Abstract: A process and assembly of a silicon-on-insulator substrate or handle incorporates a low initial viscosity epoxy adhesive having a high cross-linking density. The assembly is formed by distributing the epoxy adhesive at the interstice between a silicon wafer and the handle and heating the assembly so that the epoxy adhesive wicks by capillary action between the silicon wafer and the handle. The heating causes the epoxy adhesive to cross-link so that a strong adhesion is effectuated between the silicon and handle. The simply controllable process affords a high yield at relatively low cost.

Abstract: A process for reactive ion etching or ion milling of an air bearing slider comprises the steps of mechanical alignment of unetched slider rows with active transducer devices onto an alignment fixture; positioning a layer of thermally conductive adhesive between the rows and a substrate; heating the adhesive through the substrate such that the adhesive bonds the rows to the substrate while encapsulating the rows; removing the alignment fixture; patterning and etching the exposed planarized slider surfaces; stripping the resist and cutting the rows into individual sliders while still bonded to the substrate; stripping the adhesive with an organic solvent. This process increases tolerance to manufacturing variability, minimizes damage and contamination of the transducer devices, and decreases the cycle time and production costs.

Abstract: In an improved process for fabricating thin film head sliders from a wafer on one face of which a plurality of electromagnetic devices are arranged in rows, a single-row bar is mechanically processed to form sliders while it remains an integral part of the wafer, or after it is bonded to a fixture under a condition which induces no bow on the bar. Alternatively, a double-row bar sliced from the wafer is used for fabrication of sliders, wherein each single-row bar is mechanically processed while it remains an integral part of the double-row bar, or after it is bonded to a fixture as an integral part of a double-row bar followed by severance of the bonded double-row bar into two single-row bars. The process eliminates or materially reduces any inducement of bow of the bar, which is a serious cause of throat height control problem associated with the prior fabrication methods.

Abstract: In an improved process for fabricating thin film head sliders from a wafer on one face of which a plurality of electromagnetic devices are arranged in rows, a single-row is mechanically processed to form sliders while it remains an integral part of the wafer, or after it is bonded to a fixture under a condition which induces no bow on the bar. Alternatively, double-row bar sliced from the wafer is used for fabrication of sliders, wherein each single-row bar is mechanically processed while it remains an integral part of the double-row bar, or after it is bonded to a fixture as an integral part of a double-row bar followed by severance of the bonded double-row bar into two single-row bars. The process eliminates or materially reduces any inducement of bow of the bar, which is a serious cause of throat height control problem associated with the prior fabrication methods.