Abstract: Implementations disclosed describe, among other things, a sample inspection system that includes an illumination subsystem to illuminate a sample with a plurality of time-spaced light pulses generated, using a pulse multiplexing system, from a source light pulse. The pulse multiplexing system includes a plurality of optical loops, each deploying an optical coupler that outputs a first portion of incident light to a sample and provides a second portion of incident light as an input into the next optical loop. The sample inspection system further includes a collection subsystem to collect a portion of light generated upon interaction of the plurality of time-spaced light pulses with the sample, and a light detection subsystem to detect the collected portion of light.

Abstract: A substrate processing system includes a processing chamber, a substrate support, a laser, and a collimating assembly. The substrate support is disposed in the processing chamber and is configured to support a substrate. The laser is configured to generate a laser beam. The collimating assembly includes lenses or mirrors arranged to direct the laser beam at the substrate to heat an exposed material of the substrate. The lenses or mirrors are configured to direct the laser beam in a direction within a predetermined range of being perpendicular to a surface of the substrate.

Abstract: Implementations disclosed describe, among other things, a sample inspection system that includes an illumination subsystem to illuminate a sample with a plurality of time-spaced light pulses generated, using a pulse multiplexing system, from a source light pulse. The pulse multiplexing system includes a plurality of optical loops, each deploying an optical coupler that outputs a first portion of incident light to a sample and provides a second portion of incident light as an input into the next optical loop. The sample inspection system further includes a collection subsystem to collect a portion of light generated upon interaction of the plurality of time-spaced light pulses with the sample, and a light detection subsystem to detect the collected portion of light.

Abstract: Implementations disclosed describe, among other things, a system and a method of using a wafer inspection system that includes a plurality of inspection heads configured to concurrently inspect a separate region of a plurality of regions of a wafer. Each inspection head includes an illumination subsystem to illuminate a corresponding region of the wafer, a collection subsystem to collect a portion of light reflected/scattered from the corresponding region of the wafer. Each inspection head further includes a light detection subsystem to detect the collected light and generate one or more signals representative of a state of the corresponding region of the wafer. The wafer inspection system further includes a processing device configured to determine, using the one or more signals received from each of the inspection heads, the quality of the wafer.

Abstract: A substrate processing system includes a processing chamber, a substrate support, a laser, and a collimating assembly. The substrate support is disposed in the processing chamber and is configured to support a substrate. The laser is configured to generate a laser beam. The collimating assembly includes lenses or mirrors arranged to direct the laser beam at the substrate to heat an exposed material of the substrate. The lenses or mirrors are configured to direct the laser beam in a direction within a predetermined range of being perpendicular to a surface of the substrate.

Abstract: Defects on a substrate comprising electronic components can be classified with a computational defect analysis system that may be implemented in multiple stages. For example, a first stage classification engine may process metrology data to produce an initial classification of defects. A second stage classification engine may use the initial classification, along with manufacturing information and/or prior defect knowledge to output probabilities that the defects are caused by one or more potential sources.

Abstract: Defects on a substrate comprising electronic components can be classified with a computational defect analysis system that may be implemented in multiple stages. For example, a first stage classification engine may process metrology data to produce an initial classification of defects. A second stage classification engine may use the initial classification, along with manufacturing information and/or prior defect knowledge to output probabilities that the defects are caused by one or more potential sources.

Abstract: A substrate processing system includes a processing chamber, a substrate support, a laser, and a collimating assembly. The substrate support is disposed in the processing chamber and is configured to support a substrate. The laser is configured to generate a laser beam. The collimating assembly includes lenses or minors arranged to direct the laser beam at the substrate to heat an exposed material of the substrate. The lenses or mirrors are configured to direct the laser beam in a direction within a predetermined range of being perpendicular to a surface of the substrate.

Abstract: Defects on a substrate comprising electronic components can be classified with a computational defect analysis system that may be implemented in multiple stages. For example, a first stage classification engine may process metrology data to produce an initial classification of defects. A second stage classification engine may use the initial classification, along with manufacturing information and/or prior defect knowledge to output probabilities that the defects are caused by one or more potential sources.

Abstract: Methods and systems for generating a high resolution image for a specimen from one or more low resolution images of the specimen are provided. One system includes one or more computer subsystems configured for acquiring one or more low resolution images of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a model that includes one or more first layers configured for generating a representation of the one or more low resolution images. The model also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the one or more low resolution images.

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

Abstract: Hybrid inspectors are provided. One system includes computer subsystem(s) configured for receiving optical based output and electron beam based output generated for a specimen. The computer subsystem(s) include one or more virtual systems configured for performing one or more functions using at least some of the optical based output and the electron beam based output generated for the specimen. The system also includes one or more components executed by the computer subsystem(s), which include one or more models configured for performing one or more simulations for the specimen. The computer subsystem(s) are configured for detecting defects on the specimen based on at least two of the optical based output, the electron beam based output, results of the one or more functions, and results of the one or more simulations.

Abstract: A system for recycling energy within an assembly line includes a mobile power generator attached to a conveyer platform (a.k.a. a “skillet”) or other conveyance within the assembly line. The mobile power generator has a drive wheel that contacts an adjacent surface, such as a floor, and is rotated by movement of the conveyance along or past the surface. Rotation of the drive wheel is transmitted to a low RPM electrical generator to produce electrical energy at the conveyance.

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

Abstract: Hybrid inspectors are provided. One system includes computer subsystems) configured for receiving optical based output and electron beam based output generated for a specimen. The computer subsystem(s) include one or more virtual systems configured for performing one or more functions using at least some of the optical based output and the electron beam based output generated for the specimen. The system also includes one or more components executed by the computer subsystem(s), which include one or more models configured for performing one or more simulations for the specimen. The computer subsystem(s) are configured for detecting defects on the specimen based on at least two of the optical based output, the electron beam based output, results of the one or more functions, and results of the one or more simulations.

Abstract: Methods and systems for generating a high resolution image for a specimen from one or more low resolution images of the specimen are provided. One system includes one or more computer subsystems configured for acquiring one or more low resolution images of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a model that includes one or more first layers configured for generating a representation of the one or more low resolution images. The model also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the one or more low resolution images.

Abstract: A system for recycling energy within an assembly line includes a mobile power generator attached to a conveyer platform (a.k.a. a “skillet”) or other conveyance within the assembly line. The mobile power generator has a drive wheel that contacts an adjacent surface, such as a floor, and is rotated by movement of the conveyance along or past the surface. Rotation of the drive wheel is transmitted to a low RPM electrical generator to produce electrical energy at the conveyance.

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

Abstract: A catheter assembly configured for use in a non-bronchoscopic bronchoalveolar lavage procedure. The catheter assembly may include an inner catheter member having an inner catheter lumen and an outer catheter member having an outer catheter lumen, where the inner catheter member is disposed longitudinally and coaxially through at least a lengthwise portion of the outer catheter lumen, a distal end portion of the outer catheter includes an atraumatically-shaped disruptable seal—which seal includes at least a pair of overlapping slits that extend at least partially through an internal distal end wall portion of the outer catheter—and where a distal end portion of the inner catheter includes a wedging structure configured to at least partially sealingly contact an inner circumference of a passage in a lower portion of a patient lung.