Patents by Inventor Keizo Nakajima
Keizo Nakajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130277359Abstract: A PTC resistor according to the present invention comprises at least one PTC composition which comprises at least one resin and at least two conductive materials. The at least two conductive materials comprises at least two conductive materials different from each other. The at least one PTC composition may comprise a first PTC composition which comprises a first resin and at least one first conductive material and a second PTC composition which is compounded with the first PTC composition and comprises a second resin and at least one second conductive material. The at least one first conductive material is at least partially different from the at least one second conductive material. One of the first resin and the second resin may comprise a reactant resin and a reactive resin which is cross-linked with the reactant resin. The PTC resistor may comprise a flame retardant agent. The PTC resistor may comprise a liquid-resistant resin.Type: ApplicationFiled: June 12, 2013Publication date: October 24, 2013Inventors: Hirosi FUKUDA, Katsuhiko UNO, Takahito ISHII, Keizo NAKAJIMA, Akihiro UMEDA
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Patent number: 8519305Abstract: A polymer heating element includes an electrically insulating base substrate, at least a pair of electrodes made of a plurality of thin metal wires formed on the electrically insulating base substrate, a polymer resistor which is not in direct contact with the pair of electrodes and which has PTC characteristics, and conductive layers which are in contact with both the electrodes and the polymer resistor. The conductive layers include at least a resin component, a conductor component and an additive component.Type: GrantFiled: February 4, 2009Date of Patent: August 27, 2013Assignee: Panasonic CorporationInventors: Keizo Nakajima, Akihiro Umeda, Takahito Ishii, Katsuhiko Uno, Hiroshi Fukuda
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Publication number: 20100326976Abstract: An object of the present invention is to provide a polymer resistor capable of being formed thin and exhibiting low resistance, thereby providing a polymer heating element in which the flexibility and usability and reliability of a planar heating element at the time of attachment to an appliance are improved while reducing the cost. The polymer heating element includes an electrically insulating base substrate 2, at least a pair of electrodes 3, 3? made of a plurality of thin metal wires formed on the electrically insulating base substrate 2, a polymer resistor 4 which is not in direct contact with the pair of electrodes 3, 3? and which has PTC characteristics, and conductive layers 5, 5? which are in contact with both the electrodes 3, 3? and the polymer resistor 4, in which the conductive layers 5, 5? include at least a resin component, a conductor component and an additive component.Type: ApplicationFiled: February 4, 2009Publication date: December 30, 2010Applicant: Panasonic CorporationInventors: Keizo Nakajima, Akihiro Umeda, Takahito Ishii, Katsuhiko Uno, Hiroshi Fukuda
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Patent number: 7675004Abstract: A heating element includes a base substrate, a pair of electrodes, a resistor capable of generating heat, a conductive resin, a terminal member, a hot melt adhesion metal, a hot melt cohesion metal, and a lead wire. The pair of electrodes is provided on the base substrate, and the resistor is formed between the pair of electrodes. The conductive resin is provided on each of the electrodes, and the terminal member is provided on the conductive resin. The adhesion metal is provided on the terminal member, and the cohesion metal forms a molten phase along with the adhesion metal. An end of the lead wire is welded to the cohesion metal. The conductive resin is provided in the vicinity of the adhesion metal so as to be affected by heat of the adhesion metal.Type: GrantFiled: March 11, 2005Date of Patent: March 9, 2010Assignee: Panasonic CorporationInventors: Keizo Nakajima, Takahito Ishii, Keiko Yasui, Seishi Terakado, Takehiko Shigeoka, Kazuyuki Kohara, Mitsuru Yoneyama
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Publication number: 20100038356Abstract: The sheet heating element according to the present invention comprises a substrate sheet made of an electrically insulative material and lines made of electrically conductive materials and arranged with a distance between them on the substrate sheet. The sheet heating element further comprises at least one PTC resistor sheet being in electrical contact with the lines and configured to heat up in a self-regulated manner in response to a supply of electricity from the lines. The at least one PTC resistor sheet may comprise a flame retardant agent and/or a liquid-resistant resin. The sheet heating element according to the present invention has excellent flexibility, durability, and reliability, as well as low manufacturing cost. When the sheet heating element of the present invention is used in a car seat heater or in a steering wheel heater, the passenger feels comfortable when seated thereon, and the driver feels comfortable when touching the steering wheel.Type: ApplicationFiled: January 22, 2008Publication date: February 18, 2010Applicant: Panasonic CorporationInventors: Hirosi Fukuda, Katsuhiko Uno, Takahito Ishii, Keizo Nakajima, Akihiro Umeda
