Patents by Inventor Keizou Shiotsuki
Keizou Shiotsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230391931Abstract: There is provided a copolymer containing tetrafluoroethylene unit and perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of perfluoro(propyl vinyl ether) unit of 4.2 to 4.9% by mass with respect to the whole of the monomer units, a melt flow rate at 372° C. of 19.0 to 27.0 g/10 min, and the number of functional groups of 50 or less per 106 main-chain carbon atoms.Type: ApplicationFiled: August 22, 2023Publication date: December 7, 2023Applicant: Daikin Industries, Ltd.Inventors: Tadaharu Isaka, Yumi Zenke, Yukari Yamamoto, Hayato Tsuda, Keizou Shiotsuki
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Publication number: 20230395282Abstract: Provided is a coated electric wire having a core wire, and a coating layer installed on the periphery of the core wire, wherein the coating layer contains a copolymer containing tetrafluoroethylene unit and perfluoro(propyl vinyl ether) unit, the content of perfluoro(propyl vinyl ether) unit in the copolymer is 4.8 to 5.5% by mass with respect to the whole of the monomer units, the melt flow rate at 372° C. of the copolymer is 28.0 to 37.0 g/10 min, and the number of functional groups of the copolymer is 50 or less per 106 main-chain carbon atoms.Type: ApplicationFiled: August 22, 2023Publication date: December 7, 2023Applicant: DAIKIN INDUSTRIES, LTDInventors: Tadaharu ISAKA, Yumi ZENKE, Yukari YAMAMOTO, Yasuyuki YAMAGUCHI, Keizou SHIOTSUKI
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Publication number: 20230383033Abstract: There is provided a copolymer containing tetrafluoroethylene unit and perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of perfluoro(propyl vinyl ether) unit of 3.2 to 3.7% by mass with respect to the whole of the monomer units, the melt flow rate at 372° C. of 22.0 to 27.0 g/10 min, and the number of functional groups of 50 or less per 106 main-chain carbon atoms.Type: ApplicationFiled: August 15, 2023Publication date: November 30, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yumi ZENKE, Tadaharu ISAKA, Yukari YAMAMOTO, Hayato TSUDA, Keizou SHIOTSUKI
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Publication number: 20230235159Abstract: A copolymer containing tetrafluoroethylene unit and a perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of the perfluoro(propyl vinyl ether) unit of 2.8 to 3.5% by mass with respect to the whole of the monomer units, a melt flow rate of 31 to 38 g/10 min, and the number of functional groups of 50 or less per 106 main-chain carbon atoms, and the number of functional groups of —CF?CF2, —CF2H, —COF, —COOH, —COOCH3, —CONH2 and —CH2OH of 50 or less per 106 main-chain carbon atoms. Also disclosed is an injection molded article, a member to be compressed and a coated electric wire including the copolymer.Type: ApplicationFiled: March 29, 2023Publication date: July 27, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Tadaharu Isaka, Yukari Yamamoto, Yumi Zenke, Hayato Tsuda, Keizou Shiotsuki
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Publication number: 20230227594Abstract: A copolymer containing tetrafluoroethylene unit and a perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of the perfluoro(propyl vinyl ether) unit of 5.8 to 7.6% by mass with respect to the whole of the monomer units, a melt flow rate of 50 to 68 g/10 min, and the number of functional groups of —CF?CF2, —CF2H, —COF, —COOH, —COOCH3, —CONH2 and —CH2OH of 50 or less per 106 main-chain carbon atoms. Also disclosed is an injection molded article and member to be compressed containing the copolymer, and a coated electric wire including a coating layer containing the copolymer.Type: ApplicationFiled: March 29, 2023Publication date: July 20, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yukari YAMAMOTO, Tadaharu Isaka, Yumi Zenke, Hayato Tsuda, Keizou Shiotsuki
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Patent number: 11021556Abstract: Provided is a tetrafluoroethylene/hexafluoropropylene copolymer which is less likely to form a lump, or is less likely to form a large lump even if a lump is formed, during the formation of an electric wire. The tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate measured at 372° C. of 35.0 to 45.0 g/10 minutes and a swell of ?8.0% to 5.0%, the sum of the numbers of —CF2H groups and unstable end groups being 120 or less per 1×106 carbon atoms.Type: GrantFiled: January 30, 2015Date of Patent: June 1, 2021Assignees: DAIKIN INDUSTRIES, LTD., DAIKIN AMERICA, INC.Inventors: Tadaharu Isaka, Ryouichi Fukagawa, Takeshi Shimono, Keizou Shiotsuki
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Publication number: 20200332037Abstract: An insulated communication wire comprising a conductive metal core wire and an insulative coating, which insulated communication wire may connect a computer with a peripheral device, and which insulated communication wire may be a data transmission cable or LAN cable.Type: ApplicationFiled: July 6, 2020Publication date: October 22, 2020Applicants: DAIKIN INDUSTRIES, LTD., DAIKIN AMERICA, INC.Inventors: Tadaharu ISAKA, Ryouichi Fukagawa, Takeshi Shimono, Keizou Shiotsuki
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Publication number: 20190177453Abstract: Provided is a tetrafluoroethylene/hexafluoropropylene copolymer which is less likely to form a lump, or is less likely to form a large lump even if a lump is formed, during the formation of an electric wire. The tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate measured at 372° C. of 35.0 to 45.0 g/10 minutes and a swell of ?8.0% to 5.0%, the sum of the numbers of —CF2H groups and unstable end groups being 120 or less per 1×106 carbon atoms.Type: ApplicationFiled: February 12, 2019Publication date: June 13, 2019Applicants: Daikin Industries, Ltd., Daikin America, Inc.Inventors: Tadaharu Isaka, Ryouichi Fukagawa, Takeshi Shimono, Keizou Shiotsuki
