Abstract: An antenna module according to the present disclosure includes a control substrate including a control circuit, an antenna substrate mounted on the control substrate and including shield through holes and a plurality of first antenna patch conductors disposed side by side when viewed in a plan view, and filters each electrically connected to the shield through holes and including a high-frequency filter and a low-frequency filter. The control substrate or the antenna substrate includes internal antennas at positions each facing one of the plurality of corresponding first antenna patch conductors. When viewed in a plan view, the shield through holes and the filters are located between adjacent ones of the plurality of first antenna patch conductors.

Abstract: An antenna structure according to the present disclosure includes an antenna substrate including a first surface and a second surface located on an opposite side to the first surface, a transmissive filter located over the first surface, and control substrates located on the second surface. The transmissive filter includes first annular patterns located on a surface facing the first surface, and second annular patterns located on a surface on an opposite side to the surface facing the first surface. The first annular pattern and the second annular pattern are located overlapping each other in a plane perspective. The control substrates are identical in number to the first annular patterns, and are located overlapping the first annular patterns in a plane perspective.

Abstract: An antenna substrate according to the present disclosure includes a first insulation layer including a first surface, a second surface located opposite the first surface, and a first through-hole conductor extending from the first surface to the second surface, a ground conductor located at the first surface, the ground conductor including a slot, a second insulation layer including a second through-hole conductor connected to the first through-hole conductor, the second insulation layer covering the ground conductor located at the first surface, and a first antenna conductor located at a surface located on the opposite side to the other surface of the second insulation layer, the other surface covering the ground conductor.

Abstract: An antenna module includes a control board having a control circuit, an antenna board on the control board and having a shield through hole and a plurality of first antenna patch conductors, a signal conductor on the control board and the antenna board, a frame body surrounding the first antenna patch conductors and separating the first antenna patch conductors from each other, a metal film covering at least an outer surface or an inner surface of the frame body, and a filter electrically connected to the shield through hole. The control or antenna board includes an internal antenna opposing the first antenna patch conductors. When seen in a plan view, the shield through hole is located between the first antenna patch conductors. A resin having a higher dielectric constant than air is located is surrounded by the frame body such that the first antenna patch conductors are coated with resin.

Abstract: An antenna module according to the present disclosure includes a control substrate including a control circuit, an antenna substrate mounted on the control substrate and including shield through holes and a plurality of first antenna patch conductors disposed side by side when viewed in a plan view, and filters each electrically connected to the shield through holes and including a high-frequency filter and a low-frequency filter. The control substrate or the antenna substrate includes internal antennas at positions each facing one of the plurality of corresponding first antenna patch conductors. When viewed in a plan view, the shield through holes and the filters are located between adjacent ones of the plurality of first antenna patch conductors.

Abstract: A wiring substrate comprises a first substrate, a second substrate which includes a frame body located on the outer circumferential edge of the first substrate, at least two connecting parts connected to the inner circumferential part of the frame body, and a support body connecting the two connecting parts to each other, and a third substrate located on a surface of the second substrate opposite the first substrate. The support body includes a direction changing part between the two connecting parts and does not include an annular structure where the direction changing part is included on the circumference.

Abstract: An antenna module of the present disclosure includes a control substrate having a flat plate shape and configured to house or mount a semiconductor element; a frame substrate bonded to an upper surface of the control substrate via bonding members and exposing a center portion of the upper surface of the control substrate; and an antenna substrate having a flat plate shape, bonded to an upper surface of the frame substrate via the bonding members so as to face the control substrate, and provided with a plurality of antenna patterns disposed along a main surface of the antenna substrate. The frame substrate includes a frame main body and a crosspiece. Between the frame main body/the crosspiece and the control substrate as well as the antenna substrate, projecting portions that come into contact with the opposing control substrate, frame substrate, and antenna substrate are provided at a fixed height.

Abstract: A wiring substrate comprises a first substrate, a second substrate which includes a frame body located on the outer circumferential edge of the first substrate, at least two connecting parts connected to the inner circumferential part of the frame body, and a support body connecting the two connecting parts to each other, and a third substrate located on a surface of the second substrate opposite the first substrate. The support body includes a direction changing part between the two connecting parts and does not include an annular structure where the direction changing part is included on the circumference.

Abstract: An antenna substrate includes a cap substrate including first antenna conductors arranged lengthwise and crosswise on a first insulating layer facing each other, and a first connection pad on the outer peripheral edge of the first insulating layer's lower surface; a frame substrate including a second connection pad on an outer peripheral edge of a second insulating layer's upper surface and a third connection pad on an outer peripheral edge of the second insulating layer's lower surface; and a base substrate including a plurality of second antenna conductors arranged on a third insulating layer's upper surface and a fourth connection pad on an outer peripheral edge of the third insulating layer's upper surface. The base, frame and cap substrates are layered in this order. First opening portions in the second insulating layer have an outer periphery located radially outward from the first antenna conductor's outer periphery in a top view.

Abstract: An antenna substrate includes a cap substrate including a first antenna conductor located on upper and lower surfaces of a first insulating layer; a frame substrate including an opening located in the second insulating layer and having an outer periphery that surrounds an individual of or a collective number of outer peripheries of the plurality of first antenna conductors in a top view; a base substrate including a second antenna conductor located on an upper surface of a third insulating layer; a first adhesive material adhering the first insulating layer and the second insulating layer; and a second adhesive material adhering the second insulating layer and the third insulating layer; and the first adhesive material and the second adhesive material include a first bonding member and a second bonding member having an adhesive strength to the second insulating layer greater than that of the first bonding member.

