Patents by Inventor Keith Tan
Keith Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240106192Abstract: Disclosed herein are electronic devices that include arrays of dual function light transmit and receive pixels. The pixels of such arrays include a photodetector (PD) structure and a vertical-cavity, surface-emitting laser (VCSEL) diode, both formed in a common stack of epitaxial semiconductor layers. The pixels of the array may be configured by a controller or processor to function either as a light emitter by biasing the VCSEL diode, or as a light detector or receiver by a different bias applied to the PD structure, and this functionality may be altered in time. The array of dual function pixels may be positioned interior to an optical display of an electronic device, in some cases to provide depth sensing or autofocus. The array of pixels may be registered with a camera of an electronic device, such as to provide depth sensing or autofocus.Type: ApplicationFiled: September 23, 2022Publication date: March 28, 2024Inventors: Fei Tan, Keith Lyon, Tong Chen, Chin Han Lin, Xiaofeng Fan, Arnaud Laflaquiere
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Publication number: 20240079440Abstract: A multispectral sensing device includes a first die, including silicon, which is patterned to define a first array of sensor elements, which output first electrical signals in response to optical radiation that is incident on the device in a band of wavelengths less than 1000 nm that is incident on the front side of the first die. A second die has its first side bonded to the back side of the first die and includes a photosensitive material and is patterned to define a second array of sensor elements, which output second electrical signals in response to the optical radiation that is incident on the device in a second band of wavelengths greater than 1000 nm that passes through the first die and is incident on the first side of the second die. Readout circuitry reads the first electrical signals and the second electrical signals serially out of the device.Type: ApplicationFiled: September 6, 2022Publication date: March 7, 2024Inventors: Oray O. Cellek, Fei Tan, Gershon Rosenblum, Hong Wei Lee, Cheng-Ying Tsai, Jae Y. Park, Christophe Verove, John L Orlowski, Siddharth Joshi, Xiangli Li, David Coulon, Xiaofeng Fan, Keith Lyon, Nicolas Hotellier, Arnaud Laflaquière
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Publication number: 20240026036Abstract: The disclosure provides novel methods and dosage regimens for use in treating or preventing pain, wherein the binding molecule comprises an NGF antagonist domain and a TNF? antagonist domain, wherein the NGF antagonist domain is an anti-NGF antibody or an antigen-binding fragment thereof and wherein the TNF? antagonist domain comprises a soluble TNF? binding fragment of TNFR.Type: ApplicationFiled: September 27, 2021Publication date: January 25, 2024Inventors: FRASER WELSH, THARANI CHESSELL, KEITH TAN, THOR OSTENFELD, RICHARD JENKINS
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Publication number: 20230287092Abstract: The present invention relates to the prevention of neuronal axonal damage. More particularly, the present invention relates to the prevention neuronal axonal damage using binding members that selectively bind human amyloid beta 1-42 peptide (A?1-42), wherein the treatment of a patient with said binding member decreases the level of neurofilament light chain (NfL) in patients.Type: ApplicationFiled: June 25, 2021Publication date: September 14, 2023Inventors: Keith Tan, Craig Shering, John R. Sims, Jeffrey L. Dage
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Publication number: 20150141274Abstract: Disclosed herein are methods, compositions, and kits for isolating actively translated mRNA from heterogeneous cell populations. Also disclosed herein are methods, compositions, and kits for identifying cell types that respond to stimuli in heterogeneous cell populations.Type: ApplicationFiled: May 9, 2013Publication date: May 21, 2015Inventors: Jeffrey M. Friedman, Zachary A. Knight, Keith Tan, Kivan Birsoy
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Patent number: 7528007Abstract: A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitate securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.Type: GrantFiled: April 25, 2006Date of Patent: May 5, 2009Assignee: Micron Technology, Inc.Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: 7274095Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: GrantFiled: June 8, 2004Date of Patent: September 25, 2007Assignee: Micron Technology, Inc.Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Publication number: 20060194373Abstract: A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitation securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.Type: ApplicationFiled: April 25, 2006Publication date: August 31, 2006Inventors: Setho Fee, Lim Chye, Steven Heppler, Leng Yin, Keith Tan, Patrick Guay, Edmund Tian, Yap Eng, Eric Seng
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Publication number: 20040217459Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: ApplicationFiled: June 8, 2004Publication date: November 4, 2004Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: 6746894Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: GrantFiled: April 19, 2001Date of Patent: June 8, 2004Assignee: Micron Technology, Inc.Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Publication number: 20020142513Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: ApplicationFiled: April 19, 2001Publication date: October 3, 2002Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: D516542Type: GrantFiled: April 5, 2004Date of Patent: March 7, 2006Assignee: Koninklijke Philips Electronics N.V.Inventors: Keith Tan Chee Kang, Terence Loh Tze Kok
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Patent number: D524269Type: GrantFiled: April 5, 2004Date of Patent: July 4, 2006Assignee: Koninkijke Philips Electronics, N.V.Inventors: Keith Tan Chee Kang, Terence Loh Tze Kok
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Patent number: D531130Type: GrantFiled: December 14, 2005Date of Patent: October 31, 2006Assignee: Koninklijke Philips Electronics, N.V.Inventor: Chee Kang Keith Tan
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Patent number: D534523Type: GrantFiled: April 5, 2004Date of Patent: January 2, 2007Assignee: Koninklijke Philips Electronics N.V.Inventors: Keith Tan Chee Kang, Terence Loh Tze Kok
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Patent number: D534524Type: GrantFiled: April 5, 2004Date of Patent: January 2, 2007Assignee: Koninklijke Philips Electronics, N.V.Inventors: Keith Tan Chee Kang, Terence Loh Tze Kok
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Patent number: D536330Type: GrantFiled: December 14, 2005Date of Patent: February 6, 2007Assignee: Koninklijke Philips N.V.Inventor: Chee Kang Keith Tan
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Patent number: D549185Type: GrantFiled: August 18, 2006Date of Patent: August 21, 2007Assignee: Koninklijke Philips Electronics N.V.Inventor: Chee Kang Keith Tan
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Patent number: D549666Type: GrantFiled: April 13, 2006Date of Patent: August 28, 2007Assignee: Koninklijke Philips Electronics N.V.Inventors: Chee Kang Keith Tan, Erene Teo
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Patent number: D484474Type: GrantFiled: April 28, 2003Date of Patent: December 30, 2003Assignee: Koninklijke Philips Electronics N.V.Inventors: Pernilla Maria Cecilia Johansson, Keith Tan Chee Kang