Patents by Inventor Kelly G. Cook

Kelly G. Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COATINGS AND METHODS FOR PROVIDING FABRICS WITH FAUX METAL PLATINGS
    Publication number: 20150257314
    Abstract: According to various aspects, exemplary embodiments are disclosed of coatings and methods for providing faux metal platings and/or aesthetic coloring to fabrics. In an exemplary embodiment, a coating for providing a faux metal plating and/or aesthetic coloring to a fabric generally includes a resin and a powder mixed in the resin. The coating may have a color corresponding to a metal plating such that the coating resembles a metal plating on the fabric after being applied to the fabric.
    Type: Application
    Filed: May 21, 2015
    Publication date: September 10, 2015
    Inventors: Larry Don Creasy, JR., Kelly G. Cook, Richard Tsai, Dusan Lee
  • EMI shielding heat shrinkable tapes
    Patent number: 8691393
    Abstract: Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: April 8, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Kelly G. Cook, Larry D. Creasy, Jr.
  • EMI SHIELDING HEAT SHRINKABLE TAPES
    Publication number: 20130133941
    Abstract: Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.
    Type: Application
    Filed: January 22, 2013
    Publication date: May 30, 2013
    Applicant: Laird Technologies, Inc.
    Inventors: Kelly G. Cook, Larry D. Creasy, JR.