Patents by Inventor Keith W. Gurnett

Keith W. Gurnett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4595096
    Abstract: An integrated circuit chip carrier is made of plastics material, such as glass/epoxy printed circuit board material, and comprises a base and a side wall attached to the top surface of the base to define a chip mounting cavity. Conductor tracks on the base extend from connecting pads inside the cavity to connecting points on the periphery of the carrier. The chip carrier can be fabricated as one of an array of such carriers for subsequent separation.
    Type: Grant
    Filed: December 20, 1983
    Date of Patent: June 17, 1986
    Assignee: British Telecommunications
    Inventors: F. Nihal Sinnadurai, Anthony J. Cook, Keith W. Gurnett
  • Patent number: 4448306
    Abstract: An integrated circuit chip carrier is made of plastics material, such as glass/epoxy printed circuit board material, and comprises a base and a side wall attached to the top surface of the base to define a chip mounting cavity. Conductor tracks on the base extend from connecting pads inside the cavity to connecting points on the periphery of the carrier. The chip carrier can be fabricated as one of an array of such carriers for subsequent separation.
    Type: Grant
    Filed: January 25, 1982
    Date of Patent: May 15, 1984
    Assignee: British Telecommunications
    Inventors: F. Nihal Sinnadurai, Anthony J. Cook, Keith W. Gurnett