Patents by Inventor Keizou Shiotsuki

Keizou Shiotsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230391931
    Abstract: There is provided a copolymer containing tetrafluoroethylene unit and perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of perfluoro(propyl vinyl ether) unit of 4.2 to 4.9% by mass with respect to the whole of the monomer units, a melt flow rate at 372° C. of 19.0 to 27.0 g/10 min, and the number of functional groups of 50 or less per 106 main-chain carbon atoms.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Applicant: Daikin Industries, Ltd.
    Inventors: Tadaharu Isaka, Yumi Zenke, Yukari Yamamoto, Hayato Tsuda, Keizou Shiotsuki
  • Publication number: 20230395282
    Abstract: Provided is a coated electric wire having a core wire, and a coating layer installed on the periphery of the core wire, wherein the coating layer contains a copolymer containing tetrafluoroethylene unit and perfluoro(propyl vinyl ether) unit, the content of perfluoro(propyl vinyl ether) unit in the copolymer is 4.8 to 5.5% by mass with respect to the whole of the monomer units, the melt flow rate at 372° C. of the copolymer is 28.0 to 37.0 g/10 min, and the number of functional groups of the copolymer is 50 or less per 106 main-chain carbon atoms.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Applicant: DAIKIN INDUSTRIES, LTD
    Inventors: Tadaharu ISAKA, Yumi ZENKE, Yukari YAMAMOTO, Yasuyuki YAMAGUCHI, Keizou SHIOTSUKI
  • Publication number: 20230383033
    Abstract: There is provided a copolymer containing tetrafluoroethylene unit and perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of perfluoro(propyl vinyl ether) unit of 3.2 to 3.7% by mass with respect to the whole of the monomer units, the melt flow rate at 372° C. of 22.0 to 27.0 g/10 min, and the number of functional groups of 50 or less per 106 main-chain carbon atoms.
    Type: Application
    Filed: August 15, 2023
    Publication date: November 30, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yumi ZENKE, Tadaharu ISAKA, Yukari YAMAMOTO, Hayato TSUDA, Keizou SHIOTSUKI
  • Publication number: 20230235159
    Abstract: A copolymer containing tetrafluoroethylene unit and a perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of the perfluoro(propyl vinyl ether) unit of 2.8 to 3.5% by mass with respect to the whole of the monomer units, a melt flow rate of 31 to 38 g/10 min, and the number of functional groups of 50 or less per 106 main-chain carbon atoms, and the number of functional groups of —CF?CF2, —CF2H, —COF, —COOH, —COOCH3, —CONH2 and —CH2OH of 50 or less per 106 main-chain carbon atoms. Also disclosed is an injection molded article, a member to be compressed and a coated electric wire including the copolymer.
    Type: Application
    Filed: March 29, 2023
    Publication date: July 27, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Tadaharu Isaka, Yukari Yamamoto, Yumi Zenke, Hayato Tsuda, Keizou Shiotsuki
  • Publication number: 20230227594
    Abstract: A copolymer containing tetrafluoroethylene unit and a perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of the perfluoro(propyl vinyl ether) unit of 5.8 to 7.6% by mass with respect to the whole of the monomer units, a melt flow rate of 50 to 68 g/10 min, and the number of functional groups of —CF?CF2, —CF2H, —COF, —COOH, —COOCH3, —CONH2 and —CH2OH of 50 or less per 106 main-chain carbon atoms. Also disclosed is an injection molded article and member to be compressed containing the copolymer, and a coated electric wire including a coating layer containing the copolymer.
    Type: Application
    Filed: March 29, 2023
    Publication date: July 20, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yukari YAMAMOTO, Tadaharu Isaka, Yumi Zenke, Hayato Tsuda, Keizou Shiotsuki
  • Patent number: 11021556
    Abstract: Provided is a tetrafluoroethylene/hexafluoropropylene copolymer which is less likely to form a lump, or is less likely to form a large lump even if a lump is formed, during the formation of an electric wire. The tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate measured at 372° C. of 35.0 to 45.0 g/10 minutes and a swell of ?8.0% to 5.0%, the sum of the numbers of —CF2H groups and unstable end groups being 120 or less per 1×106 carbon atoms.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: June 1, 2021
    Assignees: DAIKIN INDUSTRIES, LTD., DAIKIN AMERICA, INC.
    Inventors: Tadaharu Isaka, Ryouichi Fukagawa, Takeshi Shimono, Keizou Shiotsuki
  • Publication number: 20200332037
    Abstract: An insulated communication wire comprising a conductive metal core wire and an insulative coating, which insulated communication wire may connect a computer with a peripheral device, and which insulated communication wire may be a data transmission cable or LAN cable.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Applicants: DAIKIN INDUSTRIES, LTD., DAIKIN AMERICA, INC.
    Inventors: Tadaharu ISAKA, Ryouichi Fukagawa, Takeshi Shimono, Keizou Shiotsuki
  • Publication number: 20190177453
    Abstract: Provided is a tetrafluoroethylene/hexafluoropropylene copolymer which is less likely to form a lump, or is less likely to form a large lump even if a lump is formed, during the formation of an electric wire. The tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate measured at 372° C. of 35.0 to 45.0 g/10 minutes and a swell of ?8.0% to 5.0%, the sum of the numbers of —CF2H groups and unstable end groups being 120 or less per 1×106 carbon atoms.
    Type: Application
    Filed: February 12, 2019
    Publication date: June 13, 2019
    Applicants: Daikin Industries, Ltd., Daikin America, Inc.
