Patents by Inventor Kelly Messing

Kelly Messing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10000680
    Abstract: Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: June 19, 2018
    Assignee: DOW SILICONES CORPORATION
    Inventors: Dorab Bhagwagar, Kelly Messing, Elizabeth Wood
  • Publication number: 20170158937
    Abstract: Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
    Type: Application
    Filed: February 22, 2017
    Publication date: June 8, 2017
    Applicant: Dow Corning Corporation
    Inventors: Dorab Bhagwagar, Kelly Messing, Elizabeth Wood
  • Patent number: 9598575
    Abstract: Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: March 21, 2017
    Assignee: DOW CORNING CORPORATION
    Inventors: Dorab Bhagwagar, Kelly Messing, Elizabeth Wood
  • Publication number: 20130248163
    Abstract: Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
    Type: Application
    Filed: January 10, 2012
    Publication date: September 26, 2013
    Inventors: Dorab Bhagwagar, Kelly Messing, Elizabeth Wood