Patents by Inventor Kejun WANG

Kejun WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240027178
    Abstract: The invention discloses a microcrack-based strain sensing element and a preparation method and use thereof. The microcrack-based strain sensing element includes a substrate layer, a metal film, a protective layer, an output electrode, and a packaging layer. The metal film is arranged on the substrate layer. The metal film is formed by deposition of two metal materials. The metal film is provided with a patterned crack structure. The protective layer is arranged on the metal film. The output electrode is connected to the metal film for outputting an electrical signal. The packaging layer is arranged on the protective layer. Compared with existing crack preparation technologies, the preparation method of the microcrack-based strain sensing element of the invention has higher-precision crack controllability, does not affect the service life of cracks, and achieves more optimized actual operation.
    Type: Application
    Filed: August 10, 2021
    Publication date: January 25, 2024
    Inventors: Qian WANG, Zezhong LU, Kejun WANG, Lei GAO, Cheng FAN, Lei ZHANG
  • Publication number: 20240018603
    Abstract: The present disclosure relates to a molecular marker of the IGF2BP1 gene related to a chicken body size trait and the use thereof, and a genetic improvement method. In the present disclosure, it is found by means of gene association analysis that a deletion mutation in a promoter region of the IGF2BP1 gene of chicken is significantly associated with the chicken body size trait.
    Type: Application
    Filed: October 3, 2023
    Publication date: January 18, 2024
    Applicant: HENAN AGRICULTURAL UNIVERSITY
    Inventors: Xiangtao KANG, Wenting LI, Kejun WANG, Yadong TIAN, Guirong SUN, Ruili HAN, Ruirui JIANG, Donghua LI, Guoxi LI, Zhuanjian LI, Xiaojun LIU, Hong LI
  • Patent number: 11705893
    Abstract: A latch circuit includes a latch module, a set control module, a reset control module and a clock module, wherein the latch module is employed for latching data input by a data module, the set control module is employed for controlling the latch module to output a high-level signal, the reset control module is employed for controlling the latch module to output a low-level signal, and the clock module is employed for providing a readout clock signal to the latch module.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: July 18, 2023
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventor: KeJun Wang
  • Patent number: 11587641
    Abstract: A fuse fault repair circuit includes a fuse array, a signal storage module, and a scan repair module. The fuse array includes a redundant fuse array and a non-redundant fuse array. When the fuse array is not faulty, the redundant fuse array has no signal output, and the non-redundant fuse array outputs S first logic signals. Each storage unit in the signal storage module is configured to store a first logic signal sent by one fuse unit connected thereto. The scan repair module is configured to scan the storage units in the signal storage module, determine, when a faulty storage unit is scanned, that a first fuse unit connected to the faulty storage unit is faulty, and replace the first fuse unit with a first redundant fuse unit corresponding to the first fuse unit. The first logic signal corresponding to the first redundant fuse unit is a normal signal.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: February 21, 2023
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventor: Kejun Wang
  • Publication number: 20230034171
    Abstract: A latch circuit includes a latch module, a set control module, a reset control module and a clock module, wherein the latch module is employed for latching data input by a data module, the set control module is employed for controlling the latch module to output a high-level signal, the reset control module is employed for controlling the latch module to output a low-level signal, and the clock module is employed for providing a readout clock signal to the latch module.
    Type: Application
    Filed: March 9, 2021
    Publication date: February 2, 2023
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventor: KeJun WANG
  • Publication number: 20220331928
    Abstract: Disclosed is a device for polishing an intraocular lens by using an electrorheological effect. The device comprises a supporting plate (14), an electric motor (16), a conductive slip ring (18), an outer sleeve (20), a tool shaft (22), a connecting flange (24), an annular electrode (26) and a tool needle (28). The electric motor (16), an outer ring of the conductive slip ring (18), and the outer sleeve (20) are all installed on the supporting plate (14). The electric motor (16) drives the tool shaft (22) to rotate by means of a transmission assembly. One end of the tool shaft (22) is closely fitted with an inner ring of the conductive slip ring (18), and the other end of the tool shaft extends into the outer sleeve (20). The connecting flange (24) is installed on the outer sleeve (20). The annular electrode (26) is connected to the connecting flange (24). One end of the tool needle (28) is connected to the tool shaft (22), and the other end of the tool needle extends out of the annular electrode (26).
