Patents by Inventor Keith Whitlaw

Keith Whitlaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Alloy composition and plating method
    Publication number: 20060065538
    Abstract: Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of lead on substrates and uses for such plated substrates.
    Type: Application
    Filed: November 2, 2005
    Publication date: March 30, 2006
    Applicant: Shipley Company, L.L.C.
    Inventors: Robert Schetty, Michael Toben, James Martin, Neil Brown, Jeffrey Crosby, Keith Whitlaw