Abstract: The disclosure provides recombinant adenoviruses comprising a polynucleotide comprising: a first DNA sequence encoding a guide RNA (gRNA), wherein the gRNA comprises a DNA-binding domain and a Clustered Regularly Interspaced Short Palindromic Repeat (CRISPR)-associated endonuclease protein-binding domain, and the DNA-binding domain is complementary to a target sequence in a gene; and a first promoter that is operably linked to the DNA sequence. The disclosure also provides pharmaceutical compositions comprising the adenoviruses described herein. The disclosure further provides a method of treating cancer in a subject, the method comprising administering to the subject a therapeutically effective amount of the pharmaceutical compositions as described herein to the subject.

Abstract: Testing packaged integrated circuit (IC) devices is difficult and time consuming. When multiple devices (dies) are packaged to produce a SiP (system in package) the devices should be tested for defects that may be introduced during the packaging process. With limited access to the inputs and outputs of the devices, test times increase compared with testing the devices before they are packaged. A CoWoS (chip on wafer on substrate) SiP includes a logic device and a memory device and has interfaces between the logic device and memory device that cannot be directly accessed at a package ball. Test programs are concurrently executed by the logic device and the memory device to reduce testing time. Each memory device includes a BIST (built-in self-test) module that is initialized and executes the memory test program while the one or more modules within the logic device are tested.

Abstract: Testing packaged integrated circuit (IC) devices is difficult and time consuming. When multiple devices (dies) are packaged to produce a SiP (system in package) the devices should be tested for defects that may be introduced during the packaging process. With limited access to the inputs and outputs of the devices, test times increase compared with testing the devices before they are packaged. A CoWoS (chip on wafer on substrate) SiP includes a logic device and a memory device and has interfaces between the logic device and memory device that cannot be directly accessed at a package ball. Test programs are concurrently executed by the logic device and the memory device to reduce testing time. Each memory device includes a BIST (built-in self-test) module that is initialized and executes the memory test program while the one or more modules within the logic device are tested.

Abstract: A powered massaging device having a drive shaft having an axis of rotation and a massaging head with a skin engaging surface. The massaging head being attachable to the drive shaft for simultaneous rotation about the axis and vibration in a direction along the axis.

Abstract: The present application relates to a powered massaging device comprising a drive shaft (7) having an axis of rotation and a massaging head (8) with a skin engaging surface (9). The massaging head (8) being attachable to said drive shaft (7) for simultaneous rotation about said axis and vibration in a direction along said axis.