Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising (a) a first polishing layer comprising a polishing surface and a first aperture having a first length and first width, (b) a second layer comprising a body and a second aperture having a second length and second width, wherein the second layer is substantially coextensive with the first polishing layer and at least one of the first length and first width is smaller than the second length and second width, and (c) a substantially transparent window portion, wherein the transparent window portion is disposed within the second aperture of the second layer so as to be aligned with the first aperture of the first polishing layer and the transparent window portion is separated from the body of the second layer by a gap. The invention further provides a chemical-mechanical polishing apparatus and method of polishing a workpiece.

Abstract: A method of forming a chemical-mechanical polishing pad having at least one optically transmissive region comprising (i) providing a polishing pad comprising an aperture, (ii) inserting an optically transmissive window into the aperture of the polishing pad, and (iii) bonding the optically transmissive window to the polishing pad by ultrasonic welding.

Abstract: A method of forming a chemical-mechanical polishing pad having at least one optically transmissive region comprising (i) providing a polishing pad comprising an aperture, (ii) inserting an optically transmissive window into the aperture of the polishing pad, and (iii) bonding the optically transmissive window to the polishing pad by ultrasonic welding.

Abstract: A polishing pad comprising a region that is at least translucent, wherein the translucent region comprises a matrix polymer and a filler, is provided herein. Also provided is a method for producing a polishing pad comprising a region that is at least translucent, which method comprises (a) providing a porous matrix polymer, (b) filling at least a portion of the pores of the matrix polymer with a filler to provide a region that is at least translucent, and (c) forming a polishing pad comprising the region that is translucent. A method of polishing a substrate, particularly a semiconductor substrate, comprising the use of the polishing pad of the present invention also is provided herein.

Abstract: A polishing pad comprising a region that is at least translucent, wherein the translucent region comprises a matrix polymer and a filler, is provided herein. Also provided is a method for producing a polishing pad comprising a region that is at least translucent, which method comprises (a) providing a porous matrix polymer, (b) filling at least a portion of the pores of the matrix polymer with a filler to provide a region that is at least translucent, and (c) forming a polishing pad comprising the region that is translucent. A method of polishing a substrate, particularly a semiconductor substrate, comprising the use of the polishing pad of the present invention also is provided herein.