Patents by Inventor Keith Ypma

Keith Ypma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND APPARATUS FOR REMOVING ABRASIVE PARTICLES
    Publication number: 20200306931
    Abstract: Methods and apparatus for removing particles from a substrate surface after a chemical mechanical polish. In some embodiments, the apparatus may include a manifold configured to receive and atomize a fluid and at least one spray nozzle mounted to the manifold and configured to spray the atomized fluid in a divergent spray pattern such that the substrate surface is cleansed when impinged by spray from the at least one spray nozzle, wherein the at least one spray nozzle sprays the atomized fluid at a pressure of approximately 30 psi to approximately 2500 psi.
    Type: Application
    Filed: March 25, 2019
    Publication date: October 1, 2020
    Inventors: PRAYUDI LIANTO, PENG SUO, SHIH-CHAO HUNG, PIN GIAN GAN, CHUN YU TO, PERIYA GOPALAN, KOK SEONG TEO, LIT PING LAM, ANDY LOO, PANGYEN ONG, DAVID P. SURDOCK, KEITH YPMA, BRIAN WILLIAMS, SCOTT OSTERMAN, MARVIN L. BERNT, MUHAMMAD NORHAZWAN, SAMUEL GOPINATH, MUHAMMAD AZIM, GUAN HUEI SEE, QI JIE PENG, SRISKANTHARAJAH THIRUNAVUKARASU, ARVIND SUNDARRAJAN
  • Semiconductor devices and methods for backside photo alignment
    Patent number: 9741612
    Abstract: Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for aligning an electronic feature to a through-substrate via includes forming a self-aligned alignment feature having a wall around at least a portion of the TSV and aligning a photolithography tool to the self-aligned alignment feature. In some embodiments, the self-aligned alignment feature is defined by the topography of a seed material at a backside of the device.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: August 22, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Brandon P. Wirz, Keith Ypma, Christopher J. Gambee, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva, Yang Chao, Jon Hacker
  • SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT
    Publication number: 20160172242
    Abstract: Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for aligning an electronic feature to a through-substrate via includes forming a self-aligned alignment feature having a wall around at least a portion of the TSV and aligning a photolithography tool to the self-aligned alignment feature. In some embodiments, the self-aligned alignment feature is defined by the topography of a seed material at a backside of the device.
    Type: Application
    Filed: February 23, 2016
    Publication date: June 16, 2016
    Inventors: Brandon P. Wirz, Keith Ypma, Christopher J. Gambee, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva, Yang Chao, Jon Hacker
  • Semiconductor devices and methods for backside photo alignment
    Patent number: 9299663
    Abstract: Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for aligning an electronic feature to a through-substrate via includes forming a self-aligned alignment feature having a wall around at least a portion of the TSV and aligning a photolithography tool to the self-aligned alignment feature. In some embodiments, the self-aligned alignment feature is defined by the topography of a seed material at a backside of the device.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: March 29, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Brandon P. Wirz, Keith Ypma, Christopher J. Gambee, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva, Yang Chao, Jon Hacker
  • SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT
    Publication number: 20150333014
    Abstract: Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for aligning an electronic feature to a through-substrate via includes forming a self-aligned alignment feature having a wall around at least a portion of the TSV and aligning a photolithography tool to the self-aligned alignment feature. In some embodiments, the self-aligned alignment feature is defined by the topography of a seed material at a backside of the device.
    Type: Application
    Filed: May 19, 2014
    Publication date: November 19, 2015
    Applicant: Micron Technology, Inc.
    Inventors: Brandon P. Wirz, Keith Ypma, Christopher J. Gambee, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva, Yang Chao, Jon Hacker