Abstract: Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.

Abstract: Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.

Abstract: Three-dimensional meshes and three-dimensional casings for thermal ground planes are disclosed. These three-dimensional meshes and three-dimensional casings can create a vapor core that has structural resiliency positive or negative pressure differential between the vapor space and external conditions. A thermal ground plane is disclosed that includes a first casing that is substantially planar and a second casing. The outer periphery of the first casing and the outer periphery of the second casing are bonded together to form a hermetic seal. The second casing may be deformed to create a vapor support structure within the thermal ground plane that includes a plurality of deformed portions (or rough pillars). A working fluid may be disposed within the first casing and the second casing. Permeable wicks may also be disposed on an inner surface of the first casing and/or the second casing for liquid transport that is disposed between the first casing and the second casing.

Abstract: Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.

Abstract: A phone case with a phone case body and a thermal ground plane is disclosed. The phone case, for example, may include fin that folds, bends, and/or extends outward from the phone case body. The phone case, for example, may include a magnetic area that comprises a toroid or donut shape. The phone case, for example, may include an aperture that extends through the phone case body and/or the thermal ground plane. The thermal ground plane may include a first casing; a liquid transport layer comprising a mesh or an array of pillars; a vapor transport layer comprising a mesh or an array of pillars; and a second casing, an outer periphery of the first casing and an outer periphery of the second casing are sealed together encasing the liquid transport layer, the vapor transport layer, and a heat transfer fluid.

Abstract: Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.