Abstract: A pyroelectric IR-sensor in which a pyroelectric light receiving element is mounted on a MID substrate or a ceramic substrate having a thermal conductivity less than 0.02 cal/cm.sec..degree.C. Both ends of the pyroelectric light receiving element are supported by the substrate, with the central portion of the pyroelectric light receiving element being spaced from the substrate. Chip parts are mounted on the substrate.

Abstract: A pyroelectric IR-sensor in which a pyroelectric light receiving element is mounted on a MID substrate or a ceramic substrate of which thermal conductivity is less than 0.02 cal/cm.sec..degree. C. in a manner that both end portions of the pyroelectric light receiving element are supported by the substrate with the central portion of the pyloelectric light receiving element being spaced from the substrate, and chip parts are further mounted on the substrate.

Abstract: A process for producing an optically active .alpha.-substituted organic acid represented by formula (II), comprising the steps of (a) treating a racemic substituted nitrile or amide represented by formula (I) with a microorganism selected from the group consisting of the microorganisms of genuses Alcaligenes, Pseudomonas, Rhodopseudomonas, Corynebacterium, Acinetobacter, Bacillus, Mycobacterium, Rhodococcus and Candida, or preparations thereof; and (b) recovering the resulting optically active u-substituted organic acid represented by formula (II): ##STR1## wherein R.sub.1 and R.sub.2 each represent a halogen atom, a hydroxyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted aryl group, a substituted or unsubstituted aryloxy group or a substituted or unsubstituted heterocyclic group with the proviso that R.sub.1 and R.sub.

Abstract: A pyroelectric IR-sensor in which a pyroelectric light receiving element is mounted on a MID substrate or a ceramic substrate having a thermal conductivity less than 0.02 cal/cm.multidot.sec.multidot..degree.C. Both ends of the pyroelectric light receiving element are supported by the substrate, with the central portion of the pyroelectric light receiving element being spaced from the substrate. Chip parts are mounted on the substrate.

Abstract: A bearingless hub structure for a rotary-wing aircraft is provided, the structure including a hub body adapted to be securely connected to a rotor mast, a plurality of flexible beam members provided integrally with the hub body to extend radially outwardly, a pitch housing encircling each of the flexible beam members, and having a radially outward end portion which is rigid with a radially inward end portion of a rotor blade, a spherical bearing positioned adjacent to a radially inward end portion of the flexible beam member for supporting the pitch housing, a lead-lag damper positioned between the flexible beam member and the pitch housing, and the flexible beam members each having a flexible plate portion which is of a low bending rigidity in a flapping direction, a flexible portion provided radially outwardly of the flexible plate portion having a low bending rigidity in the lead-lag direction, and a twist-flex portion provided radially outwardly of the flexible portion.

Abstract: A magnetic sensor includes magnetic sensor elements arrange on the upper surface of a bobbin and an input/output section provided on the lower surface of the bobbin wherein the magnetic sensor elements and the input/output section are connected through a wiring pattern formed on the bobbin by electroless plating.

Abstract: A stator for a variable resistor, manufactured by a step of preparing a heat resistant film of polyimide, a step of preparing a transfer sheet by providing a resistor film containing carbon powder and allyle resin, such as diallyl phthalate resin, on the heat resistant film, a step of preparing a lead terminal, a step of preparing a forming die having a cavity for forming a substrate, a step of locating the transfer sheet and the lead terminal in the forming die to expose at least a part of the resistor film in the cavity and position a part of the lead terminal in the cavity, a step of introducing allyle resin, such as diallyl phthalate resin, into the cavity to form a substrate joined with at least a part of the resistor film, in which substrate a part of the lead terminal is buried, and a step of separating the heat resistant film from the substrate to leave the resistor film.

Abstract: A process for preparing a 7-aminocephalosporanic acid compound which comprises treating a cephalosporin C compound with an enzyme-producing microorganism belonging to the genus Pseudomonas or a material obtained by subjecting the microorganism to chemical and/or physical treatment. A direct hydrolysis of the cephalosporin C compound into the 7-aminocephalosporanic acid compound and D-.alpha.-aminoadipic acid can be attained by the microorganism or material.