Abstract: An oxaspiro substituted pyrrolopyrazole derivative, an intermediate thereof, and a preparation method therefor.

Abstract: The present invention relates to a novel white light LED packaging structure and a process for manufacturing the same. An anti-blue light reflection film(s) is deposited on one surface of a fluorescent wafer, wherein the surface is attached to a blue-emitting chip. The anti-blue light reflection film(s) on the wafer can effectively prevent the incident blue light from reflecting on the surface of the wafer, increase the availability of the blue light and reduce the reflection loss of yellowish green light in the direction towards the chip, and thereby improving the whole luminous efficacy of the device. The white light LED packaging structure of the present invention has high fluorescence efficiency, and is suitable for applying in high-power white light LED illumination field.

Abstract: The present invention relates to a white light LED lamp and a filament. The white light LED filament comprises light emitting units and a strip-shaped fluorescent wafer(s) at least positioned at one side of the light emitting units, wherein the light emitting units are blue-emitting chips connected by a metal wire or an electric conductive circuit, and wherein electrodes are arranged at the end(s) of the fluorescent wafer. Without any lens, the filament of the present invention has a simple structure. A white light LED lamp using the filament realizes a 360° stereo-luminescence, and shows the advantages of low cost, excellent heat radiation, high luminous efficacy and so on.

Abstract: The invention discloses a composite structure based on a Ce:YAG wafer, comprising the Ce:YAG wafer and a red light emitting layer fixed on the Ce:YAG wafer. The invention further discloses a manufacturing method of the composite structure based on a Ce:YAG wafer, through which a composite optical structure capable of emitting light ranging from green light to red light is formed. The composite optical structure can be widely applied in the fields of detection equipment and illumination devices.

Abstract: The present invention discloses an embedded white light LED package structure based on a solid-state fluorescence material. In the present invention, the high power blue light chip is directly embedded into and bonded with a groove of the solid-state fluorescence material, and blue light emitted by the chip and yellow and green light obtained by conversion and emitted by the solid-state fluorescence material are blended by using the principle of lenses, to obtain white light. The embedded white light LED package structure based on a solid-state fluorescence material has a simple process, low cost, and high fluorescence efficiency; and blue light does not leak. Heat dissipation can be directly performed by using the solid-state fluorescence material, and heat dissipation performance is desirable. Energy conservation and environmental protection is achieved, and a service life of an LED lighting device is greatly improved.

Abstract: The present invention discloses an embedded white light LED package structure based on a solid-state fluorescence material. In the present invention, the high power blue light chip is directly embedded into and bonded with a groove of the solid-state fluorescence material, and blue light emitted by the chip and yellow and green light obtained by conversion and emitted by the solid-state fluorescence material are blended by using the principle of lenses, to obtain white light. The embedded white light LED package structure based on a solid-state fluorescence material has a simple process, low cost, and high fluorescence efficiency; and blue light does not leak. Heat dissipation can be directly performed by using the solid-state fluorescence material, and heat dissipation performance is desirable. Energy conservation and environmental protection is achieved, and a service life of an LED lighting device is greatly improved.