Abstract: The present invention relates to a point source light-emitting diode containing a support substrate, a metal layer, a first conduction-type layer, an active layer, a second conduction-type layer containing a current-narrowing structure, and a topside electrode having an aperture, stacking in this order, in which the metal layer is provided locally in an area corresponding to the aperture and has a metal reflection face by which a light generated in the active layer is reflected towards the aperture side, and the point source light-emitting diode further contains a light-reflection reduction face having a lower reflectivity and/or a higher absorptivity than the metal reflection face, provided around the metal reflection face.

Abstract: The present invention relates to a point source light-emitting diode containing a support substrate, a metal layer, a first conduction-type layer, an active layer, a second conduction-type layer containing a current-narrowing structure, and a topside electrode having an aperture, stacking in this order, in which the metal layer is provided locally in an area corresponding to the aperture and has a metal reflection face by which a light generated in the active layer is reflected towards the aperture side, and the point source light-emitting diode further contains a light-reflection reduction face having a lower reflectivity and/or a higher absorptivity than the metal reflection face, provided around the metal reflection face.

Abstract: Radiation occurs when current is injected into an active layer from electrodes. A pair of clad layers is disposed sandwiching the active layer, the clad layer having a band gap wider than a band gap of the active layer. An optical absorption layer is disposed outside at least one clad layer of the pair of clad layers. The optical absorption layer has a band gap wider than the band gap of the active layer and narrower than the band gap of the clad layer. A spread of a spectrum of radiated light can be narrowed.

Abstract: The principal surface of a substrate made of a group III-V compound semiconductor material is about a (100) plane. A light emitting lamination structure is disposed on the principal surface. In the light emitting lamination structure, a quantum well layer is sandwiched by a pair of carrier confinement layers made of a semiconductor material having a band gap wider than a semiconductor material of the quantum well layer. The pair of carrier confinement layers are sandwiched by a pair of clad layers made of a semiconductor material having a band gap wider than the band gap of the semiconductor material of the carrier confinement layers. Thicknesses of the quantum well layer and the carrier confinement layers, as well as compositions of the semiconductor materials thereof, are set such that light emission recombination of electrons and holes occurs in the quantum well layer and not in the carrier confinement layers.

Abstract: A luminescence structure is formed on a substrate made of semiconductor or insulator. The luminescence structure has a lamination structure that an active layer made of semiconductor is sandwiched between a pair of clad layers made of semiconductor. The clad layer is made of the semiconductor having a band gap wider than an energy corresponding to a peak wavelength of an EL spectrum of the active layer. A carrier trap layer is disposed between the substrate and luminescence structure. A peak wavelength of an EL spectrum of the carrier trap layer is longer than a wavelength corresponding to a band gap of the substrate and the peak wavelength of the EL spectrum of the active layer. Electrodes are formed to inject current into the active layer.

Abstract: Radiation occurs when current is injected into an active layer from electrodes. A pair of clad layers is disposed sandwiching the active layer, the clad layer having a band gap wider than a band gap of the active layer. An optical absorption layer is disposed outside at least one clad layer of the pair of clad layers. The optical absorption layer has a band gap wider than the band gap of the active layer and narrower than the band gap of the clad layer. A spread of a spectrum of radiated light can be narrowed.

Abstract: The principal surface of a substrate made of a group III-V compound semiconductor material is about a (100) plane. A light emitting lamination structure is disposed on the principal surface. In the light emitting lamination structure, a quantum well layer is sandwiched by a pair of carrier confinement layers made of a semiconductor material having a band gap wider than a semiconductor material of the quantum well layer. The pair of carrier confinement layers are sandwiched by a pair of clad layers made of a semiconductor material having a band gap wider than the band gap of the semiconductor material of the carrier confinement layers. Thicknesses of the quantum well layer and the carrier confinement layers, as well as compositions of the semiconductor materials thereof, are set such that light emission recombination of electrons and holes occurs in the quantum well layer and not in the carrier confinement layers.

Abstract: The principal surface of a substrate made of group III-V compound semiconductor is about (100) plane. A light emitting lamination structure is disposed on the principal surface. The light emitting lamination structure includes a quantum well layer made of group III-V mixed crystal semiconductor containing In, a pair of carrier confinement layers made of semiconductor material having a band gap wider than the quantum well layer and sandwiching the quantum well layer, and a pair of clad layers made of semiconductor material having a band gap wider than the carrier confinement layers and sandwiching the quantum well layer and the carrier confinement layers. A difference of 100 meV or larger exists between an energy level of the carrier confinement layers at a conduction band lower end and a ground level of an electron in the quantum well layer.

Abstract: The principal surface of a substrate made of group III-V compound semiconductor is about (100) plane. A light emitting lamination structure is disposed on the principal surface. The light emitting lamination structure includes a quantum well layer made of group III-V mixed crystal semiconductor containing In, a pair of carrier confinement layers made of semiconductor material having a band gap wider than the quantum well layer and sandwiching the quantum well layer, and a pair of clad layers made of semiconductor material having a band gap wider than the carrier confinement layers and sandwiching the quantum well layer and the carrier confinement layers. A difference of 100 meV or larger exists between an energy level of the carrier confinement layers at a conduction band lower end and a ground level of an electron in the quantum well layer.

Abstract: A substitute-heart control apparatus for controlling a substitute heart provided in a living body, including an information obtaining device which non-invasively obtains, from the living body, physical information relating to blood circulation in the living body, and a control device which supplies, to the substitute heart, a control signal to control a cardiac output that is a volume of blood outputted from the substitute heart per unit time, based on the physical information obtained by the information obtaining device, according to a predetermined relationship between cardiac output and physical information.

Abstract: Known MBE methods of heat-treating semiconductor crystal of a group II-group VI compound for crystal growth are accompanied by a problem of releasing the component elements during the heat-treatment to produce a coarse crystal surface that adversely affects the subsequent crystal growth steps. According to the invention, this problem is eliminated by irradiating a substrate of a group II-group VI compound, specifically ZnSe, with Zn beams and Se beams depending on the vapor pressures of the elements between the respective starting points and the respective terminating points to compensate the released Zn and Se so that consequently no oxide film is formed on the ZnSe substrate when the heat-treatment is completed to produce a plane crystal surface that is free from coarseness.

Abstract: A tip member for a coating tool in the form of a stick, wherein the stick is formed of a bundle of resin-treated fibers substantially uniformly stretched in the longitudinal direction of the fibers. One end of the stick is tapered to the tip with the fibers being unraveled to unbind the fibers in that area. One or more longitudinal grooves may be formed in the surface of the stick.

Abstract: A marking ink for use in marking pens is described, comprising 5 to 40% by weight of titanium dioxide surface treated with an alkaline earth metal or aluminum salt of a fatty acid having from 6 to 22 carbon atoms, 3 to 20% by weight of a resin, and a remainder of an organic solvent capable of dissolving therein the resin. The marking ink may further contain 0.5 to 30% by weight of a colorant. In this marking ink, precipitation and separation of titanium dioxide is controlled, and even if such precipitation and separation occur, titanium dioxide can be easily re-dispersed in the ink.