Patents by Inventor Keji CUI
Keji CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250141477Abstract: A common local oscillator chip, cascading structure, and method; the common local oscillator chip includes a local oscillator module, driving module, multiplexing matching network, local oscillator selection module, output matching network, and multiplexing transmission port.Type: ApplicationFiled: October 24, 2024Publication date: May 1, 2025Applicant: Airtouch Intelligent Technology (Shanghai) Co., Ltd.Inventors: Shuiyang LIN, Ying SONG, Keji CUI
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Publication number: 20250070816Abstract: The present disclosure relates to electronic devices and communication systems. One example electronic device includes a power divider array that includes a general input port and a plurality of branch output ports. The power divider array has a filter mode and a power splitter mode that are switchable. In the power splitter mode, the power divider array is configured to implement power distribution of a signal from the general input port to the plurality of branch output ports. In the filter mode, the power divider array is configured to filter a signal transmitted between the general input port and the plurality of branch output ports.Type: ApplicationFiled: November 8, 2024Publication date: February 27, 2025Inventors: Keji CUI, Peng GAO, Yongchang YU
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Publication number: 20240396504Abstract: This application provides a multi-band low noise amplifier, including: an input end, a first input matching network, a second input matching network, a first amplifier, and a second amplifier. The input end is coupled to an antenna and is configured to receive an inter-band carrier aggregation signal, where the inter-band carrier aggregation signal includes a first carrier signal located in a first band and a second carrier signal located in a second band, and the first band is different from and does not overlap the second band. The first input matching network is coupled between the input end and the first amplifier and is configured to perform impedance matching for the first carrier signal. The second input matching network is coupled between the input end and the second amplifier and is configured to perform impedance matching for the second carrier signal.Type: ApplicationFiled: May 22, 2023Publication date: November 28, 2024Inventors: Keji Cui, Di Li, Yongchang Yu
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Patent number: 12119797Abstract: This application provides example variable gain amplifiers and example phased array transceivers. One example variable gain amplifier includes an amplification circuit, configured to amplify an input signal; a control circuit, configured to control a gain of the amplification circuit by adjusting an output current of the amplification circuit; an inductive load, where the inductive load is coupled to a signal output end of the amplification circuit; and an inductive adjustment circuit, where the inductive adjustment circuit and the inductive load are inductively coupled, and where the inductive adjustment circuit is adjustable.Type: GrantFiled: September 30, 2021Date of Patent: October 15, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Keji Cui, Yongli Wang, Lei Lu
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Patent number: 12113559Abstract: A multi-band radio frequency front-end device, a multi-band receiver, and a multi-band transmitter, the multi-band radio frequency front-end device including a first radio frequency front-end circuit, where the first radio frequency front-end circuit works on a first band, a second radio frequency front-end circuit, where the second radio frequency front-end circuit works on a second band, a first input/output matching network, and a second input/output matching network, where routing of the first input/output matching network and routing of the second input/output matching network on a layout are annular and nested.Type: GrantFiled: May 11, 2023Date of Patent: October 8, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Keji Cui, Di Li, Lei Lu
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Publication number: 20240014843Abstract: The present disclosure relates to multi-chip apparatuses and electronic devices. One example multi-chip apparatus includes a first chip with a first internal signal generator and a first frequency multiplier, and a second chip with a second internal signal generator and a second frequency multiplier. The second frequency multiplier includes a first receiving circuit, a second receiving circuit, and a load circuit, where an input end of the first receiving circuit is coupled to an output end of the first internal signal generator, an input end of the second receiving circuit is coupled to an output end of the second internal signal generator, and an output end of the first receiving circuit and an output end of the second receiving circuit are coupled to an input end of the load circuit.Type: ApplicationFiled: September 21, 2023Publication date: January 11, 2024Inventors: Bowen DING, Keji CUI, Wanyi GUO
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Publication number: 20230344125Abstract: A phased array includes a local oscillator signal adjustment path, a first adder, a first power divider, and a plurality of radio-frequency signal transmit channels. An output end of the local oscillator signal adjustment path is coupled to a first input end of the first adder, and is configured to input a first signal to the first adder. A second input end of the first adder is coupled to a transmit path, and is configured to receive a second signal, and the first adder superimposes the first signal on the second signal to generate a to-be-transmitted signal. An input end of the first power divider is coupled to an output end of the first adder, an output end of the first power divider is coupled to input ends of the plurality of radio-frequency signal transmit channels.Type: ApplicationFiled: June 30, 2023Publication date: October 26, 2023Inventors: Keji Cui, Di Li, Peng Gao, Yongchang Yu
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Publication number: 20230283307Abstract: A multi-band radio frequency front-end device, a multi-band receiver, and a multi-band transmitter, the multi-band radio frequency front-end device including a first radio frequency front-end circuit, where the first radio frequency front-end circuit works on a first band, a second radio frequency front-end circuit, where the second radio frequency front-end circuit works on a second band, a first input/output matching network, and a second input/output matching network, where routing of the first input/output matching network and routing of the second input/output matching network on a layout are annular and nested.Type: ApplicationFiled: May 11, 2023Publication date: September 7, 2023Inventors: Keji Cui, Di Li, Lei Lu
