Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract: A wafer-scale assembly circuit including a plurality of metal interconnect layers, where each metal layer includes patterned metal portions and where at least some of the patterned metal portions are RF signal lines. The circuit further includes at least one benzocyclobutene layer provided between two metal interconnect layers that includes at least one trench via formed around a perimeter of the benzocyclobutene layer at a circuit sealing ring, where the trench via provides a hermetic seal at the sealing ring. The benzocyclobutene layer also includes a plurality of stabilizing post vias formed through the benzocyclobutene layer adjacent to the trench via proximate to the sealing ring and extending around the perimeter of the benzocyclobutene layer, where the stabilizing vias operate to prevent the benzocyclobutene layer from shrinking in size.

Abstract: A wafer-scale assembly circuit including a plurality of metal interconnect layers, where each metal layer includes patterned metal portions and where at least some of the patterned metal portions are RF signal lines. The circuit further includes at least one benzocyclobutene layer provided between two metal interconnect layers that includes at least one trench via formed around a perimeter of the benzocyclobutene layer at a circuit sealing ring, where the trench via provides a hermetic seal at the sealing ring. The benzocyclobutene layer also includes a plurality of stabilizing post vias formed through the benzocyclobutene layer adjacent to the trench via proximate to the sealing ring and extending around the perimeter of the benzocyclobutene layer, where the stabilizing vias operate to prevent the benzocyclobutene layer from shrinking in size.