Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.

Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.

Abstract: An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.

Abstract: An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.