Patents by Inventor Kellie Susanne Jensen

Kellie Susanne Jensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240051292
    Abstract: In some examples, a fluidic die includes fluidic actuators, switches, and electrically conductive lines in an electrically conductive layer of the fluidic die. The electrically conductive lines electrically connect the switches to respective actuators. A first dimension of a first electrically conductive line is different from a second dimension of a second electrically conductive line to match a first resistance of the first electrically conductive line having a first length to a second resistance of the second electrically conductive line having a second length different from the first length.
    Type: Application
    Filed: January 11, 2021
    Publication date: February 15, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Vincent C. KORTHUIS, Rogelio CICILI, Eric T. MARTIN, Kellie Susanne JENSEN, James R. PRZYBYLA
  • Patent number: 11225070
    Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stan E. Leigh, Kellie Susanne Jensen, Terry McMahon, Donald W. Schulte
  • Publication number: 20210170746
    Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.
    Type: Application
    Filed: January 23, 2018
    Publication date: June 10, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Stan E. Leigh, Kellie Susanne Jensen, Terry McMahon, Donald W. Schulte
  • Patent number: 10005282
    Abstract: Fluid ejection devices with particle tolerant thin-film extensions are disclosed. An example apparatus includes a printer; a reservoir; and a printhead including: a firing chamber; a channel to receive fluid from the reservoir, the channel is coupled to the firing chamber, the channel having an opening; and a particle-tolerant film disposed adjacent the opening of the channel, the particle-tolerant film disposed between the channel and the reservoir, the particle-tolerant film to deter particles within the fluid from settling in an area adjacent the opening.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: June 26, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Kellie Susanne Jensen
  • Patent number: 9498953
    Abstract: A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: November 22, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Anthony M. Fuller, Rio Rivas, Kellie Susanne Jensen
  • Patent number: 9352568
    Abstract: In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate, a chamber layer formed over the thin-film layer, the chamber layer defining a fluidic channel that leads to a firing chamber, a slot extending through the substrate and into the chamber layer through an ink feed hole in the thin-film layer, and a particle tolerant thin-film extension of the thin-film layer that protrudes into the slot from between the substrate and the chamber layer.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: May 31, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Rio Rivas, Ed Friesen, Kellie Susanne Jensen
  • Publication number: 20160082732
    Abstract: Fluid ejection devices with particle tolerant thin-film extensions are disclosed. An example apparatus includes a printer; a reservoir; and a printhead including: a firing chamber; a channel to receive fluid from the reservoir, the channel is coupled to the firing chamber, the channel having an opening; and a particle-tolerant film disposed adjacent the opening of the channel, the particle-tolerant film disposed between the channel and the reservoir, the particle-tolerant film to deter particles within the fluid from settling in an area adjacent the opening.
    Type: Application
    Filed: December 3, 2015
    Publication date: March 24, 2016
    Inventors: Rio Rivas, Ed Friesen, Kellie Susanne Jensen
  • Publication number: 20150352843
    Abstract: A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.
    Type: Application
    Filed: January 23, 2013
    Publication date: December 10, 2015
    Inventors: Anthony M. Fuller, Rio Rivas, Kellie Susanne Jensen
  • Publication number: 20150124024
    Abstract: In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate, a chamber layer formed over the thin-film layer, the chamber layer defining a fluidic channel that leads to a firing chamber, a slot extending through the substrate and into the chamber layer through an ink feed hole in the thin-film layer, and a particle tolerant thin-film extension of the thin-film layer that protrudes into the slot from between the substrate and the chamber layer.
    Type: Application
    Filed: July 24, 2012
    Publication date: May 7, 2015
    Inventors: Rio Rivas, Ed Friesen, Kellie Susanne Jensen
  • Publication number: 20140285576
    Abstract: In one example, a printhead structure includes a cover covering an underlying structure. The cover and the underlying structure define multiple chambers from which fluid may be dispensed through nozzles in the cover and the cover has a stepped edge profile along at least part of the perimeter of the cover.
    Type: Application
    Filed: March 22, 2013
    Publication date: September 25, 2014
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.
    Inventors: Rio Rivas, Kellie Susanne Jensen, T. Stafford Johnson