    Inventors: Tadaharu Isaka, Ryouichi Fukagawa, Takeshi Shimono, Keizou Shiotsuki
  • Publication number: 20170008986
    Abstract: Provided is a tetrafluoroethylene/hexafluoropropylene copolymer which is less likely to form a lump, or is less likely to form a large lump even if a lump is formed, during the formation of an electric wire. The tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate measured at 372° C. of 35.0 to 45.0 g/10 minutes and a swell of ?8.0% to 5.0%, the sum of the numbers of —CF2H groups and unstable end groups being 120 or less per 1×106 carbon atoms.
    Type: Application
    Filed: January 30, 2015
    Publication date: January 12, 2017
    Applicants: DAIKIN INDUSTRIES, LTD., DAIKIN AMERICA, INC.
    Inventors: Tadaharu ISAKA, Ryouichi FUKAGAWA, Takeshi SHIMONO, Keizou SHIOTSUKI
  • Patent number: 9012580
    Abstract: A tetrafluoroethylene/hexafluoropropylene copolymer has improved moldability in melt extrusion molding, especially with significant reduction of defects in high-speed extrusion coating of an electrical wire. The tetrafluoroethylene/hexafluoropropylene copolymer is obtained by polymerization of at least tetrafluoroethylene and hexafluoropropylene selected from the group consisting of tetrafluoroethylene, hexafluoropropylene and a third monomer without mixing with the resin which has the melting point with the difference of 20 degree C. and more from the melting point of the tetrafluoroethylene/hexafluoropropylene copolymer; and has a complex viscosity of from 2.0×I03 to 10.0×I03 Pa*s and a storage modulus of from 0.1 to 3.5 Pa*s in melt viscoelasticity measurement under the condition of atmosphere temperature of 310 degree C. and angular frequency of 0.01 radian/second. The tetrafluoroethylene/hexafluoropropylene copolymer can be used in an electrical wire as a coating on a conductive core.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: April 21, 2015
    Assignees: Daikin Industries, Ltd., Daikin America, Inc.
    Inventors: Takahiro Kitahara, Tadaharu Isaka, Ryouichi Fukagawa, Keizou Shiotsuki
  • Publication number: 20130230645
    Abstract: A method of producing a fluororesin composition includes copolymerizing at least tetrafluoroethylene with hexafluoropropylene so that a melt flow rate at 372 degree C. of the copolymer formed in the copolymerization changes from 0.05-5.0 grams/10 minutes to 10-60 grams/10 minutes. The tetrafluoroethylene/hexafluoropropylene copolymer can be used as a coating on an electrical wire.
    Type: Application
    Filed: April 3, 2013
    Publication date: September 5, 2013
    Applicants: Daikin Industries, Ltd., Daikin America, Inc.
    Inventors: Takahiro KITAHARA, Tadaharu ISAKA, Ryouichi FUKAGAWA, Keizou SHIOTSUKI
  • Patent number: 7884148
    Abstract: The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions. The present invention is related to a resin composition comprising a fluororesin (A) and a filler (X) low in affinity for said fluororesin (A), wherein the filler (X) has a d99 value of not more than 15 ?m.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: February 8, 2011
    Assignee: Daikin Industries, Ltd.
    Inventors: Keizou Shiotsuki, Eiji Fujita, Tatsuya Higuchi, Shouji Fukuoka, Takahiro Taira
  • Publication number: 20100314154
    Abstract: A tetrafluoroethylene/hexafluoropropylene copolymer has improved moldability in melt extrusion molding, especially with significant reduction of defects in high-speed extrusion coating of an electrical wire. The tetrafluoroethylene/hexafluoropropylene copolymer is obtained by polymerization of at least tetrafluoroethylene and hexafluoropropylene selected from the group consisting of tetrafluoroethylene, hexafluoropropylene and a third monomer without mixing with the resin which has the melting point with the difference of 20 degree C. and more from the melting point of the tetrafluoroethylene/hexafluoropropylene copolymer; and has a complex viscosity of from 2.0×I03 to 10.0×I03 Pa*s and a storage modulus of from 0.1 to 3.5 Pa*s in melt viscoelasticity measurement under the condition of atmosphere temperature of 310 degree C. and angular frequency of 0.01 radian/second. The tetrafluoroethylene/hexafluoropropylene copolymer can be used in an electrical wire as a coating on a conductive core.
    Type: Application
    Filed: February 9, 2009
    Publication date: December 16, 2010
    Applicants: DAIKIN AMERICA, INC., DAIKIN INDUSTRIES, LTD.
    Inventors: Takahiro Kitahara, Tadaharu Isaka, Ryouichi Fukagawa, Keizou Shiotsuki
  • Patent number: 7241826
    Abstract: The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions. The present invention is related to a resin composition comprising a fluororesin (A) and a filler (X) low in affinity for said fluororesin (A), wherein the filler (X) has a d99 value of not more than 15 ?m.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: July 10, 2007
    Assignee: Daikin Industries, Ltd.
    Inventors: Keizou Shiotsuki, Eiji Fujita, Tatsuya Higuchi, Shouji Fukuoka, Takahiro Taira
  • Publication number: 20070149671
    Abstract: The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions. The present invention is related to a resin composition comprising a fluororesin (A) and a filler (X) low in affinity for said fluororesin (A), wherein the filler (X) has a d99 value of not more than 15 ?m.
    Type: Application
    Filed: March 5, 2007
    Publication date: June 28, 2007
    Inventors: Keizou Shiotsuki, Eiji Fujita, Tatsuya Higuchi, Shouji Fukuoka, Takahiro Taira
  • Publication number: 20040198886
    Abstract: The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions.
    Type: Application
    Filed: May 25, 2004
    Publication date: October 7, 2004
    Inventors: Keizou Shiotsuki, Eiji Fujita, Tatsuya Higuchi, Shouji Fukuoka, Takahiro Taira