Patents by Inventor Keju JI

Keju JI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11478976
    Abstract: A flat-pressing manufacturing method of a bionic adhesive structure based on a micro through-hole nickel-based mold is disclosed. The method includes the following steps: preparing a nickel-based mold with a micro through-hole array; placing the nickel-based mold on an elastic pad in a magnetic mold closing system; coating a liquid prepolymer uniformly on a backing, and placing a side of the backing coated with the liquid prepolymer on the nickel-based mold, covering a sealing diaphragm on the backing to separate a cavity into an upper chamber and a lower chamber, and performing a vacuum treatment on the lower chamber and an inflation treatment on the upper chamber to apply a uniform pressure on the backing layer and achieve a full filling of prepolymers with different viscosities; and after the filling is completed, curing and demolding to obtain the bionic adhesive structure.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: October 25, 2022
    Assignees: NANJING ADHESION TECHNOLOGY CO., LTD, NANJING LI-HANG INDUSTRY INSTITUTE OF BIONIC TECHNOLOGY LIMITED COMPANY
    Inventors: Keju Ji, Zhendong Dai, Chunxia Zhao, Yiqiang Tang, Peiyun Gan, Yuanhua Qiao
  • Patent number: 11254566
    Abstract: A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: February 22, 2022
    Assignees: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS, NANJING LI-HANG INDUSTRY INSTITUTE OF BIONIC TECHNOLOGY LIMITED COMPANY
    Inventors: Zhendong Dai, Keju Ji, Enhua Cui, Jian Chen, Cong Yuan, Yiqiang Tang
  • Publication number: 20220048239
    Abstract: A flat-pressing manufacturing method of a bionic adhesive structure based on a micro through-hole nickel-based mold is disclosed. The method includes the following steps: preparing a nickel-based mold with a micro through-hole array; placing the nickel-based mold on an elastic pad in a magnetic mold closing system; coating a liquid prepolymer uniformly on a backing, and placing a side of the backing coated with the liquid prepolymer on the nickel-based mold, covering a sealing diaphragm on the backing to separate a cavity into an upper chamber and a lower chamber, and performing a vacuum treatment on the lower chamber and an inflation treatment on the upper chamber to apply a uniform pressure on the backing layer and achieve a full filling of prepolymers with different viscosities; and after the filling is completed, curing and demolding to obtain the bionic adhesive structure.
    Type: Application
    Filed: April 22, 2021
    Publication date: February 17, 2022
    Applicants: Nanjing Adhesion Technology Co., Ltd, Nanjing Li-Hang Industry Institute of Bionic Technology Limited Company
    Inventors: Keju JI, Zhendong DAI, Chunxia ZHAO, Yiqiang TANG, Peiyun GAN, Yuanhua QIAO
  • Publication number: 20210261405
    Abstract: A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.
    Type: Application
    Filed: June 11, 2020
    Publication date: August 26, 2021
    Applicants: Nanjing University of Aeronautics and Astronautics, Nanjing Li-Hang Industry Institute of Bionic Technology Limited Company
    Inventors: Zhendong DAI, Keju JI, Enhua CUI, Jian CHEN, Cong YUAN, Yiqiang TANG