Patents by Inventor Keizo Tanaka

Keizo Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190247930
    Abstract: Provided is a surface-coated cutting tool including a base material and a coating including a super-multilayer-structure layer where A layers and B layers different from the A layers in composition are alternately laminated. The super-multilayer-structure layer includes an X area and a Y area those are alternately repeated. In the X area, A layers having a thickness AX and B layers having a thickness BX are alternately laminated. In the Y area, A layers having a thickness AY and B layers having a thickness BY are alternately laminated. The thickness AX is larger than the thickness AY, and the thickness BX is smaller than the thickness BY. Each of the A layers and the B layers comprising one or more elements selected from a group consisting of Ti, Al, Cr, Si, Ta, Nb, and W, and one or more elements selected from a group consisting of C and N.
    Type: Application
    Filed: September 20, 2017
    Publication date: August 15, 2019
    Inventors: Keizo Tanaka, Makoto Setoyama, Yutaka Kobayashi, Akira Kobayashi
  • Publication number: 20190022763
    Abstract: A surface-coated cutting tool includes a substrate composed of cemented carbide and a coating film. The coating film includes an intermediate layer in contact with the substrate and an upper layer formed on the intermediate layer. The upper layer is made up of a single layer consisting of an upper base layer which is a layer in contact with the intermediate layer or multiple layers constituted of two or more layers. A mismatch in lattice interplanar spacing in an interface region between the substrate and the intermediate layer is not higher than 65% of a theoretical value of a mismatch in lattice interplanar spacing between the substrate and the upper base layer. A mismatch in lattice interplanar spacing in an interface region between the intermediate layer and the upper base layer is not higher than 65% of the theoretical value of the mismatch in lattice interplanar spacing between the substrate and the upper base layer.
    Type: Application
    Filed: November 22, 2017
    Publication date: January 24, 2019
    Inventors: Keizo Tanaka, Makoto Setoyama, Haruyo Fukui, Akira Kobayashi, Koji Kuramochi
  • Publication number: 20180214993
    Abstract: A wear-resistant member production method includes: forming a clad layer by moving, relative to a substrate while feeding cladding powder onto the substrate and melting it using a local heating device; and cutting the clad layer. The cladding powder includes matrix powder containing a copper-based alloy, and hard powder including, as a hard phase, a silicide containing one or more elements selected from Cr, Fe, Co, Ni, and Cu, and one or more elements selected from Mo, W, and Nb. The hard powder includes first hard powder and second hard powder. The second hard powder is fed, separately from the first hard powder, to a melt pool formed by melting the first hard powder and the matrix powder, such that at least part of the second hard powder remains unmelted within the clad layer.
    Type: Application
    Filed: January 31, 2018
    Publication date: August 2, 2018
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Keizo TANAKA, Yasuhiro YAMAMOTO
  • Patent number: 9962771
    Abstract: A surface-coated tool includes a substrate and a coating film formed on the substrate. The coating film includes an alternate layer in which one or more A layers and one or more B layers are alternately stacked. The A layer and the B layer each have a thickness not smaller than 2 nm and not greater than 100 nm. An average composition of the A layer is expressed as TiaAlbSicN (0.5<a<0.8, 0.2<b<0.4, 0.01<c<0.1, a+b+c=1), an average composition of the B layer is expressed as TidAleSifN (0.4<d<0.6, 0.3<e<0.7, 0.01<f<0.1, d+e+f=1), and a condition of 0.05<A?D?0.2 AND 0.05<E?B?0.2 is satisfied.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: May 8, 2018
    Assignee: Sumitomo Electric Hardmetal Corp.
    Inventors: Keizo Tanaka, Hiroki Takeshita, Kazuhiro Hirose, Haruyo Fukui
  • Publication number: 20160175939
    Abstract: A surface-coated tool includes a substrate and a coating film formed on the substrate. The coating film includes an alternate layer in which one or more A layers and one or more B layers are alternately stacked. The A layer and the B layer each have a thickness not smaller than 2 nm and not greater than 100 nm. An average composition of the A layer is expressed as TiaAlbSicN (0.5<a<0.8, 0.2<b<0.4, 0.01<c<0.1, a+b+c=1), an average composition of the B layer is expressed as TidAleSifN (0.4<d<0.6, 0.3<e<0.7, 0.01<f<0.1, d+e+f=1), and a condition of 0.05<A-D?0.2 AND 0.05<E-B?0.2 is satisfied.
    Type: Application
    Filed: May 19, 2015
    Publication date: June 23, 2016
    Applicants: SUMITOMO ELECTRIC HARDMETAL CORP., SUMITOMO ELECTRIC HARDMETAL CORP.
