Patents by Inventor Keizi Hanzawa

Keizi Hanzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5676851
    Abstract: A capacitance acceleration sensor and method of making same are disclosed. A capacitance acceleration sensor includes a movable electrode etched from a silicon plate which is clamped between two solid dielectric plate members of glass, silicon oxides, or oxygen oxides. Static electrodes are secured to surfaces of the dielectric members facing opposite the movable electrode, thereby providing easy manufacturing assessibility for leadout wires from these electrodes. In certain embodiments, the movable electrode is formed integrally with a monocrystalline silicon plate member which also contains an integrated circuit for generating an output acceleration signal in response to movement of the movable electrode when the assembly experiences acceleration forces.
    Type: Grant
    Filed: September 23, 1996
    Date of Patent: October 14, 1997
    Assignees: Hitachi Ltd., Hitachi Automotive Engineering Co., Ltd.
    Inventors: Masayoshi Suzuki, Takao Sasayama, Keizi Hanzawa, Norio Ichikawa, Junichi Horie, Yukiko Sugisawa, Yuuji Ogasawara
  • Patent number: 5616844
    Abstract: A capacitance acceleration sensor includes a movable electrode etched from a silicon plate which is clamped between two solid dielectric plate members of glass, silicon oxides, or oxygen oxides. Static electrodes are secured to surfaces of the dielectric members facing opposite the movable electrode, thereby providing easy manufacturing assessibility for leadout wires from these electrodes. In certain embodiments, the movable electrode is formed integrally with a monocrystalline silicon plate member which also contains an integrated circuit for generating an output acceleration signal in response to movement of the movable electrode when the assembly experiences acceleration forces.
    Type: Grant
    Filed: December 27, 1994
    Date of Patent: April 1, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Masayoshi Suzuki, Takao Sasayama, Keizi Hanzawa, Norio Ichikawa, Junichi Horie, Yukiko Sugisawa, Yuuji Ogasawara