Patents by Inventor Keizo Matsukawa

Keizo Matsukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of aligning and bonding tab inner leads
    Patent number: 5059559
    Abstract: The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.
    Type: Grant
    Filed: November 1, 1988
    Date of Patent: October 22, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Michio Takahashi, Tooru Mita, Yasuo Nakagawa, Toshimitsu Hamada, Hisafumi Iwata, Aizo Kaneda, Kouji Serizawa, Hiroyuki Tanaka, Koichi Sugimoto, Toshihiko Sakai, Keizo Matsukawa, Tsutomu Mimata