Patents by Inventor Kelly K. Smith

Kelly K. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10691184
    Abstract: An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat sink. The first heat sink is attached to the chassis, and the first heat sink includes an opening in the cover that corresponds to a location of the component. The second heat sink is to be attached to the first heat sink to close the opening and to be removable from the first heat sink to allow access to the opening to service the component.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 23, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sunil Rao Ganta Papa Rao Bala, Kelly K. Smith, Joseph Allen
  • Patent number: 10687442
    Abstract: Example implementations relate to a fan module assembly. One example fan module assembly includes a basepan housed in a chassis of a computing device. The basepan includes a distal end. The fan module assembly also includes a plurality of pins extending from the basepan. The plurality of pins includes a first pin and a second pin. The first pin and the second pin are staggered with respect to a plane defined by the distal end. The fan module assembly further includes a fan module attached to the basepan via the first pin and the second pin.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: June 16, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Joseph Anthony Oliver, Kelly K Smith, Keith A Sauer, James Jeffery Schulze
  • Publication number: 20200174534
    Abstract: An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat sink. The first heat sink is attached to the chassis, and the first heat sink includes an opening in the cover that corresponds to a location of the component. The second heat sink is to be attached to the first heat sink to close the opening and to be removable from the first heat sink to allow access to the opening to service the component.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 4, 2020
    Inventors: Sunil Rao Ganta Papa Rao Bala, Kelly K. Smith, Joseph Allen
  • Patent number: 10653029
    Abstract: A convertible chassis system for receiving a plurality of storage drives includes a chassis that includes a plurality of bays for receiving the storage drives. The convertible chassis also includes a reversible key that is removably affixed to the chassis body in either a first orientation or a second orientation. Each orientation provides a different key guide within the plurality of bays that either allows the storage drives to be received into or rejected from the bays of the chassis.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: May 12, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: James Jeffrey Schulze, Keith Sauer, Kelly K. Smith
  • Publication number: 20190335603
    Abstract: A convertible chassis system for receiving a plurality of storage drives includes a chassis that includes a plurality of bays for receiving the storage drives. The convertible chassis also includes a reversible key that is removably affixed to the chassis body in either a first orientation or a second orientation. Each orientation provides a different key guide within the plurality of bays that either allows the storage drives to be received into or rejected from the bays of the chassis.
    Type: Application
    Filed: April 30, 2018
    Publication date: October 31, 2019
    Inventors: James Jeffrey Schulze, Keith Sauer, Kelly K. Smith
  • Patent number: 9939857
    Abstract: Examples include a system comprising chassis and hard drive. In some examples, the hard drive has a set of positioning members and the chassis includes a hard drive slot having a guide rail unit to guide the hard drive into the hard drive slot via a positioning member of the set of positioning members on the hard drive. The chassis also includes a latch assembly connected to the hard drive slot to retain and extract the hard drive.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: April 10, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kenny Huy Pham, Ronald Pinche Tsai, Keith A Sauer, Kelly K Smith
  • Publication number: 20170295676
    Abstract: A chassis in accordance with one example includes a plurality of slots to receive a plurality of top-loading computing cartridges from a top of the chassis. The chassis also includes a supply inlet on a first side of the chassis to direct cooling fluid from the first side to a second side of the chassis, and a return outlet on the second side of the chassis to expel the cooling fluid from the chassis. The plurality of computing cartridges are immersed in the cooling fluid.
    Type: Application
    Filed: September 29, 2014
    Publication date: October 12, 2017
    Inventors: Kevin D CONN, Kelly K SMITH, Kapil Rao Papa Rao Bala GANTA, Sr.
  • Publication number: 20170265334
    Abstract: Example implementations relate to a fan module assembly. One example fan module assembly includes a basepan housed in a chassis of a computing device. The basepan includes a distal end. The fan module assembly also includes a plurality of pins extending from the basepan. The plurality of pins includes a first pin and a second pin. The first pin and the second pin are staggered with respect to a plane defined by the distal end. The fan module assembly further includes a fan module attached to the basepan via the first pin and the second pin.
    Type: Application
    Filed: August 29, 2014
    Publication date: September 14, 2017
    Inventors: Joseph Anthony OLIVER, Kelly K SMITH, Keith A SAUER, James Jeffery SCHULZE
  • Publication number: 20170202099
    Abstract: A latch assembly includes a lever and a cover. The lever includes a main portion, a cam portion, and an end portion. The cam portion includes a first cam surface and a second cam surface. The lever rotates between an install hood position and an uninstall hood position. The cover couples the lever and the hood. The cover includes a cavity to receive the lever.