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Publication number: 20100038357Abstract: A PTC resistor according to the present invention comprises at least one PTC composition which comprises at least one resin and at least two conductive materials. The at least two conductive materials comprises at least two conductive materials different from each other. The at least one PTC composition may comprise a first PTC composition which comprises a first resin and at least one first conductive material and a second PTC composition which is compounded with the first PTC composition and comprises a second resin and at least one second conductive material. The at least one first conductive material is at least partially different from the at least one second conductive material. One of the first resin and the second resin may comprise a reactant resin and a reactive resin which is cross-linked with the reactant resin. The PTC resistor may comprise a flame retardant agent. The PTC resistor may comprise a liquid-resistant resin.Type: ApplicationFiled: January 22, 2008Publication date: February 18, 2010Applicant: Panasonic CorporationInventors: Hirosi Fukuda, Katsuhiko Uno, Takahito Ishii, Keizo Nakajima, Akihiro Umeda
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Publication number: 20090051196Abstract: The seating element has an electrically insulative substrate, a pair of electrodes disposed on the substrate, and a polymer resistor electrically connected to the electrodes. The polymer resistor includes resin composition cross-linked via one of oxygen atom and nitrogen atom, and at least one of fibrous conductor and flake-like conductor mixed in the resin composition.Type: ApplicationFiled: July 13, 2006Publication date: February 26, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL., LTD.Inventors: Takahito Ishii, Seishi Terakado, Katsuhiko Uno, Hirosi Fukuda, Hiroyuki Ogino, Keizo Nakajima
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Patent number: 7435772Abstract: There is provided a treatment method of efficiently separating an additive component from a resin component for the purpose of treating and recycling a thermoplastic resin composition containing an additive. The treatment method includes heating and agitating the thermoplastic resin composition containing the additive together with a solvent for dissolving at least part of the additive at a temperature ranging from the glass transition temperature of the thermoplastic resin to the boiling point of the solvent inclusive, and separating and recovering the solvent in a liquid state in which at least part of the additive is dissolved, so that at least part of the additive is separated and removed from the thermoplastic resin composition.Type: GrantFiled: February 13, 2007Date of Patent: October 14, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keizo Nakajima, Tetsuji Kawakami, Hiroshi Onishi, Takayoshi Ueno, Takahiko Terada
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Publication number: 20070193996Abstract: A heating element includes a base substrate, a pair of electrodes, a resistor capable of generating heat, a conductive resin, a terminal member, a hot melt adhesion metal, a hot melt cohesion metal, and a lead wire. The pair of electrodes is provided on the base substrate, and the resistor is formed between the pair of electrodes. The conductive resin is provided on each of the electrodes, and the terminal member is provided on the conductive resin. The adhesion metal is provided on the terminal member, and the cohesion metal forms a molten phase along with the adhesion metal. An end of the lead wire is welded to the cohesion metal. The conductive resin is provided in the vicinity of the adhesion metal so as to be affected by heat of the adhesion metal.Type: ApplicationFiled: March 11, 2005Publication date: August 23, 2007Inventors: Keizo Nakajima, Takahito Ishii, Keiko Yasui, Seishi Terakado, Takehiko Shigeoka, Kazuyuki Kohara, Mitsuru Yoneyama
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Patent number: 7235219Abstract: There is provided a treatment method of efficiently separating an additive component from a resin component for the purpose of treating and recycling a thermoplastic resin composition containing an additive. The treatment method includes heating and agitating the thermoplastic resin composition containing the additive together with a solvent for dissolving at least part of the additive at a temperature ranging from the glass transition temperature of the thermoplastic resin to the boiling point of the solvent inclusive, and separating and recovering the solvent in a liquid state in which at least part of the additive is dissolved, so that at least part of the additive is separated and removed from the thermoplastic resin composition.Type: GrantFiled: February 27, 2002Date of Patent: June 26, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keizo Nakajima, Tetsuji Kawakami, Hiroshi Onishi, Takayoshi Ueno, Takahiko Terada
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Publication number: 20070142523Abstract: There is provided a treatment method of efficiently separating an additive component from a resin component for the purpose of treating and recycling a thermoplastic resin composition containing an additive. The treatment method includes heating and agitating the thermoplastic resin composition containing the additive together with a solvent for dissolving at least part of the additive at a temperature ranging from the glass transition temperature of the thermoplastic resin to the boiling point of the solvent inclusive, and separating and recovering the solvent in a liquid state in which at least part of the additive is dissolved, so that at least part of the additive is separated and removed from the thermoplastic resin composition.Type: ApplicationFiled: February 13, 2007Publication date: June 21, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Keizo NAKAJIMA, Tetsuji KAWAKAMI, Hiroshi ONISHI, Takayoshi UENO, Takahiko TERADA