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Publication number: 20230238701Abstract: Example multi-band phased array are described. One example multi-band phased array includes a plurality of branches coupled to a plurality of multi-band antennas. Each of the plurality of branches includes a low noise amplifier and a power amplifier. The power amplifier and the low noise amplifier are configured to transmit and receive, in a time-sharing manner, a signal of a first frequency band and a signal of a second frequency band that are received by the multi-band phased array, and the first frequency band and the second frequency band are different and do not overlap. Each of the plurality of branches further includes a phase shifter, where the phase shifter is configured to perform phase shifting on the signal of the first frequency band, and the phase shifter is further configured to perform phase shifting on the signal of the second frequency band.Type: ApplicationFiled: March 30, 2023Publication date: July 27, 2023Inventors: Keji CUI, Tianyu SHEN, Yongchang YU
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Patent number: 11683054Abstract: A multi-band radio frequency front-end device, a multi-band receiver, and a multi-band transmitter, the multi-band radio frequency front-end device including a first radio frequency front-end circuit, where the first radio frequency front-end circuit works on a first band, a second radio frequency front-end circuit, where the second radio frequency front-end circuit works on a second band, a first input/output matching network, and a second input/output matching network, where routing of the first input/output matching network and routing of the second input/output matching network on a layout are annular and nested.Type: GrantFiled: June 28, 2021Date of Patent: June 20, 2023Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Keji Cui, Di Li, Lei Lu
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Publication number: 20230090113Abstract: A radio-frequency chip is provided, and relates to the field of chip technologies, to reduce a component loss caused by redundant components in the radio-frequency chip. The radio-frequency chip includes a phased array, the phased array includes a plurality of branches, and each of the plurality of branches includes a transmitting path, a receiving path, a common path, and a phase shifter. The phase shifter includes a first phase shift unit, a second phase shift unit, and a third phase shift unit. The first phase shift unit is located on the transmitting path, the second phase shift unit is located on the receiving path, and the third phase shift unit is located on the common path.Type: ApplicationFiled: November 28, 2022Publication date: March 23, 2023Inventors: Yong Huang, Keji Cui, Lei Lu
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Publication number: 20220416835Abstract: A transceiver includes a package substrate and a die, and a transceiver switch is disposed in the transceiver. The transceiver switch includes an antenna feedpoint, a transmit feedpoint and a receive feedpoint that are coupled to the antenna feedpoint, and a first metal connection line disposed on the package substrate, and the antenna feedpoint and the receive feedpoint are disposed at two ends of the first metal connection line. The transceiver switch further includes a first switch, a transmit pad, and a receive pad that are disposed on the die, a first terminal of the first switch is coupled to the receive pad, a second terminal of the first switch is coupled to a ground terminal of the die, the receive pad is coupled to the receive feedpoint, and the transmit pad is coupled to the transmit feedpoint.Type: ApplicationFiled: September 2, 2022Publication date: December 29, 2022Inventors: Di Li, Keji Cui, Kefeng Han, Lei Lu
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Patent number: 11533031Abstract: Amplifiers, amplification circuits, and phase shifters, for example, for flexibly adjusting an output phase to thereby meet a requirement of a constant phase on a link in a communications field, are provided. In one aspect, an amplifier includes first, second, and third MOS transistors. The first MOS transistor includes a gate separately coupled to a signal input end and a bias voltage input end, a source coupled to a power supply, and a drain separately coupled to sources of the second and third MOS transistors. A drain of the third MOS transistor is coupled to a ground, and a drain of the second MOS transistor is coupled to a signal output end. The bias voltage input end is configured to receive a bias voltage to adjust a phase difference between an input signal at the signal input end and an output signal at the signal output end.Type: GrantFiled: September 29, 2020Date of Patent: December 20, 2022Assignee: Huawei Technologies Co., Ltd.Inventors: Keji Cui, Yongli Wang, Lei Lu
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Publication number: 20220021363Abstract: This application provides a variable gain amplifier and a phased array transceiver, to enable the variable gain amplifier to keep a phase constant when switching a gain, and to enable a gain step to be stable with a frequency. The variable gain amplifier includes an amplification circuit, configured to amplify an input signal; a control circuit, configured to control a gain of the amplification circuit by adjusting an output current of the amplification circuit; and an inductive load and an inductive adjustment circuit, where the inductive load is coupled to a signal output end of the amplification circuit, the inductive adjustment circuit and the inductive load are inductively coupled, and the inductive adjustment circuit is adjustable.Type: ApplicationFiled: September 30, 2021Publication date: January 20, 2022Inventors: Keji CUI, Yongli WANG, Lei LU
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Publication number: 20210328606Abstract: A multi-band radio frequency front-end device, a multi-band receiver, and a multi-band transmitter, the multi-band radio frequency front-end device including a first radio frequency front-end circuit, where the first radio frequency front-end circuit works on a first band, a second radio frequency front-end circuit, where the second radio frequency front-end circuit works on a second band, a first input/output matching network, and a second input/output matching network, where routing of the first input/output matching network and routing of the second input/output matching network on a layout are annular and nested.Type: ApplicationFiled: June 28, 2021Publication date: October 21, 2021Inventors: Keji Cui, Di Li, Lei Lu
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Publication number: 20210013850Abstract: Amplifiers, amplification circuits, and phase shifters, for example, for flexibly adjusting an output phase to thereby meet a requirement of a constant phase on a link in a communications field, are provided. In one aspect, an amplifier includes first, second, and third MOS transistors. The first MOS transistor includes a gate separately coupled to a signal input end and a bias voltage input end, a source coupled to a power supply, and a drain separately coupled to sources of the second and third MOS transistors. A drain of the third MOS transistor is coupled to a ground, and a drain of the second MOS transistor is coupled to a signal output end. The bias voltage input end is configured to receive a bias voltage to adjust a phase difference between an input signal at the signal input end and an output signal at the signal output end.Type: ApplicationFiled: September 29, 2020Publication date: January 14, 2021Inventors: Keji CUI, Yongli WANG, Lei LU