Patents by Inventor Kelly L. Moore

Kelly L. Moore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230143426
    Abstract: The present invention is directed towards a system for coating a substrate comprising an electrodepositable coating composition and a powder coating composition. Also disclosed are coated substrates comprising a first coating layer comprising an electrodepositable coating layer, and a second coating layer comprising a powder coating layer on at least a portion of the first coating layer, as well as methods of coating substrates.
    Type: Application
    Filed: February 26, 2021
    Publication date: May 11, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Sijmen J. Visser, Brian E. Woodworth, Holli A. Gonder-Jones, John R. Schneider, Kelly L. Moore, Mark L. Follet, Liang Ma, Calum H. Munro, Marvin M. Pollum, JR., Maria S. French, Allison G. Condie, Amy E. Harrison, Irina G. Schwendeman, Daniel K. Dei, Cassandra Noelle Bancroft, Christopher Apanius, Kevin T. Sylvester, Corey J. Dedomenic, Egle Puodziukynaite
  • Publication number: 20230044601
    Abstract: The present invention is directed towards an electrodepositable coating composition comprising a cationic electrodepositable binder; a phyllosilicate pigment; and a dispersing agent. Also disclosed are methods of making the electrodepositable coating composition, coatings derived therefrom, and substrates coated with the coatings derived from the electrodepositable coating composition.
    Type: Application
    Filed: December 18, 2020
    Publication date: February 9, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Kevin T. Sylvester, Egle Puodziukynaite, Corey J. Dedomenic, Kevin A. O'neil, Richard F. Karabin, Silvia Bezer, Christopher A. Dacko, Kelly L. Moore, Mark L. Follet, Jonathan G. Weis
  • Publication number: 20200216685
    Abstract: The present invention is directed to an electrodepositable coating composition comprising a main vehicle comprising a phosphatized epoxy resin, a plasticizer, and a curing agent, wherein the main vehicle comprises a low-VOC main vehicle. The present invention is also directed to coatings and coated substrates.
    Type: Application
    Filed: September 11, 2018
    Publication date: July 9, 2020
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Se Ryeon Lee, Mark L. Follet, Kelly L. Moore, Thor G. Lingenfelter, Amy E. Harrison
  • Patent number: 8389651
    Abstract: The present invention is directed to an electrodepositable coating composition comprising a non-solubilized zinc compound in an amount of at least 0.61 weight % based on the total resin solids of the electrodepositable coating composition.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: March 5, 2013
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Kelly L. Moore, Richard F. Karabin, Alan J. Kaylo, Michael J. Pawlik
  • Patent number: 8333879
    Abstract: A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: December 18, 2012
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Kelly L. Moore, Michael J. Pawlik, Michael G. Sandala, Craig A. Wilson
  • Publication number: 20120006683
    Abstract: A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.
    Type: Application
    Filed: September 22, 2011
    Publication date: January 12, 2012
    Applicant: PPG INDUSTRIES OHIO, INC.
    Inventors: Kelly L. Moore, Michael J. Pawlik, Michael G. Sandala, Craig A. Wilson
  • Patent number: 8057654
    Abstract: A method includes: immersing a semiconductive substrate in an electrodeposition composition, wherein at least 20 percent by weight of resin solids in the composition is a highly cross-linked microgel component, and applying a voltage between the substrate and the composition to form a dielectric coating on the substrate. A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: November 15, 2011
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Kelly L. Moore, Michael J. Pawlik, Michael G. Sandala, Craig A. Wilson
  • Publication number: 20110186440
    Abstract: The present invention is directed to an electrodepositable coating composition comprising a non-solubilized zinc compound in an amount of at least 0.61 weight % based on the total resin solids of the electrodepositable coating composition.
    Type: Application
    Filed: February 4, 2010
    Publication date: August 4, 2011
    Inventors: Kelly L. Moore, Richard F. Karabin, Alan J. Kaylo, Michael J. Pawlik
  • Publication number: 20090236231
    Abstract: A method includes: immersing a semiconductive substrate in an electrodeposition composition, wherein at least 20 percent by weight of resin solids in the composition is a highly cross-linked microgel component, and applying a voltage between the substrate and the composition to form a dielectric coating on the substrate. A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 24, 2009
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Kelly L. Moore, Michael J. Pawlik, Michael G. Sandala, Craig A. Wilson