Patents by Inventor Keith Wong Bing Chiang

Keith Wong Bing Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Individual selective rework of defective BGA solder balls
    Patent number: 6911388
    Abstract: A method for reworking a ball grid array (BGA) of solder balls is provided including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: June 28, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Kwan Yew Kee, Chew Boon Ngee, Keith Wong Bing Chiang
  • Individual selective rework of defective BGA solder balls
    Publication number: 20040056078
    Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.
    Type: Application
    Filed: September 11, 2003
    Publication date: March 25, 2004
    Inventors: Kwan Yew Kee, Chew Boon Ngee, Keith Wong Bing Chiang
  • Individual selective rework of defective BGA solder balls
    Patent number: 6685080
    Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: February 3, 2004
    Assignee: Micron Technolgy, Inc.
    Inventors: Kwan Yew Kee, Chew Boon Ngee, Keith Wong Bing Chiang