Patents by Inventor Keiun Ko

Keiun Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition containing polyphenylene oxide
    Patent number: 4228258
    Abstract: A novel resin composition improved in moldability and impact resistance, comprising (A) a polyphenylene oxide having a molecular weight of 5,000 or higher, (B) an aromatic hydrocarbon-formaldehyde resin or a modified aromatic hydrocarbon-formaldehyde resin, and, if necessary, (C) a rubbery polymer, the weight ratio of the resin (A) to the resin (B) being from 10:90 to 99:1 and the amount of the rubbery polymer (C) being 3 to 40 parts by weight per 100 parts by weight of the sum of the resins (A) and (B). This resin composition has excellent mechanical and electrical properties of the polyphenylene oxide together with an improved moldability, impact resistance, and adhesiveness.
    Type: Grant
    Filed: January 29, 1979
    Date of Patent: October 14, 1980
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Akitoshi Sugio, Masanobu Masu, Masaharu Kimura, Norio Sayama, Keiun Ko, Eiichi Yonemitsu
  • Resin composition containing polyphenylene oxide
    Patent number: 4153644
    Abstract: A novel resin composition improved in moldability and impact resistance, comprising (A) a polyphenylene oxide having a molecular weight of 5,000 or higher, (B) an aromatic hydrocarbon-formaldehyde resin or a modified aromatic hydrocarbon-formaldehyde resin, and, if necessary, (C) a rubbery polymer, the weight ratio of the resin (A) to the resin (B) being from 10:90 to 99:1 and the amount of the rubbery polymer (C) being 3 to 40 parts by weight per 100 parts by weight of the sum of the resins (A) and (B). This resin composition has excellent mechanical and electrical properties of the polyphenylene oxide together with an improved moldability, impact resistance, and adhesiveness.
    Type: Grant
    Filed: December 15, 1975
    Date of Patent: May 8, 1979
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Akitoshi Sugio, Masanobu Masu, Masaharu Kimura, Norio Sayama, Keiun Ko, Eiichi Yonemitsu
  • One package system cold-setting coating compositions
    Patent number: 4058497
    Abstract: This invention relates to a one package system cold-setting type coating composition which comprises an acrylic copolymer having carboxyl groups in its molecule or an alkyd resin, an aluminum alkoxide complex and a keto-enol tautomeric compound, characterized by adding a specific nitrogen compound to the composition for preventing discoloration of a coated substance.
    Type: Grant
    Filed: September 2, 1975
    Date of Patent: November 15, 1977
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Keiun Ko, Naomitsu Takashina, Senzo Shimizu, Masuya Ikegami, Yoshinori Iwamoto
  • In-air curable resin compositions
    Patent number: 4049634
    Abstract: A resin composition curable in air comprising (A) an unsaturated oligomer having a number average molecular weight of 500 to 4,000 and containing at least two acryloyl and/or methacryloyl groups at the ends of the molecule and at least one ethylenic internal double bond in the oligomer chain and (B) an oligomer having a number average molecular weight of 500 to 4,000 which contains at least two acryloyl and/or methacryloyl groups at the ends of the molecule and at least one pendant allyloxy groups in the oligomer chain with an allyloxy equivalent of not more than 500, and is free from an ethylenic internal double bond in the oligomer chain. The composition is especially useful as a solventless coating agent.
    Type: Grant
    Filed: July 25, 1975
    Date of Patent: September 20, 1977
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Keiun Ko, Naomitsu Takashina, Shigeru Shiokawa, Rokuro Fujita