Abstract: An applicator die for crimping open loop type terminals to wire leads comprising applicator housing, a plurality of blades and a plurality of housing. An applicator housing is provided which is extended or retracted vertically in response to an applicator force applied thereto. An insulation blade housing with an insulation blade and a core blade housing, with a core blade are movingly disposed inside the applicator housing. Prior to a crimping operation, the applicator housing is retracted and a terminal is moved into position and aligned with the insulation and core blades. A lead wire is also positioned inside the terminal. As the applicator housing descends in response to the applicator force, it pushes the lead wire down into contact with the terminal. A cam lever, acting under the influence of the applicator force, moves a cam vertically, bringing together complementary members of an insulation anvil and a core anvil.