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Patent number: 6903242Abstract: A dehalogenation treatment method of a halogen-containing flame-retardant resin composition has a step of bringing the halogen-containing flame-retardant resin composition into contact with a material mixture containing a dehalogenation material and a dehalogenation promoting material at a temperature lower than a thermal decomposition temperature of the resin composition.Type: GrantFiled: July 3, 2001Date of Patent: June 7, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takahiko Terada, Hiroshi Onishi, Tetsuji Kawakami, Keizo Nakajima, Takayoshi Ueno
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Publication number: 20040152816Abstract: There is provided a treatment method of efficiently separating an additive component from a resin component for the purpose of treating and recycling a thermoplastic resin composition containing an additive. The treatment method includes heating and agitating the thermoplastic resin composition containing the additive together with a solvent for dissolving at least part of the additive at a temperature ranging from the glass transition temperature of the thermoplastic resin to the boiling point of the solvent inclusive, and separating and recovering the solvent in a liquid state in which at least part of the additive is dissolved, so that at least part of the additive is separated and removed from the thermoplastic resin composition.Type: ApplicationFiled: March 18, 2004Publication date: August 5, 2004Inventors: Keizo Nakajima, Tetsuji Kawakami, Hiroshi Onishi, Takayoshi Ueno, Takahiko Terada
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Patent number: 6523764Abstract: A method for treating waste printed circuit boards, the method has the steps of: heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250° C. or higher; pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; and separating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.Type: GrantFiled: January 19, 2001Date of Patent: February 25, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takayoshi Ueno, Keizo Nakajima, Masaaki Suzuki, Hiroshi Onishi, Takahiko Terada, Yoshitaka Kawasaki, Tetsuji Kawakami
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Publication number: 20030018161Abstract: For efficiently recycling a flame retardant resin composition constituted of a flame retardant and a resin, the present invention provides a method for treating a flame retardant resin composition comprising a step of bringing at least part of a flame retardant resin composition containing a resin and a flame retardant into contact with a pressurized fluid constituted of a solvent to reduce the flame retardancy.Type: ApplicationFiled: June 19, 2002Publication date: January 23, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Masaaki Suzuki, Keizo Nakajima, Hiroshi Onishi
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Patent number: 6429284Abstract: For efficiently recycling a flame retardant resin composition constituted of a flame retardant and a resin, the present invention provides a method for treating a flame retardant resin composition comprising a step of bringing at least part of a flame retardant resin composition containing a resin and a flame retardant into contact with a pressurized fluid constituted of a solvent to reduce the flame retardancy.Type: GrantFiled: May 16, 2001Date of Patent: August 6, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masaaki Suzuki, Keizo Nakajima, Hiroshi Onishi
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Publication number: 20020099253Abstract: A dehalogenation treatment method of a halogen-containing flame-retardant resin composition has a step of bringing the halogen-containing flame-retardant resin composition into contact with a material mixture containing a dehalogenation material and a dehalogenation promoting material at a temperature lower than a thermal decomposition temperature of the resin composition.Type: ApplicationFiled: July 3, 2001Publication date: July 25, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Takahiko Terada, Hiroshi Onishi, Tetsuji Kawakami, Keizo Nakajima, Takayoshi Ueno
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Patent number: 6388050Abstract: The present specification discloses a method for treating a thermoplastic resin composition containing a flame retardant comprising a dissolving or dispersing step of bringing the thermoplastic resin composition containing a flame retardant into contact with a solvent to dissolve or disperse at least one portion of the flame retardant into the solvent. According to this, a thermoplastic resin composition containing a flame retardant can be easily separated into a flame retardant and a thermoplastic resin in their original states.Type: GrantFiled: April 17, 2001Date of Patent: May 14, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keizo Nakajima, Tetsuji Kawakami, Takayoshi Ueno, Hiroshi Onishi
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Patent number: 6336601Abstract: A method for treating waste printed circuit boards, the method has the steps of: heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250° C. or higher; pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; and separating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.Type: GrantFiled: December 13, 1999Date of Patent: January 8, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takayoshi Ueno, Keizo Nakajima, Masaaki Suzuki, Hiroshi Onishi, Takahiko Terada
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Publication number: 20010044520Abstract: For efficiently recycling a flame retardant resin composition constituted of a flame retardant and a resin, the present invention provides a method for treating a flame retardant resin composition comprising a step of bringing at least part of a flame retardant resin composition containing a resin and a flame retardant into contact with a pressurized fluid constituted of a solvent to reduce the flame retardancy.Type: ApplicationFiled: May 16, 2001Publication date: November 22, 2001Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Masaaki Suzuki, Keizo Nakajima, Hiroshi Onishi