Patents by Inventor Kejian Chen

Kejian Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240138406
    Abstract: An antimicrobial peptide Scyampcin44-63, a formula of the antimicrobial peptide Scyampcin44-63 is C113H188N30O24S2, and an amino acid sequence of the antimicrobial peptide Scyampcin44-63 is SEQ ID NO: 01 with the C-terminus being amidated.
    Type: Application
    Filed: December 28, 2023
    Publication date: May 2, 2024
    Inventors: Kejian WANG, Ying ZHOU, Fangyi CHEN
  • Publication number: 20220023575
    Abstract: The present disclosure provides a breathing assist device for use in a mask. The breathing assist device may include an air pump, a connecting tube, and a fixing member. A first end of the connecting tube may be disposed on an inner surface of the mask by the fixing member, and a second end of the connecting tube may be connected to the air pump.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 27, 2022
    Applicant: OCEAN STAR PROMOTIONS INC.
    Inventor: Kejian CHEN
  • Patent number: 10815627
    Abstract: A method for improving the seismic performance of bridges by utilizing the beam body and an energy dissipation and seismic mitigation bridge bearing, which can effectively eliminate the harmful vibration of the bridge pier in the inherent frequency band, thus reducing the stress of the pier body and improving the seismic performance of the bridge pier without introducing external additional mass and looking for an installation space on the pier. The method includes the following steps: obtain the natural frequency fi, the equivalent modal mass Mi and the modal stiffness Ki of the pier in the longitudinal or transverse direction by numerical modal analysis or experimental modal test; determine the mass mi of the beam body; calculate the connection stiffness ki and the connection damping ci between the beam body and the pier; select the bearing system with above connection stiffness ki and the connection damping ci.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: October 27, 2020
    Assignee: CHINA RAILWAY ERYUAN ENGINEERING GROUP CO., LTD.
    Inventors: Jizhong Yang, Lie Chen, Kejian Chen, Yingliang Wang, Yinguang Xu, Wanming Zhai, Yongxing Wei, Mingjun Liu, Chengbiao Cai, Yongping Zeng, Xiaolong Zhen, Ming Yuan, Lihui You, Dubei Feng, Zhigang Yuan
  • Publication number: 20190194883
    Abstract: A method for improving the seismic performance of bridges by utilizing the beam body and an energy dissipation and seismic mitigation bridge bearing, which can effectively eliminate the harmful vibration of the bridge pier in the inherent frequency band, thus reducing the stress of the pier body and improving the seismic performance of the bridge pier without introducing external additional mass and looking for an installation space on the pier. The method includes the following steps: obtain the natural frequency fi, the equivalent modal mass Mi and the modal stiffness Ki of the pier in the longitudinal or transverse direction by numerical modal analysis or experimental modal test; determine the mass mi of the beam body; calculate the connection stiffness ki and the connection damping ci between the beam body and the pier; select the bearing system with above connection stiffness ki and the connection damping ci.
    Type: Application
    Filed: August 23, 2017
    Publication date: June 27, 2019
    Applicant: CHINA RAILWAY ERYUAN ENGINEERING GROUP CO.,LTD
    Inventors: Jizhong YANG, Lie CHEN, Kejian CHEN, Yingliang WANG, Yinguang XU, Wanming ZHAI, Yongxing WEI, Mingjun LIU, Chengbiao CAI, Yongping ZENG, Xiaolong ZHEN, Ming YUAN, Lihui YOU, Dubei FENG, Zhigang YUAN
  • Patent number: 6883908
    Abstract: Methods, systems, and compositions that make it possible to form high resolution, pressure sensitive adhesive patterns or films on a wide range of substrates. The compositions generally incorporate a curable, fluid composition (i.e., pressure sensitive adhesive precursor). When cured, a pressure sensitive adhesive is formed. Ink jet printing and subsequent curing allows pressure sensitive adhesive features to be formed with high resolution and tremendous flexibility in the patterns by which adhesive features may be formed. Preferred embodiments of the invention incorporate rheology modifying agents that can be used to promote favorable dot gain and other printing characteristics, the ability to build print thickness, and mechanical properties of resultant cured adhesives.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: April 26, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: James K. Young, Brant U. Kolb, Albert I. Everaerts, Kevin M. Eliason, Diana M. Eitzman, Kejian Chen, John P. Banovetz, Gregory J. Anderson
  • Publication number: 20040247654
    Abstract: A hydrophilic, pressure-sensitive adhesive composition comprising a swellable adhesive polymer, a swelling agent, herbal medicines, and optionally a modifying polymer in an amount sufficient to form a cohesive, pressure-sensitive adhesive composition. The composition is useful as a delivery device for herbal medicine and other active ingredients to or through skin. A method of preparation of the composition is also disclosed.