    Type: Application
    Filed: July 29, 2014
    Publication date: July 13, 2017
    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Minh H NGUYEN, Keith A SAUER, Kelly K SMITH
  • Publication number: 20160366792
    Abstract: Examples herein disclose a multiple tier cooling structure. The multiple tier cooling structure includes multiple tanks, multiple inlets, and multiple outlets. Each of the multiple tanks are on a respective tier, each of the multiple inlets are located on a first side at each tank to direct a cooling fluid from the first side of each tank to a second side. Each of the multiple outlets are located on the second side at each tank to direct an expulsion of the cooling fluid from each tank.
    Type: Application
    Filed: May 28, 2014
    Publication date: December 15, 2016
    Inventors: Kelly K SMITH, Richard A BARGERHUFF, Rachel Nicole POLLOCK, Kapil Rao GANTA PAPA RAO BALA
  • Patent number: 9342103
    Abstract: A bezel includes a dock for a portable display device. The bezel also includes a hinge component that, when coupled to an enclosure, allows the bezel to be rotatably moved with respect to the enclosure.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: May 17, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Belgie B McClelland, Kevin D Conn, Kelly K Smith
  • Patent number: 9192070
    Abstract: A method and apparatus for loading IC's into a socket lid is disclosed. The IC is first loaded into a lid. Once the IC has been loaded into the lid, the lid is rotated into a closed position on the frame. The lid is then locked in place on the frame by rotating at least one locking lever into a closed lacked position, where the locking lever forces the lid down against the socket contacts against a spring.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: November 17, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chong S Tan, Robert J Hastings, Joseph R Allen, Michael T. Gill, Kelly K Smith, Keith A Sauer
  • Patent number: 9121422
    Abstract: A fastener useable with a system board is provided herein. The fastener includes a fastener body and a spool. The fastener body has a mating member at one end and a threaded member at an opposite end. The mating member extends from the fastener body and positions the fastener body on a chassis. The spool engages with the threaded member of the fastener body and is secured to the chassis.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: September 1, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Keith A Sauer, David M Paquin, Kelly K Smith
  • Patent number: 9098252
    Abstract: A fastener useable with a peripheral component interconnect riser cage is provided herein. The fastener includes a body, a rotation limiter, and a housing. The body includes an engagement end that engages with a receptacle on a sub-pan and a cap end that positions the body. The rotation limiter includes a receiving member and a positioning member. The receiving member couples with the body. The positioning member extends from the rotation limiter to limit rotation of the body coupled thereto. The housing receives the rotation limiter and the body. The housing includes a rotation aperture that receives a positioning member such that the rotation limiter is rotatable along the rotation aperture. The housing further includes a lateral aperture to receive the body such that the body is inserted through the lateral aperture and coupled to the rotation limiter.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: August 4, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Keith A Sauer, Kelly K Smith, David M Paquin
  • Patent number: 9011170
    Abstract: A method and apparatus for mounting a semiconductor is disclosed. First, the semiconductor is mounted into the bracket of a lid while the lid is detached from a frame. Once the semiconductor has been loaded into the lid/bracket assembly, the loaded lid is mounted onto the frame. The lid is then locked in place on the frame by rotating a locking lever into a closed locked position.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: April 21, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Keith A. Sauer, Kelly K Smith, Robert J. Hastings, Chong Sin Tan
  • Publication number: 20140295711
    Abstract: A compression connector includes a housing and a plurality of contacts located within the housing. Each of the plurality of contacts is configured to bend at a plurality of locations when pressure is applied to the contact. In addition, each of the plurality of contacts is configured to tuck within itself when pressure is applied to the contact. Furthermore, each of the plurality of contacts is constrained by the housing.
    Type: Application
    Filed: October 25, 2011
    Publication date: October 2, 2014
    Inventors: John P. Franz, Andrew James Phelan, George D. Magason, David A. Selvidge, Joseph R. Allen, Kelly K. Smith, Michael S. Bunker
  • Publication number: 20140240915
    Abstract: A drive carrier includes a bezel and opposing sidewalls connected to the bezel. At least one of the opposing sidewalls includes a plurality of slots that form at least part of a keying solution, and a dimension of at least two of the plurality of slots is not the same.
    Type: Application
    Filed: November 1, 2011
    Publication date: August 28, 2014
    Inventors: Andrew James Phelan, John P. Franz, James Jeffery Schulze, Kelly K. Smith, Everett R. Salinas
  • Patent number: D732547
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: June 23, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Belgie B. McClelland, Kevin D. Conn, Kelly K. Smith
  • Patent number: D753664
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: April 12, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Belgie B. McClelland, Kevin D. Conn, Kelly K. Smith
  • Patent number: D765088
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: August 30, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Belgie B. McClelland, Kevin D. Conn, Kelly K. Smith