Patents by Inventor Keizo Shimamura

Keizo Shimamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9306221
    Abstract: A fuel electrode for a solid oxide electrochemical cell includes: an electrode layer constituted of a mixed phase including an oxide having mixed conductivity and another oxide selected from the group including an aluminum-based oxide and a magnesium-based composite oxide, said another oxide having, supported on a surface part thereof, particles of at least one member selected from nickel, cobalt, and nickel-cobalt alloys.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: April 5, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takayuki Fukasawa, Keizo Shimamura, Yoshio Hanakata, Masato Yoshino, Kentaro Matsunaga, Tsuneji Kameda, Yoshiyasu Itoh
  • Patent number: 8247130
    Abstract: A hydrogen electrode constituted of a mixed phase composed of an oxide sinter having particles of at least one member selected from Ni, Co, Fe, and Cu on a surface part thereof and coated wholly or partly with a film having mixed conductivity and a sinter having ionic conductivity is formed on a surface of an electrolyte having oxygen ion conductivity.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: August 21, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Norikazu Osada, Takayuki Fukasawa, Keizo Shimamura
  • Publication number: 20090220837
    Abstract: A hydrogen electrode constituted of a mixed phase composed of an oxide sinter having particles of at least one member selected from Ni, Co, Fe, and Cu on a surface part thereof and coated wholly or partly with a film having mixed conductivity and a sinter having ionic conductivity is formed on a surface of an electrolyte having oxygen ion conductivity.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 3, 2009
    Inventors: Norikazu Osada, Takayuki Fukasawa, Keizo Shimamura
  • Publication number: 20090068533
    Abstract: A fuel electrode for a solid oxide electrochemical cell includes: an electrode layer including a mixed phase constituted of zirconia stabilized with yttrium oxide, ytterbium oxide, or scandium oxide and of an oxide selected from the group including an aluminum-based oxide and a magnesium-based composite oxide, said oxide having, supported on a surface part thereof, particles of at least one member selected from nickel, cobalt, and nickel-cobalt alloys; a meshy wiring formed on a surface layer part of the electrode layer and made of a material having higher electronic conductivity than the electrode layer; and a current collector which overlies the electrode layer and is in contact with at least the wiring.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 12, 2009
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takayuki Fukasawa, Keizo Shimamura, Yoshio Hanakata, Masato Yoshino, Kentaro Matsunaga, Tsuneji Kameda, Yoshiyasu Itoh
  • Publication number: 20090068523
    Abstract: A fuel electrode for a solid oxide electrochemical cell includes: an electrode layer 12 constituted of a mixed phase including an oxide having mixed conductivity and another oxide selected from the group including an aluminum-based oxide and a magnesium-based composite oxide, said another oxide having, supported on a surface part thereof, particles of at least one member selected from nickel, cobalt, and nickel-cobalt alloys; a meshy wiring 21 formed on a surface layer part of the electrode layer and made of a material having higher electronic conductivity than the electrode layer; and a current collector 14 which overlies the electrode layer and is in contact with at least the wiring.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 12, 2009
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takayuki Fukasawa, Keizo Shimamura, Yoshio Hanakata, Masato Yoshino, Kentaro Matsunaga, Tsuneji Kameda, Yoshiyasu Itoh
  • Patent number: 6306756
    Abstract: A method for the production of a semiconductor device having an electrode line formed in a semiconducting substrate is disclosed which comprises preparing a semiconducting substrate having trenches and/or contact holes formed preparatorily in a region destined to form the electrode line, forming a conductive film formed mainly of at least one member selected from among Cu, Ag, and Au on the surface of the semiconducting substrate, heat-treating the superposed Cu film while supplying at least an oxidizing gas thereto thereby flowing the Cu film and causing never melting to fill the trenches and/or contact holes, and removing by polishing the part of the conductive film which falls outside the region of the electrode line and completing the electrode lines consequently.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: October 23, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masahiko Hasunuma, Sachiyo Ito, Keizo Shimamura, Hisashi Kaneko, Nobuo Hayasaka, Junsei Tsutsumi, Akihiro Kajita, Junichi Wada, Haruo Okano
  • Patent number: 6090701
    Abstract: A method for the production of a semiconductor device having an electrode line formed in a semiconducting substrate is disclosed which comprises preparing a semiconducting substrate having trenches and/or contact holes formed preparatorily in a region destined to form the electrode line, forming a conductive film formed mainly of at least one member selected from among Cu, Ag, and Au on the surface of the semiconducting substrate, heat-treating the superposed Cu film while supplying at least an oxidizing gas thereto thereby flowing the Cu film to fill the trenches and/or contact holes, and removing by polishing the part of the conductive film which falls outside the region of the electrode line and completing the electrode lines consequently. During the heat treatment, a reducing gas is supplied in addition to the oxidizing gas to induce a local oxidation-reduction reaction and fluidify and/or flow the conductive film and consequently accomplish the embodiment of the conductive film in the trenches.
    Type: Grant
    Filed: June 20, 1995
    Date of Patent: July 18, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masahiko Hasunuma, Sachiyo Ito, Keizo Shimamura, Hisashi Kaneko, Nobuo Hayasaka, Junsei Tsutsumi, Akihiro Kajita, Junichi Wada, Haruo Okano
  • Patent number: 5004498
    Abstract: A dispersion strengthened copper alloy containing a copper matrix, and dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %. In this alloy, an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.
    Type: Grant
    Filed: October 10, 1989
    Date of Patent: April 2, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keizo Shimamura, Kagetaka Amano, Tatsuyoshi Aisaka, Satoshi Hanai, Kohsoku Nagata
  • Patent number: 4990411
    Abstract: A composite member is prepared which comprises a core which will have a compound superconducting layer when heat-treated, and a stock for forming a stabilizing member made of copper and surrounding the core. The composite member is heat-treated in an oxidizing atmosphere, thus forming a copper-oxide thin layer on the surface of the stock. Thereafter, the composite member is heat-treated in a non-oxidizing atmosphere or in an atmosphere having an oxygen partial pressure which is too low to allow the forming of copper oxide. As a result, a compound superconducting wire is made which comprises a member including a compound superconductor, a diffusion-preventing layer made of oxide and surrounding the member, and a stabilizing member made of copper and surrounding the layer.
    Type: Grant
    Filed: June 9, 1989
    Date of Patent: February 5, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shigeo Nakayama, Hachio Shiraki, Satoru Murase, Keizo Shimamura, Yoshiko Kohanawa
  • Patent number: 4832707
    Abstract: This invention provides a metal-bonded tool in which iron-base alloy powder and abrasive grains are bonded to each other. The quantity of the carbon or graphite in the bond being between 2.5 wt % or more and 4.5 wt % or less of the bond, and the diameter of the precipitated carbon or graphite being 5 .mu.m or less in the bond.
    Type: Grant
    Filed: May 19, 1988
    Date of Patent: May 23, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hisato Kamohara, Kagetaka Amano, Hiromichi Horie, Keizo Shimamura, Tatsuyoshi Aisaka