Abstract: The invention provides a method for treating or preventing an a-synucleinopathy in a subject in need thereof, the method comprising administering to the subject a fixed dose of 50-5,000 mg of an anti-?-synuclein antibody, or antigen-binding fragment thereof. Also provided are corresponding compositions and kits.

Abstract: The disclosure provides novel methods and dosage regimens for use in treating or preventing pain, wherein the binding molecule comprises an NGF antagonist domain and a TNF? antagonist domain, wherein the NGF antagonist domain is an anti-NGF antibody or an antigen-binding fragment thereof and wherein the TNF? antagonist domain comprises a soluble TNF? binding fragment of TNFR.

Abstract: The present invention relates to the prevention of neuronal axonal damage. More particularly, the present invention relates to the prevention neuronal axonal damage using binding members that selectively bind human amyloid beta 1-42 peptide (A?1-42), wherein the treatment of a patient with said binding member decreases the level of neurofilament light chain (NfL) in patients.

Abstract: Disclosed herein are methods, compositions, and kits for isolating actively translated mRNA from heterogeneous cell populations. Also disclosed herein are methods, compositions, and kits for identifying cell types that respond to stimuli in heterogeneous cell populations.

Abstract: A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitate securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.

Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.

Abstract: A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitation securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.

Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.

Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.

Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.