Abstract: An antenna module of the present disclosure includes a control substrate having a flat plate shape and configured to house or mount a semiconductor element; a frame substrate bonded to an upper surface of the control substrate via bonding members and exposing a center portion of the upper surface of the control substrate; and an antenna substrate having a flat plate shape, bonded to an upper surface of the frame substrate via the bonding members so as to face the control substrate, and provided with a plurality of antenna patterns disposed along a main surface of the antenna substrate. The frame substrate includes a frame main body and a crosspiece. Between the frame main body/the crosspiece and the control substrate as well as the antenna substrate, projecting portions that come into contact with the opposing control substrate, frame substrate, and antenna substrate are provided at a fixed height.

Abstract: An antenna substrate includes a cap substrate including first antenna conductors arranged lengthwise and crosswise on a first insulating layer facing each other, and a first connection pad on the outer peripheral edge of the first insulating layer's lower surface; a frame substrate including a second connection pad on an outer peripheral edge of a second insulating layer's upper surface and a third connection pad on an outer peripheral edge of the second insulating layer's lower surface; and a base substrate including a plurality of second antenna conductors arranged on a third insulating layer's upper surface and a fourth connection pad on an outer peripheral edge of the third insulating layer's upper surface. The base, frame and cap substrates are layered in this order. First opening portions in the second insulating layer have an outer periphery located radially outward from the first antenna conductor's outer periphery in a top view.

Abstract: An antenna substrate includes a cap substrate including a first antenna conductor located on upper and lower surfaces of a first insulating layer; a frame substrate including an opening located in the second insulating layer and having an outer periphery that surrounds an individual of or a collective number of outer peripheries of the plurality of first antenna conductors in a top view; a base substrate including a second antenna conductor located on an upper surface of a third insulating layer; a first adhesive material adhering the first insulating layer and the second insulating layer; and a second adhesive material adhering the second insulating layer and the third insulating layer; and the first adhesive material and the second adhesive material include a first bonding member and a second bonding member having an adhesive strength to the second insulating layer greater than that of the first bonding member.

Abstract: A method of manufacturing a cavity substrate of the present invention includes respectively laminating second and third substrates on upper and lower surfaces of a first substrate having an opening and having an external dimension larger than an external dimension of each of the second and third substrates to ensure that an end portion of the first substrate protrudes a first length from the second and third substrates, and cutting the end portion of the first substrate protruding from each of the second and third substrates to a second length smaller than the first length.

Abstract: A method of manufacturing a cavity substrate of the present invention includes respectively laminating second and third substrates on upper and lower surfaces of a first substrate having an opening and having an external dimension larger than an external dimension of each of the second and third substrates to ensure that an end portion of the first substrate protrudes a first length from the second and third substrates, and cutting the end portion of the first substrate protruding from each of the second and third substrates to a second length smaller than the first length.

Abstract: A composite wiring board includes a first wiring board having an opening for housing an electronic component, and including a plurality of first connection pads on an upper surface and a plurality of second connection pads on a lower surface, and a second wiring board having the electronic component mounted on a lower surface, including a third connection pad provided on the lower surface on an outer peripheral side and bonded to the first connection pad through a solder, and disposed on the first wiring board so as to cover the opening, in which a grounding inner wall conductor layer is deposited on an inner wall of the opening around the electronic component, and a grounding conductor layer is deposited on the lower surface of the second wiring board and connected to the inner wall conductor layer through a solder.

Abstract: A wiring board includes a base wiring board 10 and a frame wiring board 20. The base wiring board 10 has an element mounting portion 1a and a frame-shaped frame joining portion 1b on the upper surface and a solder resist layer 4 deposited in a portion between the element mounting portion 1a and the frame joining portion 1b. In the wiring board 10, a first joining pad 6 provided in the frame joining portion 1b and a second joining pad 16 provided in a lower surface of the frame wiring board 20 are joined together via a solder bump H so that a gap may be formed between the frame joining portion 1b and the frame wiring board 20. The base wiring board 10 has a resin injection hole 8 penetrating through the base wiring board 10 in the frame joining portion 1b, and the gap is filled with a sealing resin 18.

Abstract: There is provided a collective printed circuit board including a plurality of printed circuit boards each having a mounting unit on which a semiconductor element is mounted at an upper-surface central portion, and a frame having a plurality of through holes having sizes to surround the mounting portion. Upper-surface peripheral edge portions of the printed circuit boards and a through-hole peripheral portion of the frame are bonded to each other such that the mounting units are exposed from the through holes.

Abstract: There is provided a printed circuit board including an insulating substrate having a guide hole, a solder resist layer coated on a surface of the insulating substrate, and a connection pad arranged on the surface of the insulating substrate and having an outer periphery covered with the solder resist layer and a central portion exposed in an opening formed in the solder resist layer. The solder resist layer has a positioning hole having a diameter smaller than that of the guide hole and formed by photolithography above the guide hole simultaneously with the opening.

Abstract: A wiring board includes a base wiring board 10 and a frame wiring board 20. The base wiring board 10 has an element mounting portion 1a and a frame-shaped frame joining portion 1b on the upper surface and a solder resist layer 4 deposited in a portion between the element mounting portion 1a and the frame joining portion 1b. In the wiring board 10, a first joining pad 6 provided in the frame joining portion 1b and a second joining pad 16 provided in a lower surface of the frame wiring board 20 are joined together via a solder bump H so that a gap may be formed between the frame joining portion 1b and the frame wiring board 20. The base wiring board 10 has a resin injection hole 8 penetrating through the base wiring board 10 in the frame joining portion 1b, and the gap is filled with a sealing resin 18.