Patents by Inventor Kelly Q. Kay

Kelly Q. Kay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8005250
    Abstract: One embodiment of a microphone housing having at its base a cylindrical solid section (4) containing circuit boards (3) and on which is mounted transducer (2) and acoustically permeable basket (1). The basket is made of rigid, conductive foam providing electrical shielding, mechanical protection and wind and pop screening, without appreciably altering the acoustical characteristics of the transducer. Another embodiment is also described and shown.
    Type: Grant
    Filed: December 20, 2008
    Date of Patent: August 23, 2011
    Assignee: Josephson Engineering, Inc.
    Inventors: David Lane Josephson, David M. Gordon, Kelly Q. Kay
  • Publication number: 20090169043
    Abstract: One embodiment of a microphone housing having at its base a cylindrical solid section (4) containing circuit boards (3) and on which is mounted transducer (2) and acoustically permeable basket (1). The basket is made of rigid, conductive foam providing electrical shielding, mechanical protection and wind and pop screening, without appreciably altering the acoustical characteristics of the transducer. Another embodiment is also described and shown.
    Type: Application
    Filed: December 20, 2008
    Publication date: July 2, 2009
    Applicant: JOSEPHSON ENGINEERING, INC.
    Inventors: David Lane Josephson, David M. Gordon, Kelly Q. Kay
  • Patent number: 7218742
    Abstract: A microphone assembly comprising a housing, the housing including an upper lip, a silicon backplate having a top portion, a bottom portion, an annular side portion, a silicon spacer integrally formed with the backplate and comprising at least one protrusion extending from and integral to the top portion of the silicon backplate, the spacer further comprising an insulating layer, such as silicon dioxide or a fluoropolymer. A plurality of openings extend from the top portion of the backplate to the bottom portion of the backplate. A single diaphragm, comprised of metallized polymer film, acts as both a protective environmental barrier and a sensing electrode of a capacitive electroacoustic sensing transducer. A metal ring is positioned against the upper lip of the metal housing. The diaphragm is adhesively affixed to the ring, and the ring, in cooperation with the upper lip and a spring, secure the diaphragm against the insulating layer of the spacer.
    Type: Grant
    Filed: April 5, 2004
    Date of Patent: May 15, 2007
    Assignee: Shure Incorporated
    Inventors: Kelly Q. Kay, Mark W. Gilbert
  • Publication number: 20040184633
    Abstract: A microphone assembly comprising a housing, the housing including an upper lip, a silicon backplate having a top portion, a bottom portion, an annular side portion, a silicon spacer integrally formed with the backplate and comprising at least one protrusion extending from and integral to the top portion of the silicon backplate, the spacer further comprising an insulating layer, such as silicon dioxide or a fluoropolymer. A plurality of openings extend from the top portion of the backplate to the bottom portion of the backplate. A single diaphragm, comprised of metallized polymer film, acts as both a protective environmental barrier and a sensing electrode of a capacitive electroacoustic sensing transducer. A metal ring is positioned against the upper lip of the metal housing. The diaphragm is adhesively affixed to the ring, and the ring, in cooperation with the upper lip and a spring, secure the diaphragm against the insulating layer of the spacer.
    Type: Application
    Filed: April 5, 2004
    Publication date: September 23, 2004
    Applicant: Shure Incorporated
    Inventors: Kelly Q. Kay, Mark W. Gilbert
  • Patent number: 6741709
    Abstract: A microphone assembly comprising a housing, the housing including an upper lip, a silicon backplate having a top portion, a bottom portion, an annular side portion, a silicon spacer integrally formed with the backplate and comprising at least one protrusion extending from and integral to the top portion of the silicon backplate, the spacer further comprising an insulating layer, such as silicon dioxide or a fluoropolymer. A plurality of openings extend from the top portion of the backplate to the bottom portion of the backplate. A single diaphragm, comprised of metallized polymer film, acts as both a protective environmental barrier and a sensing electrode of a capacitive electroacoustic sensing transducer. A metal ring is positioned against the upper lip of the metal housing. The diaphragm is adhesively affixed to the ring, and the ring, in cooperation with the upper lip and a spring, secure the diaphragm against the insulating layer of the spacer.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: May 25, 2004
    Assignee: Shure Incorporated
    Inventors: Kelly Q. Kay, Mark W. Gilbert
  • Publication number: 20020076076
    Abstract: A microphone assembly comprising a housing, the housing including an upper lip, a silicon backplate having a top portion, a bottom portion, an annular side portion, a silicon spacer integrally formed with the backplate and comprising at least one protrusion extending from and integral to the top portion of the silicon backplate, the spacer further comprising an insulating layer, such as silicon dioxide or a fluoropolymer. A plurality of openings extend from the top portion of the backplate to the bottom portion of the backplate. A single diaphragm, comprised of metallized polymer film, acts as both a protective environmental barrier and a sensing electrode of a capacitive electroacoustic sensing transducer. A metal ring is positioned against the upper lip of the metal housing. The diaphragm is adhesively affixed to the ring, and the ring, in cooperation with the upper lip and a spring, secure the diaphragm against the insulating layer of the spacer.
    Type: Application
    Filed: December 20, 2000
    Publication date: June 20, 2002
    Inventors: Kelly Q. Kay, Mark W. Gilbert