Abstract: Thermoelectric coolers having solderless electrical interconnects, and semiconductor packages incorporating such thermoelectric coolers, are described. In an example, a thermoelectric cooler includes a solderless electrode electrically connecting a P-type semiconductor column to an N-type semiconductor column, and the solderless electrode is in direct contact with diffusion barrier layers separating the solderless electrode from the P-type and N-type semiconductor material layers of the semiconductor columns. Methods of manufacturing thermoelectric coolers having solderless electrical interconnects are also described.