Patents by Inventor Keizo Hokazono

Keizo Hokazono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5619794
    Abstract: A complex structure molding process for molding a complex structure including a plastic base and a plurality of terminal pins, comprising the steps of molding the plastic base to have the terminal pins partly embedded in the plastic base, storing a continuous metal material having a rim portion and a plurality of terminal pins perpendicularly extending from the rim portion, cutting the continuous metal material in a first direction parallel to the direction in which the terminal pins extend from the rim portion to form a segmented metal material, and setting the segmented metal material in the molding means in the state having the segmented metal material assume their predetermined attitudes. The continuous metal material is fed in a second direction perpendicular to the first direction to cut the continuous metal material and to set the segmented metal material for molding the plastic base to have the terminal pins partly embedded in the plastic base.
    Type: Grant
    Filed: March 17, 1995
    Date of Patent: April 15, 1997
    Assignee: Teijin Seiki Co., Ltd.
    Inventor: Keizo Hokazono