Patents by Inventor Keizo Toyama
Keizo Toyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10584983Abstract: The present invention aims at providing a cover structure of a tactile sensor and a tactile sensor that can secure sufficient adhesion between a sensor body and a covering layer without providing an adhesive layer and have no possibility of causing a sensor to make detection error due to the covering layer formed thereon. A cover structure of a tactile sensor according to the present invention includes a sensor body 2 and a covering layer 3 made of elastic body molded on the sensor body 2. The covering layer 3 includes at least two layers of an outer layer 32 disposed as the outermost layer and an inner layer 31 disposed to come in contact with the sensor body 2 and having a higher adhesiveness and a lower hardness than those of the outer layer 32, and is integrally molded with the sensor body 2 by the cast molding.Type: GrantFiled: January 29, 2016Date of Patent: March 10, 2020Assignees: NOK CORPORATION, NIPPON MEKTRON, LTD.Inventors: Yuki Murota, Hiroshi Umebayashi, Toru Uda, Hidekazu Yoshihara, Taisuke Kimura, Keizo Toyama
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Patent number: 10359326Abstract: This invention provides a pressure sensitive element capable of suppressing dispersion in the initial load for pressure sensing among the sensor electrodes or among the pressure sensors. The pressure sensitive element has a support substrate, a sensor electrode, a pressure sensing film and an insulating layer. The pressure sensing film is arranged opposing to the sensor electrode. The insulating layer has an opening and is provided between the support substrate and the pressure sensing film. At least a part of an opening edge of the opening is fallen on the sensor electrode. An exposed part as a part of the sensor electrode is exposed inside the opening, while leaving a buried part as the other part of the sensor electrode buried under the insulating layer.Type: GrantFiled: July 28, 2016Date of Patent: July 23, 2019Assignee: NIPPON MEKTRON, LTD.Inventors: Ryoichi Toyoshima, Keizo Toyama, Hirokazu Ohdate, Masayuki Iwase
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Patent number: 10048141Abstract: Provided is a pressure sensing element configured to be flexible, and capable of demonstrating a stable electrical reliability over a long period; and, a pressure sensor having such pressure sensing element. A pressure sensing element (100) has an electro-conductive pressure sensing film (14), a sensor electrode (12) provided at a position faced to the pressure sensing film (14), and an insulating layer (13) which creates a predetermined distance “A” between the pressure sensing film (14) and the sensor electrode (12) so as to keep them apart from each other, the pressure sensing film (14) being a resin film containing carbon particles (140); and, a pressure sensor (200) has the pressure sensing element (100), and a detection unit (210) which is electrically connected with the pressure sensing element (100) so as to detect contact resistance between the pressure sensing film (14) and the sensor electrode (12).Type: GrantFiled: December 24, 2014Date of Patent: August 14, 2018Assignee: NIPPON MEKTRON, LTD.Inventors: Masayuki Iwase, Keizo Toyama, Kazuyuki Ozaki, Hirokazu Ohdate, Taisuke Kimura, Ryoichi Toyoshima
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Patent number: 10034370Abstract: A stretchable circuit board includes: a stretchable portion 50 that includes a stretchable base 53 haying stretchability and a stretchable wiring 55 formed on a first main surface 53a of the stretchable base 53 and having stretchability; and a non-stretchable portion 30 that includes a base substrate 34 having stretchability lower than that of the stretchable base 53 and a draw-out wiring 35 formed on a main surface 32b of the base substrate 34, in which the main surface 53a of the stretchable portion 53 and the main surface 32b of the base substrate 34 are joined with each other, and the stretchable wiring 55 and the draw-out wiring 35 are electrically connected with each other. In addition, the main surface 32b of the base substrate has a rough surface with projections and depressions.Type: GrantFiled: August 30, 2017Date of Patent: July 24, 2018Assignee: NIPPON MEKTRON, LTD.Inventors: Masayuki Iwase, Keizo Toyama
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Publication number: 20180092206Abstract: A stretchable circuit board includes: a stretchable portion 50 that includes a stretchable base 53 haying stretchability and a stretchable wiring 55 formed on a first main surface 53a of the stretchable base 53 and having stretchability; and a non-stretchable portion 30 that includes a base substrate 34 having stretchability lower than that of the stretchable base 53 and a draw-out wiring 35 formed on a main surface 32b of the base substrate 34, in which the main surface 53a of the stretchable portion 53 and the main surface 32b of the base substrate 34 are joined with each other, and the stretchable wiring 55 and the draw-out wiring 35 are electrically connected with each other. In addition, the main surface 32b of the base substrate has a rough surface with projections and depressions.Type: ApplicationFiled: August 30, 2017Publication date: March 29, 2018Applicant: NIPPON MEKTRON, LTD.Inventors: Masayuki Iwase, Keizo Toyama