    Type: Application
    Filed: June 5, 2003
    Publication date: December 9, 2004
    Applicant: 3M Innovative Properties Company
    Inventors: Robert A. Asmus, Kejian Chen, JingJing Ma
  • Publication number: 20020128340
    Abstract: Methods, systems, and compositions that make it possible to form high resolution, pressure sensitive adhesive patterns or films on a wide range of substrates. The compositions generally incorporate a curable, fluid composition (i.e., pressure sensitive adhesive precursor). When cured, a pressure sensitive adhesive is formed. Ink jet printing and subsequent curing allows pressure sensitive adhesive features to be formed with high resolution and tremendous flexibility in the patterns by which adhesive features may be formed. Preferred embodiments of the invention incorporate rheology modifying agents that can be used to promote favorable dot gain and other printing characteristics, the ability to build print thickness, and mechanical properties of resultant cured adhesives.
    Type: Application
    Filed: January 8, 2001
    Publication date: September 12, 2002
    Inventors: James K. Young, Brant U. Kolb, Albert I. Everaerts, Kevin M. Eliason, Diana M. Eitzman, Kejian Chen, John P. Banovetz, Gregory J. Anderson
  • Patent number: 5902836
    Abstract: Solute polymers in solvent monomers form a coatable syrup that can be cured to a viscoelastomeric material when radiation-sensitive .alpha.-cleaving groups in either the polymer or one of the monomers are exposed to ultraviolet radiation. The solute polymers can be formed from the solvent monomers in situ or be added thereto to form the syrup.
    Type: Grant
    Filed: August 23, 1995
    Date of Patent: May 11, 1999
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Greggory S. Bennett, Gaddam N. Babu, Kejian Chen, Louis E. Winslow, George F. Vesley, Patrick G. Zimmerman
  • Patent number: 5825526
    Abstract: A tape that includes an electronically conductive flexible substrate, a release layer, and an adhesive comprising an ion-intercalating material, and electrochromic devices and glazing units prepared using this tape.
    Type: Grant
    Filed: April 24, 1996
    Date of Patent: October 20, 1998
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Silvia L. Bommarito, Kejian Chen, Peter F. Cullen, L. Charles Hardy, Paul S. Lugg
  • Patent number: 5593795
    Abstract: Electrolyte compositions in which a salt is disposed in a thiol-ene matrix. The compositions retain their shape under operating conditions and exhibit an ionic conductivity of at least 1.times.10.sup.-6 when measured in the absence of solvent at 25.degree. C.
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: January 14, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Kejian Chen, Haitao Huang
  • Patent number: 5506279
    Abstract: The invention provides novel acrylamide functional disubstituted acetyl aryl ketones and a process for their preparation in high yields uncontaminated by difunctional material. The invention further provides photocrosslinkable compositions comprising one or more ethylenically-unsaturated monomers and as photoinitiator the acrylamide functional disubstituted acetyl aryl ketone of the invention. The compositions are useful for the preparation of films and coatings, particularly pressure-sensitive adhesive coatings.
    Type: Grant
    Filed: May 3, 1994
    Date of Patent: April 9, 1996
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Gaddam N. Babu, Greggory S. Bennett, Kejian Chen, Steven M. Heilmann, Howell K. Smith, II, Louis E. Winslow