    Inventors: Keizo Tanaka, Hiroki Takeshita, Kazuhiro Hirose, Haruyo Fukui
  • Publication number: 20100059261
    Abstract: A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I): wherein one of X and Y represents O and the other represents NAr2R2, and R1, R2, Ar1, and Ar2 are as defined in the specification, and a resin composition comprising the compound as a reactive monomer.
    Type: Application
    Filed: June 20, 2006
    Publication date: March 11, 2010
    Applicants: AMT LABORATORY CO., LTD., MANAC INC.
    Inventors: Hisashi Watanabe, Kenji Nakajima, Keizo Tanaka, Satoru Nanba
  • Patent number: 6336990
    Abstract: A tape carrier package is stacked on an array substrate while interposing a thermosetting type anisotropic conductive adhesive between a plurality of first conductors formed on the end portion of the array substrate and a plurality of second conductors formed on the tape carrier package. Subsequently, a heater tool of a thermocompression bonding apparatus applies pressure and heat to the anisotropic conductive adhesive via the tape carrier package. In this case, the anisotropic conductive adhesive is slowly heated up to its hardening end temperature to harden after it softens, thereby thermocompression bonding the first and second conductors to each other by the anisotropic conductive adhesive.
    Type: Grant
    Filed: July 1, 1998
    Date of Patent: January 8, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keizo Tanaka, Yoshikazu Yomogihara
  • Patent number: 6302648
    Abstract: A two stage jointed stationary blade of a high pressure or intermediate pressure steam turbine is formed with a bolt joint in place of a welded joint so as to make detachment and disassembly possible, and thereby facilitating maintenance and inspection work and reducing assembling man-hours. A stationary blade (front stage)(2), outer ring front portion (1) and inner ring front portion (3) are welded into an integral structure. A stationary blade (rear stage) 22, outer ring rear portion (21) and inner ring rear portion (23) are also welded into an integral structure. The outer ring front portion 1, outer ring center portion 10 and the outer ring rear portion 21 are mutually engaged via engaging portions (4, 11 and 12, 24) with precise positioning and then jointed together integrally by bolt (30).
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: October 16, 2001
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Tetsu Konishi, Keizo Tanaka, Hideyuki Toda, Asaharu Matsuo, Toyokazu Kuwana, Ryotaro Magoshi
  • Patent number: 5989088
    Abstract: The present invention provides a manufacturing method of a flat-panel display unit and a carrier therefor which make it unnecessary to implement alignment in each step, except for alignment which require higher precision, by performing the alignment in advance in the pre-stage of a series of steps. The present invention also provides a manufacturing method of a flat-panel display unit which allows alignment with accuracy of about 50 to 100 .mu.m to be performed simply, reliably and quickly. According to the inventive manufacturing method, a display panel is mounted non-shiftably on the carrier and while being mounted thereon, is then carried between processing machines and is processed by the processing machines. In mounting the display panel on the carrier, it is aligned with the carrier in advance by visually aligning alignment marks thereof.
    Type: Grant
    Filed: July 2, 1997
    Date of Patent: November 23, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tatsuya Hasegawa, Satoshi Yoshimura, Shinichi Koyama, Keizo Tanaka, Yoshikazu Yomogihara, Sanae Tokunaga, Masaichi Okubo
  • Patent number: 5810959
    Abstract: A tape carrier package is stacked on an array substrate while interposing a thermosetting type anisotropic conductive adhesive between a plurality of first conductors formed on the end portion of the array substrate and a plurality of second conductors formed on the tape carrier package. Subsequently, a heater tool of a thermocompression bonding apparatus applies pressure and heat to the anisotropic conductive adhesive via the tape carrier package. In this case, the anisotropic conductive adhesive is slowly heated up to its hardening end temperature to harden after it softens, thereby thermocompression bonding the first and second conductors to each other by the anisotropic conductive adhesive.
    Type: Grant
    Filed: February 27, 1997
    Date of Patent: September 22, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keizo Tanaka, Yoshikazu Yomogihara
  • Patent number: 5278125
    Abstract: A tandem support structure for an exhaust gas purifying catalyst comprises a sleeve, a first honeycomb disposed on an upstream side of exhaust gases, and a second honeycomb disposed on a downstream side of exhaust gases at a position axially separated from the first honeycomb. The second honeycomb is fixed to the sleeve, and the first honeycomb is held by a holding member which axially extends in an upstream direction from said second honeycomb, without contacting the sleeve. Since an air layer exists between the first honeycomb and the sleeve, heat radiation from the first honeycomb is prevented and temperature rising characteristics of the first honeycomb are improved.
    Type: Grant
    Filed: December 4, 1992
    Date of Patent: January 11, 1994
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Kiyomi Iida, Gozo Kaji, Norio Yamagishi, Keizo Tanaka