Patents by Inventor Keith WANG

Keith WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device comprising thermally conductive connector
    Patent number: 11733749
    Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion, and a uni-directional thermally conductive connector coupled to the first device portion and the second device portion. The first device portion comprises a region that includes a component configured to generate heat. The uni-directional thermally conductive connector is configured to dissipate heat away from the first device portion and towards the second device portion. The uni-directional thermally conductive connector includes a thermally conductive material that primarily dissipates heat along a first direction of the thermally conductive material.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: August 22, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Hung-Wen Lin, Sin-Shong Wang, Keith Wang, Ajit Kumar Vallabhaneni, Jen-Chun Chang
  • Integrated device coupled to a step heat sink configured to provide shielding
    Patent number: 11637051
    Abstract: An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: April 25, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Hung-Wen Lin, Sin-Shong Wang, Jen-Chun Chang, Ajit Kumar Vallabhaneni, Keith Wang
  • ELECTRONIC DEVICE COMPRISING THERMALLY CONDUCTIVE CONNECTOR
    Publication number: 20210373628
    Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion, and a uni-directional thermally conductive connector coupled to the first device portion and the second device portion. The first device portion comprises a region that includes a component configured to generate heat. The uni-directional thermally conductive connector is configured to dissipate heat away from the first device portion and towards the second device portion. The uni-directional thermally conductive connector includes a thermally conductive material that primarily dissipates heat along a first direction of the thermally conductive material.
    Type: Application
    Filed: November 10, 2020
    Publication date: December 2, 2021
    Inventors: Hung-Wen LIN, Sin-Shong WANG, Keith WANG, Ajit Kumar VALLABHANENI, Jen-Chun CHANG
  • INTEGRATED DEVICE COUPLED TO A STEP HEAT SINK CONFIGURED TO PROVIDE SHIELDING
    Publication number: 20210118764
    Abstract: An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 22, 2021
    Inventors: Hung-Wen LIN, Sin-Shong WANG, Jen-Chun CHANG, Ajit Kumar VALLABHANENI, Keith WANG