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Publication number: 20170008986Abstract: Provided is a tetrafluoroethylene/hexafluoropropylene copolymer which is less likely to form a lump, or is less likely to form a large lump even if a lump is formed, during the formation of an electric wire. The tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate measured at 372° C. of 35.0 to 45.0 g/10 minutes and a swell of ?8.0% to 5.0%, the sum of the numbers of —CF2H groups and unstable end groups being 120 or less per 1×106 carbon atoms.Type: ApplicationFiled: January 30, 2015Publication date: January 12, 2017Applicants: DAIKIN INDUSTRIES, LTD., DAIKIN AMERICA, INC.Inventors: Tadaharu ISAKA, Ryouichi FUKAGAWA, Takeshi SHIMONO, Keizou SHIOTSUKI
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Patent number: 9012580Abstract: A tetrafluoroethylene/hexafluoropropylene copolymer has improved moldability in melt extrusion molding, especially with significant reduction of defects in high-speed extrusion coating of an electrical wire. The tetrafluoroethylene/hexafluoropropylene copolymer is obtained by polymerization of at least tetrafluoroethylene and hexafluoropropylene selected from the group consisting of tetrafluoroethylene, hexafluoropropylene and a third monomer without mixing with the resin which has the melting point with the difference of 20 degree C. and more from the melting point of the tetrafluoroethylene/hexafluoropropylene copolymer; and has a complex viscosity of from 2.0×I03 to 10.0×I03 Pa*s and a storage modulus of from 0.1 to 3.5 Pa*s in melt viscoelasticity measurement under the condition of atmosphere temperature of 310 degree C. and angular frequency of 0.01 radian/second. The tetrafluoroethylene/hexafluoropropylene copolymer can be used in an electrical wire as a coating on a conductive core.Type: GrantFiled: February 9, 2009Date of Patent: April 21, 2015Assignees: Daikin Industries, Ltd., Daikin America, Inc.Inventors: Takahiro Kitahara, Tadaharu Isaka, Ryouichi Fukagawa, Keizou Shiotsuki
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Publication number: 20130230645Abstract: A method of producing a fluororesin composition includes copolymerizing at least tetrafluoroethylene with hexafluoropropylene so that a melt flow rate at 372 degree C. of the copolymer formed in the copolymerization changes from 0.05-5.0 grams/10 minutes to 10-60 grams/10 minutes. The tetrafluoroethylene/hexafluoropropylene copolymer can be used as a coating on an electrical wire.Type: ApplicationFiled: April 3, 2013Publication date: September 5, 2013Applicants: Daikin Industries, Ltd., Daikin America, Inc.Inventors: Takahiro KITAHARA, Tadaharu ISAKA, Ryouichi FUKAGAWA, Keizou SHIOTSUKI
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Patent number: 7884148Abstract: The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions. The present invention is related to a resin composition comprising a fluororesin (A) and a filler (X) low in affinity for said fluororesin (A), wherein the filler (X) has a d99 value of not more than 15 ?m.Type: GrantFiled: March 5, 2007Date of Patent: February 8, 2011Assignee: Daikin Industries, Ltd.Inventors: Keizou Shiotsuki, Eiji Fujita, Tatsuya Higuchi, Shouji Fukuoka, Takahiro Taira
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Publication number: 20100314154Abstract: A tetrafluoroethylene/hexafluoropropylene copolymer has improved moldability in melt extrusion molding, especially with significant reduction of defects in high-speed extrusion coating of an electrical wire. The tetrafluoroethylene/hexafluoropropylene copolymer is obtained by polymerization of at least tetrafluoroethylene and hexafluoropropylene selected from the group consisting of tetrafluoroethylene, hexafluoropropylene and a third monomer without mixing with the resin which has the melting point with the difference of 20 degree C. and more from the melting point of the tetrafluoroethylene/hexafluoropropylene copolymer; and has a complex viscosity of from 2.0×I03 to 10.0×I03 Pa*s and a storage modulus of from 0.1 to 3.5 Pa*s in melt viscoelasticity measurement under the condition of atmosphere temperature of 310 degree C. and angular frequency of 0.01 radian/second. The tetrafluoroethylene/hexafluoropropylene copolymer can be used in an electrical wire as a coating on a conductive core.Type: ApplicationFiled: February 9, 2009Publication date: December 16, 2010Applicants: DAIKIN AMERICA, INC., DAIKIN INDUSTRIES, LTD.Inventors: Takahiro Kitahara, Tadaharu Isaka, Ryouichi Fukagawa, Keizou Shiotsuki
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Patent number: 7241826Abstract: The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions. The present invention is related to a resin composition comprising a fluororesin (A) and a filler (X) low in affinity for said fluororesin (A), wherein the filler (X) has a d99 value of not more than 15 ?m.Type: GrantFiled: June 26, 2002Date of Patent: July 10, 2007Assignee: Daikin Industries, Ltd.Inventors: Keizou Shiotsuki, Eiji Fujita, Tatsuya Higuchi, Shouji Fukuoka, Takahiro Taira
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Publication number: 20070149671Abstract: The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions. The present invention is related to a resin composition comprising a fluororesin (A) and a filler (X) low in affinity for said fluororesin (A), wherein the filler (X) has a d99 value of not more than 15 ?m.Type: ApplicationFiled: March 5, 2007Publication date: June 28, 2007Inventors: Keizou Shiotsuki, Eiji Fujita, Tatsuya Higuchi, Shouji Fukuoka, Takahiro Taira
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Publication number: 20040198886Abstract: The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions.Type: ApplicationFiled: May 25, 2004Publication date: October 7, 2004Inventors: Keizou Shiotsuki, Eiji Fujita, Tatsuya Higuchi, Shouji Fukuoka, Takahiro Taira