Patents by Inventor Keith Willis

Keith Willis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070120935
    Abstract: A media path crossover for a printing system includes a first crossover pathway on which sheets of print media are conveyed across a crossover junction without interruption and a second crossover pathway on which sheets of print media are conveyed across the crossover junction without interruption. The second crossover pathway intersects the first crossover pathway at a crossover junction. The first crossover pathway comprises a first input path and a first output path and the second crossover pathway comprises a second input path and a second output path. At least the first input path includes a first access panel, whereby a sheet can be cleared therefrom while continuing conveyance of media along the second crossover pathway.
    Type: Application
    Filed: November 30, 2005
    Publication date: May 31, 2007
    Inventor: Keith Willis
  • Publication number: 20060226593
    Abstract: A feeder tray having movable front section to allow for loading of stock without having to load over the front section of the tray.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 12, 2006
    Inventors: Keith Willis, Tom Keyes
  • Publication number: 20060216054
    Abstract: A user interface is provided for a printer having a finishing device having a maximum physical sheet capacity and being operable at an operational sheet capacity equal to or less than the maximum physical sheet capacity, a marking device which applies marks to sheets of media supplied thereto and outputs the same to the finishing device which receives the sheets from the marking device. The user interface comprises a display and an input device. The display communicates to an operator of the printer a selectable operational capacity of the finishing device whereby the operator may select a selectable operational capacity, a selectable option to override the selectable operational capacity and a prompt to override the operational capacity. The input device permits the operator of the printer to indicate selections.
    Type: Application
    Filed: March 24, 2005
    Publication date: September 28, 2006
    Inventor: Keith Willis
  • Patent number: 7087996
    Abstract: The invention relates to a ball-limiting metallurgy (BLM) etching system and process. The BLM stack is provided for an electrical device that contains an aluminum layer disposed upon a metal first layer. A metal upper layer is disposed above the metal second layer, and an alternative metal third layer is disposed between the metal second layer and the metal upper layer. The etching system and process utilizes an etching solution that includes a nitrogen-containing heterocyclic compound, an ammonium hydroxide compound, an oxidizer, and a metal halide compound. Etching conditions prevent any metallization that is dissolved from redepositing, thus avoiding lowered yields.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: August 8, 2006
    Assignee: Intel Corporation
    Inventors: Donald Danielson, Tzeun-luh Huang, Dawn L. Scovell, Keith Willis
  • Publication number: 20050062222
    Abstract: In a printing apparatus or copier, a vertical portion of a paper path is formed between two flat members. To remove jammed paper from the path, one of the flat members is moved, by a hinge, from the other, releasing any sheet in the path. Released sheets drop down the path and land on a bottom structure. The bottom structure causes a sheet landing thereon to incline away from the hinge, so that a user can remove the sheet without having to reach far into the path.
    Type: Application
    Filed: September 24, 2003
    Publication date: March 24, 2005
    Inventor: Keith Willis
  • Publication number: 20040224518
    Abstract: The invention relates to a ball-limiting metallurgy (BLM) etching system and process. The BLM stack is provided for an electrical device that contains an aluminum layer disposed upon a metal first layer. A metal upper layer is disposed above the metal second layer, and an alternative metal third layer is disposed between the metal second layer and the metal upper layer. The etching system and process utilizes an etching solution that includes a nitrogen-containing heterocyclic compound, an ammonium hydroxide compound, an oxidizer, and a metal halide compound. Etching conditions prevent any metallization that is dissolved from redepositing, thus avoiding lowered yields.
    Type: Application
    Filed: June 14, 2004
    Publication date: November 11, 2004
    Inventors: Donald Danielson, Tzeun-luh Huang, Dawn L. Scovell, Keith Willis
  • Patent number: 6749760
    Abstract: The invention relates to a ball-limiting metallurgy (BLM) etching system and process. The BLM stack is provided for an electrical device that contains an aluminum layer disposed upon a metal first layer. A metal upper layer is disposed above the metal second layer, and an alternative metal third layer is disposed between the metal second layer and the metal upper layer. The etching system and process utilizes an etching solution that includes a nitrogen-containing heterocyclic compound, an ammonium hydroxide compound, an oxidizer, and a metal halide compound. Etching conditions prevent any metallization that is dissolved from redepositing, thus avoiding lowered yields.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: June 15, 2004
    Assignee: Intel Corporation
    Inventors: Donald Danielson, Tzeun-luh Huang, Dawn L. Scovell, Keith Willis
  • Publication number: 20030082913
    Abstract: The invention relates to a ball-limiting metallurgy (BLM) etching system and process. The BLM stack is provided for an electrical device that contains an aluminum layer disposed upon a metal first layer. A metal upper layer is disposed above the metal second layer, and an alternative metal third layer is disposed between the metal second layer and the metal upper layer. The etching system and process utilizes an etching solution that includes a nitrogen-containing heterocyclic compound, an ammonium hydroxide compound, an oxidizer, and a metal halide compound. Etching conditions prevent any metallization that is dissolved from redepositing, thus avoiding lowered yields.
    Type: Application
    Filed: October 26, 2001
    Publication date: May 1, 2003
    Applicant: Intel Corporation
    Inventors: Donald Danielson, Tzeun-Iuh Huang, Dawn L. Scovell, Keith Willis