Abstract: A sound damping wallboard and methods of forming a sound damping wallboard are disclosed. The sound damping wallboard comprises a gypsum layer with a gypsum surface having an encasing layer. The encasing layer is partially removed to expose the gypsum surface and form a gypsum surface portion and a first encasing layer portion on the gypsum layer. A sound damping layer is applied to the gypsum layer to cover at least part of the gypsum surface portion and the encasing layer portion.

Abstract: A heat pipe network for a satellite or spacecraft is disclosed. The network is constructed from formed and straight heat pipes securely connected together with a highly conductive material, such as Grafoil, serving as an interface gasket. The heat pipe network is interconnected to the subnadir panel and auxiliary panels, and thermally couples the North and South radiator panels. High thermal dissipating units can be mounted to heat pipes on panels attached to the main spacecraft radiator panels. The heat pipes transfer the thermal energy to the radiator panels where it is radiated to space.