Abstract: Agricultural electronics include many components. The components can be connected via an electronic link that connects the various components to components of an agricultural implement. This can include the use of a component type identifier and a master module. The identifier and the module can communicate data, including identification data and instructional data, to easily acknowledge and operate various electrical components of the agricultural implement. Additional sensors can be included to provide even additional data that is communicated between the module and the components of the agricultural implement to aid in providing instructions for operation and to provide additional data information.

Abstract: The present disclosure describes identifying a type of mobile device, determining a location of a near-field communication (NFC) device (e.g., NFC reader) within a mobile device (e.g., a mobile phone) based on its type, creating a user interface displayed on the mobile device with a visual indication of a tap zone for the NFC device based on its location within the mobile device, and then displaying the user interface on a display screen.

Abstract: A system for nutrient remediation in a water environment using biologically active bioremediation units (BABUs), comprising a biologically active first compound of sodium alginate with chitosan, mixing a quantity of glomalin and lignin with Chlorella vulgaris to form a second mixture, mixing the first mixture with the second mixture, and spherifying the third mixture by dropping the third mixture into calcium chloride, creating a physical medium to contain the viable culture of the remediating organism called BABUs, and where the BABUs are used for nutrient remediation in a surface water environment where the surface water environment contains an excess of nutrients, waiting for nutrient capture by the BABUs, removing the nutrient rich BABUs from the water, and placing the BABUs in soil, wherein the BABUs release the nutrients to the soil.

Abstract: Agricultural electronics include many components. The components can be connected via an electronic link that connects the various components to components of an agricultural implement. This can include the use of a component type identifier and a master module. The identifier and the module can communicate data, including identification data and instructional data, to easily acknowledge and operate various electrical components of the agricultural implement. Additional sensors can be included to provide even additional data that is communicated between the module and the components of the agricultural implement to aid in providing instructions for operation and to provide additional data information.

Abstract: An interchangeable patch hat apparatus for providing variable designs for a single hat includes a hat body having a front portion with a patch aperture extending from an outer surface through an inner surface. A patch has an outer face, an inner face, and a patch edge. The patch is dimensioned to be larger than the patch aperture. A plurality of engagement members comprises a plurality of first engagement members coupled to the patch proximal the patch edge and a plurality of second engagement members coupled to the front portion of the hat body proximal the patch aperture. The first engagement members are selectively engageable with the second engagement members to couple the patch to the hat body and cover the patch aperture. The patch is thus interchangeable to offer a choice of logo or design displayed on the apparatus.

Abstract: A portable exhibit display includes a frame and a fabric covering for tensioned securement to the frame, wherein the frame incorporates a plurality of first magnets defining magnetic attachment regions of a magnetic attachment array. An accessory provided with one or more attachment points attractive to the first magnets may be removably magnetically secured to the fabric covering in proximity to respective magnetic attachment regions of the magnetic attachment array.

Abstract: A portable exhibit display includes a frame and a fabric covering for tensioned securement to the frame, wherein the frame incorporates a plurality of first magnets defining magnetic attachment regions of a magnetic attachment array. An accessory provided with one or more attachment points attractive to the first magnets may be removably magnetically secured to the fabric covering in proximity to respective magnetic attachment regions of the magnetic attachment array.

Abstract: A portable exhibit display includes a framework and a fabric covering for tensioned securement to the framework. Three dimensional attachments may be secured to the framework with the covering sandwiched between the framework and the three dimensional accessory. The framework and three dimensional accessory incorporates a plurality of magnet fittings to attract and secure at attachment points and regions the three dimensional object to the framework.

Abstract: An illuminated nipple cover that directs light to a skin contact member, which may be translucent or clear. The skin contact member is covered with an opaque cover so the skin contact member is illuminated, and the opaque cover blocks light from being seen from the skin contact member.

Abstract: An illuminated nipple cover that directs light to a skin contact member, which may be translucent or clear. The skin contact member is covered with an opaque cover so the skin contact member is illuminated, and the opaque cover blocks light from being seen from the skin contact member.

Abstract: An illuminated nipple cover that directs light to a skin contact member, which may be translucent or clear. The skin contact member is covered with an opaque cover so the skin contact member is illuminated, and the opaque cover blocks light from being seen from the skin contact member.

Abstract: A device and method are used to retain an electrical cord on an exterior of a motor vehicle. At one or more locations along the electrical cord between opposing ends thereof, a respective pair of shell pieces are fastened together from opposite sides of the electrical cord to enclose a respective portion of the electrical cord between the respective pair of shell pieces, thereby securing the fastened-together pair of shell pieces to the electrical cord. The fastened-together shells pieces are then releasably secured to the exterior of the vehicle at a respective location thereon to secure the respective portion of the electrical cord to the exterior of the vehicle. The device of the present invention is fastened in place on the cord, not the vehicle, for the long term. Accordingly, unsightly permanent mountings on the vehicle are avoided, as is damage associate with attempted removal of permanent mountings.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: A method removes and/or contains edge residue. A wafer comprised of a semiconductor material having a top surface, a bottom surface and an edge surface is provided. The bottom surface and the top surface are substantially planar and the edge surface is non-planar. Residue can be located on the edge surface, which can dislodge if not addressed and damage devices formed on the wafer. One or more devices can be at least partially formed on the top surface. A pre-metal dielectric liner is formed over the top surface of the wafer and covering at least a portion of the residue. An edge portion of the liner is etched or otherwise removed to expose the portion of the residue. Thereafter, a pre-metal dielectric layer is formed over the top surface of the wafer and the pre-metal dielectric liner. During formation of the pre-metal dielectric layer, the edge residue is removed and/or contained.

Abstract: The present invention provides, in one embodiment, method of forming a barrier layer 300 over a semiconductor substrate 110. The method comprises forming an opening 120 in an insulating layer 130 located over a substrate thereby uncovering an underlying copper layer 140. The method further comprises exposing the opening and the underlying copper layer to a plasma-free reducing atmosphere 200 in the presence of a thermal anneal. The also comprises depositing a barrier layer in the exposed opening and on the exposed underlying copper layer. Such methods and resulting conductive structures thereof may be advantageously used in methods to manufacture integrated circuits comprising copper interconnects.

Abstract: The present invention provides a method of forming a interconnect barrier layer 100. The method comprises physical vapor deposition of barrier material 200 within an opening 140 located in a dielectric layer 135 of a substrate 110. The method also comprises a RF plasma etching the barrier material 200 deposited in the opening 140 simultaneously with conducting the physical vapor deposition of the barrier material 200.

Abstract: A method is disclosed to form a seed layer for an integrated circuit. The method may include depositing a metal seed layer (106) over a barrier layer (104) such that the metal seed layer (106) has a greater thickness along a top surface portion (114) of at least one recessed feature (102) formed in the substrate that is substantially coplanar with the substrate than a sidewall surface portion (112) of the at least one recessed feature (102). A portion of the metal seed layer (106) is etched from the top surface portion (114) of the at least one recessed feature (102) to improve coverage of the metal seed layer (106) along the sidewall surface portion (112) of the at least one recessed feature (102) and to mitigate overhang of the metal seed layer.