Patents by Inventor Keith W. Bailey

Keith W. Bailey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor components
    Patent number: 6372526
    Abstract: A method of manufacturing semiconductor components (200, 400, 700) includes assembling, packaging, and testing the semiconductor components (200, 400, 700) while the semiconductor components (200, 400, 700) are mounted on an adhesive layer (220). The method of can also keep the semiconductor components (200, 400, 700) mounted on the adhesive layer (220) between each of the assembling, packaging, and testing steps.
    Type: Grant
    Filed: April 6, 1998
    Date of Patent: April 16, 2002
    Assignee: Semiconductor Components Industries LLC
    Inventors: Keith W. Bailey, Sury N. Darbha, Prosanto K. Mukerji, Gary R. Lorenzen
  • Electronic component and method of manufacture
    Patent number: 6147410
    Abstract: An electronic component includes a semiconductor substrate (101, 301, 401), an electrically conductive layer (102, 103, 302, 303, 402, 403) supported by the semiconductor substrate (101, 301, 401), and a lead (110, 120, 210, 310, 410, 420) having an electrical coupling portion (112, 122, 212, 312, 412, 422) coupled to and supported by the electrically conductive layer (102, 103, 302, 303, 402, 403) wherein the electrical coupling portion (112, 122, 212, 312, 412, 422) has at least one notch (115, 215, 315) adjacent to the electrically conductive layer (102, 103, 302, 303, 402, 403).
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: November 14, 2000
    Assignee: Motorola, Inc.
    Inventors: Alexander J. Elliott, Timothy E. Meko, Gary R. Lorenzen, Kent Lamar Kime, Prosanto K. Mukerji, Keith W. Bailey, William L. Fragale, Pablo Rodriguez, George C. Chen
  • Method of manufacturing a semiconductor leadframe structure
    Patent number: 5557842
    Abstract: A semiconductor leadframe structure (11,41) includes a die bond portion (12) and a plurality of leads (13) coupled to the die bond portion (12). The leadframe structure (11) comprises a metal (23) such as copper or a copper alloy. At least one lead (28,29) includes a bond post (31) that has a major surface (32) for forming a wire bond. The major surface (32) includes an exposed area (33) of leadframe metal (23) and a covered area (34) of another metal (24) deposited onto the leadframe metal (23).
    Type: Grant
    Filed: May 30, 1995
    Date of Patent: September 24, 1996
    Assignee: Motorola, Inc.
    Inventor: Keith W. Bailey
  • Semiconductor leadframe structure compatible with differing bond wire materials
    Patent number: 5530284
    Abstract: A semiconductor leadframe structure (11,41) includes a die bond portion (12) and a plurality of leads (13) coupled to the die bond portion (12). The leadframe structure (11) comprises a metal (23) such as copper or a copper alloy. At least one lead (28,29) includes a bond post (31) that has a major surface (32) for forming a wire bond. The major surface (32) includes an exposed area (33) of leadframe metal (23) and a covered area (34) of another metal (24) deposited onto the leadframe metal (23).
    Type: Grant
    Filed: March 6, 1995
    Date of Patent: June 25, 1996
    Assignee: Motorola, Inc.
    Inventor: Keith W. Bailey