Patents by Inventor Keith R. Kessler

Keith R. Kessler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10158156
    Abstract: A microwave transmission line having a coplanar waveguide and a pair of conductive members, each one of the pair of conductive members having a proximal end disposed on a portion of a corresponding one of a pair of ground plane conductors of the coplanar waveguide and a distal end disposed over, and vertically spaced from, a region between a center conductor of the coplanar waveguide and a corresponding one of the pair of ground plane conductors of the coplanar waveguide. The distal ends are laterally separated from each other by a region disposed over the center conductor.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: December 18, 2018
    Assignee: Raytheon Company
    Inventors: Christopher M. Laighton, Edward A. Watters, Keith R. Kessler
  • Publication number: 20180131066
    Abstract: A microwave transmission line having a coplanar waveguide and a pair of conductive members, each one of the pair of conductive members having a proximal end disposed on a portion of a corresponding one of a pair of ground plane conductors of the coplanar waveguide and a distal end disposed over, and vertically spaced from, a region between a center conductor of the coplanar waveguide and a corresponding one of the pair of ground plane conductors of the coplanar waveguide. The distal ends are laterally separated from each other by a region disposed over the center conductor.
    Type: Application
    Filed: June 20, 2016
    Publication date: May 10, 2018
    Applicant: Raytheon Company
    Inventors: Christopher M. Laighton, Edward A. Watters, Keith R. Kessler
  • Patent number: 9647310
    Abstract: A microwave structure having an input section for receiving both a common mode signal and a CPW differential mode signal; an output section; and a CPW transmission line, having a center conductor disposed between a pair of coplanar ground plane conductors, connected between the input section and the output section. The conductors of the CPW transmission line are configured to provide the common mode signal a different attenuation in passing to the output section than the CPW transmission line provides to the differential mode signal passing between the input section and the output section.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: May 9, 2017
    Assignee: RAYTHEON COMPANY
    Inventors: Shahed Reza, Keith R. Kessler, Christopher M. Laighton, Michael F. Parkes
  • Publication number: 20150255847
    Abstract: A microwave structure having an input section for receiving both a common mode signal and a CPW differential mode signal; an output section; and a CPW transmission line, having a center conductor disposed between a pair of coplanar ground plane conductors, connected between the input section and the output section. The conductors of the CPW transmission line are configured to provide the common mode signal a different attenuation in passing to the output section than the CPW transmission line provides to the differential mode signal passing between the input section and the output section.
    Type: Application
    Filed: March 4, 2014
    Publication date: September 10, 2015
    Applicant: RAYTHEON COMPANY
    Inventors: Shahed Reza, Keith R. Kessler, Christopher M. Laighton
  • Patent number: 6281574
    Abstract: A method for operating a microwave amplifier wherein a packaging arrangement is provided. The packaging arrangement includes: (i) a mounting thermally conducting mounting flange; (ii) an isomorphic, thermally conductive material disposed on the flange; (iii) a circuit comprising a semiconductor chip having a transistor arranged as the amplifier, such amplifier being adapted to operate at a nominal microwave frequency with a band of frequencies, disposed on a portion of a surface of the isomorphic, thermally conductive material, other surface portions of the thermally conductive material extending laterally beyond the portion of the material having the semiconductor chip disposed thereon; (iv) a corral having an aperture through an inner region thereof, the isothermal material being disposed within the aperture, such corral having an outer region thereon mounted to surface portions of the flange. The amplifier is biased for Class C operation.
    Type: Grant
    Filed: September 27, 1999
    Date of Patent: August 28, 2001
    Assignee: Raytheon Company
    Inventors: Peter R. Drake, Keith R. Kessler