Patents by Inventor Kelly D. Habeck

Kelly D. Habeck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5349500
    Abstract: An apparatus is described for electrically connecting flip chips to a flexible printed circuit substrate. The apparatus comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad fellows to form an electrical connection with its corresponding solder bump.
    Type: Grant
    Filed: June 23, 1993
    Date of Patent: September 20, 1994
    Assignee: Sheldahl, Inc.
    Inventors: Keith L. Casson, Kelly D. Habeck, Eugene T. Selbitschka
  • Patent number: 5261593
    Abstract: A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.
    Type: Grant
    Filed: August 19, 1992
    Date of Patent: November 16, 1993
    Assignee: Sheldahl, Inc.
    Inventors: Keith L. Casson, Kelly D. Habeck, Eugene T. Selbitschka