Patents by Inventor Keizo Masawaki

Keizo Masawaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6756413
    Abstract: The present invention relates to an O/W type aqueous dispersion which comprises mixing a radical polymerization type thermosetting resin and water together to uniformly disperse particles of the resin in the aqueous phase; the aqueous dispersion is stable and thixotropic and has excellent workability; moreover, as with a normal radical polymerization type thermosetting resin, the aqueous dispersion can be cured at ambient temperature or with heating in the presence of a curing agent and if necessary an accelerator, and the cured material obtained is a porous cured material having fine particles bound together and fine interconnected pores between the bound particles.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: June 29, 2004
    Assignee: Japan U-PICA Company, Ltd.
    Inventor: Keizo Masawaki
  • Publication number: 20030114622
    Abstract: The present invention relates to a method of manufacturing a cured resin fine powder having spherical particles of particle diameter 10 &mgr;m or less, by curing at ambient temperature or with heating, in the presence of a curing agent and if necessary an accelerator, an O/W type aqueous thermosetting resin dispersion that has been obtained by uniformly dispersing a liquid radical polymerization type thermosetting resin in an aqueous phase, and then removing water, washing if desired, and drying.
    Type: Application
    Filed: October 1, 2002
    Publication date: June 19, 2003
    Inventor: Keizo Masawaki
  • Publication number: 20030022954
    Abstract: The present invention relates to an O/W type aqueous dispersion which comprises mixing a radical polymerization type thermosetting resin and water together to uniformly disperse particles of the resin in the aqueous phase; the aqueous dispersion is stable and thixotropic and has excellent workability; moreover, as with a normal radical polymerization type thermosetting resin, the aqueous dispersion can be cured at ambient temperature or with heating in the presence of a curing agent and if necessary an accelerator, and the cured material obtained is a porous cured material having fine particles bound together and fine interconnected pores between the bound particles.
    Type: Application
    Filed: August 8, 2002
    Publication date: January 30, 2003
    Inventor: Keizo Masawaki