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Publication number: 20170343394Abstract: The present invention aims at providing a cover structure of a tactile sensor and a tactile sensor that can secure sufficient adhesion between a sensor body and a covering layer without providing an adhesive layer and have no possibility of causing a sensor to make detection error due to the covering layer formed thereon. A cover structure of a tactile sensor according to the present invention includes a sensor body 2 and a covering layer 3 made of elastic body molded on the sensor body 2. The covering layer 3 includes at least two layers of an outer layer 32 disposed as the outermost layer and an inner layer 31 disposed to come in contact with the sensor body 2 and having a higher adhesiveness and a lower hardness than those of the outer layer 32, and is integrally molded with the sensor body 2 by the cast molding.Type: ApplicationFiled: January 29, 2016Publication date: November 30, 2017Applicants: NOK Corporation, Nippon Mektron, Ltd.Inventors: Yuki MUROTA, Hiroshi UMEBAYASHI, Toru UDA, Hidekazu YOSHIHARA, Taisuke KIMURA, Keizo TOYAMA
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Insulating material, passive element, circuit board, and method of manufacturing an insulating sheet
Patent number: 9620286Abstract: Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked on the high-k layer.Type: GrantFiled: June 23, 2014Date of Patent: April 11, 2017Assignees: NIPPON MEKTRON, LTD., OSAKA UNIVERSITYInventors: Masaya Nogi, Katsuaki Suganuma, Hirotaka Koga, Natsuki Komoda, Hirofumi Matsumoto, Masayuki Iwase, Kazuyuki Ozaki, Keizo Toyama -
Publication number: 20170089778Abstract: A pressure sensitive element has a support substrate, a sensor electrode, a pressure sensing film and an insulating layer; the pressure sensing film being arranged opposing to the sensor electrode; the insulating layer having an opening, and being provided between the support substrate and the pressure sensing film; at least a part of an opening edge of the opening being fallen on the sensor electrode; an exposed part as a part of the sensor electrode being exposed inside the opening, leaving a buried part as the other part of the sensor electrode buried under the insulating layer.Type: ApplicationFiled: July 28, 2016Publication date: March 30, 2017Applicant: NIPPON MEKTRON, LTD.Inventors: Ryoichi Toyoshima, Keizo Toyama, Hirokazu Ohdate, Masayuki Iwase
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Patent number: 9574955Abstract: A pressure sensing element (100) includes a support substrate (11); a sensor electrode (12) supported by the support substrate (11); a pressure sensing film (14) functionalized to be electro-conductive, at least in a portion thereof faced to the sensor electrode (12); and an insulating layer (13) which keeps the sensor electrode (12) and the pressure sensing film (14) apart from each other by a predetermined distance A, and has formed therein an opening (20) in which the sensor electrode (12) is exposed to the pressure sensing film (14), the insulating layer (13) having an aperture wall (13b) which partitions the opening (20), and an aperture end (top aperture end (13a)) faced to the pressure sensing film (14), and the insulating layer (13) being increased in height, measured from the support substrate (11), continuously towards the opening (20).Type: GrantFiled: January 14, 2015Date of Patent: February 21, 2017Assignee: NIPPON MEKTRON, LTD.Inventors: Masayuki Iwase, Keizo Toyama, Kazuyuki Ozaki, Hirokazu Ohdate, Taisuke Kimura, Ryoichi Toyoshima
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Publication number: 20160363491Abstract: A pressure sensing element (100) includes a support substrate (11); a sensor electrode (12) supported by the support substrate (11); a pressure sensing film (14) functionalized to be electro-conductive, at least in a portion thereof faced to the sensor electrode (12); and an insulating layer (13) which keeps the sensor electrode (12) and the pressure sensing film (14) apart from each other by a predetermined distance A, and has formed therein an opening (20) in which the sensor electrode (12) is exposed to the pressure sensing film (14), the insulating layer (13) having an aperture wall (13b) which partitions the opening (20), and an aperture end (top aperture end (13a)) faced to the pressure sensing film (14), and the insulating layer (13) being increased in height, measured from the support substrate (11), continuously towards the opening (20).Type: ApplicationFiled: January 14, 2015Publication date: December 15, 2016Applicant: NIPPON MEKTRON, LTD.Inventors: Masayuki Iwase, Keizo Toyama, Kazuyuki Ozaki, Hirokazu Ohdate, Taisuke Kimura, Ryoichi Toyoshima
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Publication number: 20160327441Abstract: Provided is a pressure sensing element configured to be flexible, and capable of demonstrating a stable electrical reliability over a long period; and, a pressure sensor having such pressure sensing element. A pressure sensing element (100) has an electro-conductive pressure sensing film (14), a sensor electrode (12) provided at a position faced to the pressure sensing film (14), and an insulating layer (13) which creates a predetermined distance “A” between the pressure sensing film (14) and the sensor electrode (12) so as to keep them apart from each other, the pressure sensing film (14) being a resin film containing carbon particles (140); and, a pressure sensor (200) has the pressure sensing element (100), and a detection unit (210) which is electrically connected with the pressure sensing element (100) so as to detect contact resistance between the pressure sensing film (14) and the sensor electrode (12).Type: ApplicationFiled: December 24, 2014Publication date: November 10, 2016Applicant: NIPPON MEKTRON, LTD.Inventors: Masayuki Iwase, Keizo Toyama, Kazuyuki Ozaki, Hirokazu Ohdate, Taisuke Kimura, Ryoichi Toyoshima
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INSULATING MATERIAL, PASSIVE ELEMENT, CIRCUIT BOARD, AND METHOD OF MANUFACTURING AN INSULATING SHEET
Publication number: 20150014039Abstract: Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked on the high-k layer.Type: ApplicationFiled: June 23, 2014Publication date: January 15, 2015Applicants: NIPPON MEKTRON, LTD., OSAKA UNIVERSITYInventors: Masaya Nogi, Katsuaki Suganuma, Hirotaka Koga, Natsuki Komoda, Hirofumi Matsumoto, Masayuki Iwase, Kazayuki Ozaki, Keizo Toyama