    Type: Application
    Filed: October 13, 2020
    Publication date: October 20, 2022
    Inventors: Cheng Fan, Lei Zhang, Yucheng Xue, Qian Wang, Kejun Wang
  • Patent number: 11472157
    Abstract: A bionic flexible actuator with a real-time feedback function and a preparation method thereof. The method includes: preparing stimuli-response layer and bionic flexible strain-sensor film layer, arranging bionic V-shaped groove array structure on bionic flexible strain-sensor film layer, and sticking bionic flexible strain-sensor film layer onto stimuli-response layer through adhesive layer; stimuli-response layer is prepared by adopting following steps: mixing multi-walled carbon nanotubes and polyvinylidene fluoride after being dissolved in a solvent respectively and obtaining a mixed solution; performing a film formation process to mixed solution and embedding a first electrode to obtain stimuli-response layer.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: October 18, 2022
    Assignee: JILIN UNIVERSITY
    Inventors: Zhiwu Han, Linpeng Liu, Junqiu Zhang, Dakai Wang, Tao Sun, Kejun Wang, Shichao Niu, Tao Hou
  • Patent number: 11456409
    Abstract: A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 27, 2022
    Assignee: JILIN UNIVERSITY
    Inventors: Zhiwu Han, Kejun Wang, Honglie Song, Junqiu Zhang, Daobing Chen, Linpeng Liu, Binjie Zhang, Tao Sun, Dakai Wang, Changchao Zhang
  • Publication number: 20220277803
    Abstract: A fuse fault repair circuit includes a fuse array, a signal storage module, and a scan repair module. The fuse array includes a redundant fuse array and a non-redundant fuse array. When the fuse array is not faulty, the redundant fuse array has no signal output, and the non-redundant fuse array outputs S first logic signals. Each storage unit in the signal storage module is configured to store a first logic signal sent by one fuse unit connected thereto. The scan repair module is configured to scan the storage units in the signal storage module, determine, when a faulty storage unit is scanned, that a first fuse unit connected to the faulty storage unit is faulty, and replace the first fuse unit with a first redundant fuse unit corresponding to the first fuse unit. The first logic signal corresponding to the first redundant fuse unit is a normal signal.
    Type: Application
    Filed: October 11, 2021
    Publication date: September 1, 2022
    Inventor: Kejun WANG
  • Publication number: 20210207939
    Abstract: A bionic flexible actuator with a real-time feedback function and a preparation method thereof. The method includes: preparing stimuli-response layer and bionic flexible strain-sensor film layer, arranging bionic V-shaped groove array structure on bionic flexible strain-sensor film layer, and sticking bionic flexible strain-sensor film layer onto stimuli-response layer through adhesive layer; stimuli-response layer is prepared by adopting following steps: mixing multi-walled carbon nanotubes and polyvinylidene fluoride after being dissolved in a solvent respectively and obtaining a mixed solution; performing a film formation process to mixed solution and embedding a first electrode to obtain stimuli-response layer.
    Type: Application
    Filed: October 30, 2019
    Publication date: July 8, 2021
    Applicant: JILIN UNIVERSITY
    Inventors: Zhiwu HAN, Linpeng LIU, Junqiu ZHANG, Dakai WANG, Tao SUN, Kejun WANG, Shichao NIU, Tao HOU
  • Publication number: 20210175411
    Abstract: A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
    Type: Application
    Filed: October 31, 2019
    Publication date: June 10, 2021
    Applicant: JILIN UNIVERSITY
    Inventors: Zhiwu HAN, Kejun WANG, Honglie SONG, Junqiu ZHANG, Daobing CHEN, Linpeng LIU, Binjie ZHANG, Tao SUN, Dakai WANG, Changchao ZHANG