Abstract: A local area of an electronic assembly, including a single electronic component or a cluster of components mounted to a printed wiring board, is cleaned. A shroud is positioned about the local area and aqueous cleaning solution is sprayed on the lead joints of the electronic component. To remove the cleaning liquids, a vacuum is drawn from the shroud through a central baffle which is positioned close to the electronic component. Adjustable gates are provided about the base of the shroud to permit air flow into the shroud. Adjustment of the gates controls turbulence of the cleaning solution and subsequent direction of air flow for drying of the electronic component, leads and board. Shroud/baffle assemblies are selected and nozzle assemblies are tilted to correspond to different sizes of electronic components.