Patents by Inventor Kelly Christopher Magruder

Kelly Christopher Magruder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190158209
    Abstract: There is disclosed in one example a fiberoptic communication circuit for wavelength division multiplexing (WDM) communication, including: an incoming waveguide to receive an incoming WDM laser pulse; an intermediate slab including a demultiplexer circuit to isolate n discrete modes from the incoming WDM laser pulse; n outgoing waveguides to receive the n discrete modes, the outgoing waveguides including fully-etched rib-to-channel waveguides; and an array of n photodetectors to detect the n discrete modes.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 23, 2019
    Applicant: Intel Corporation
    Inventors: Wenhua Lin, Judson Douglas Ryckman, Ling Liao, Kelly Christopher Magruder, Harel Frish, Assia Barkai, Han-din Liu, Yimin Kang
  • Publication number: 20190123109
    Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.
    Type: Application
    Filed: December 19, 2018
    Publication date: April 25, 2019
    Applicant: Intel Corporation
    Inventors: Boping Xie, Ansheng Liu, Olufemi Isiade Dosunmu, Alexander Krichevsky, Kelly Christopher Magruder, Harel Frish