Abstract: A subminiature circuit protector includes a plurality of layers of ceramic material in a laminate structure, each layer bearing a fuse element. The ends of laminate structure are coated with electrically conductive end terminations. The fuse elements of the layers may be connected in parallel, with fuse elements on each layer connecting to both end terminations, or interconnected in series from one end termination to the other. Each of the fuse elements of the individual layers may comprise two or more individual fuse elements connected in series or in parallel. A method for manufacturing the circuit protector in accordance with the invention includes the steps of printing a multiplicity of fuse elements on a plurality of substrates, stacking the substrates to form a laminate structure, cutting the laminate into individual units, and coating the opposite ends of the units with electrically conductive material to form end terminations.