Abstract: Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods are disclosed herein. In one embodiment, a substrate includes a first pair and a second pair of electrical contacts on a first surface of the substrate. The first pair of electrical contacts can be configured to receive a first surface-mount capacitor, and the second pair of electrical contacts can be configured to receive a second surface-mount capacitor. The first pair of electrical contacts can be spaced apart by a first space, and the second pair of electrical contacts can be spaced apart by a second space. The first and second spaces can correspond to corresponding to first and second distances between electrical contacts of the first and second surface-mount capacitors.

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a base layer, a dielectric interposer coupled to the base layer and including a first outer surface facing the base layer and an opposing second outer surface facing away from the base layer and spaced apart from the first outer surface in a direction, a first electrical-connection cut-in in the second outer surface that extends, in the direction, toward the first outer surface, and one or more first electrical connections disposed within the first electrical-connection cut-in such that at least a portion of the one or more first electrical connections does not extend, in the direction, beyond the second outer surface.

Abstract: Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device is an assembly that includes a package substrate having a front side and a backside opposite the front side. A controller die with a first longitudinal footprint can be attached to the front side of the package substrate. A passive electrical component is also attached to the front side of the package substrate. A stack of semiconductor dies can be attached to the controller die and the passive electrical component. The stack of semiconductor dies has a second longitudinal footprint greater than the first longitudinal footprint in at least one dimension. The controller die and the passive electrical component are positioned at least partially within the second longitudinal footprint, thereby at least partially supporting the stack of semiconductor dies.

Abstract: An apparatus includes a substrate for mounting an integrated circuit. The substrate includes a primary layer including a first surface that is a first external surface of the substrate. The substrate includes an inner layer that is located below the primary layer and including a second surface. A portion of the second surface of the inner layer is exposed via an open area associated with the primary layer. The inner layer includes a first multiple of wire bond pads that are exposed via the open area associated with the primary layer.

Abstract: Semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having an inner surface, a die stack carried by the inner surface, and a stacked capacitor device carried by the inner surface adjacent to the die stack. The die stack can include one or more semiconductor dies, each of which can be electrically coupled to the inner surface by one or more bond wires and/or solder structures. The stacked capacitor device can include a first capacitor having a lower surface attached to the inner surface of the package substrate, a interposer having a first side attached to an upper surface of the first capacitor, and a second capacitor attached to a second side of the interposer opposite the first side.

Abstract: This document discloses techniques, apparatuses, and systems relating to a package substrate for a semiconductor device. A semiconductor device assembly is described that includes a packaged semiconductor device having one or more semiconductor dies coupled to a package-level substrate. The package-level substrate has a first surface at which first contact pads are disposed in a first configuration. The packaged semiconductor device is coupled with an additional package-level substrate that includes a second surface having second contact pads disposed in the first configuration and a third surface having third contact pads disposed in a second configuration different from the first configuration. The additional package-level substrate includes circuitry coupling the second contact pads the third contact pads to provide connectivity at the third contact pads. In doing so, an adaptively compatible semiconductor device may be assembled.

Abstract: Methods, systems, and devices for multi-chip package with enhanced conductive layer adhesion are described. In some examples, a conductive layer (e.g., a conductive trace) may be formed above a substrate. An integrated circuit may be bonded to the conductive layer and an encapsulant may be deposited at least between the integrated circuit and the conductive layer. In some examples, one or more surface features or one or more recesses may be formed on or within the conductive layer and the encapsulant may adhere to the surface features or recesses.

Abstract: Modular systems in packages, and associated devices, systems, and methods, are disclosed herein. In one embodiment, a system comprises a main module package and an upper module package. The main module package includes a first substrate and a first electronic device mounted on a first side of the first substrate. The upper module package includes a second substrate and one or more second electronic devices mounted on a first side of the second substrate. The second substrate includes a cavity at a second side of the second substrate opposite the first side, and the upper module package is mountable on the first side of the first substrate of the main module package such that the first electronic device is positioned within the cavity and the second substrate generally surrounds at least a portion of a perimeter of the first electronic device.

Abstract: Disclosed are a Darlington transistor drive circuit, a Darlington transistor drive method implemented based on such Darlington transistor drive circuit, and a constant current switching power supply including such Darlington transistor drive circuit. The Darlington transistor drive circuit includes a drive current circuit, two switch units, and a drive control circuit used for controlling the two switch units to be switched off during the switching-on cycle of the Darlington transistor and to be switched on during a switching-off cycle of the Darlington transistor, and for changing an equivalent resistance of the two switch units at different stages during the switching- off cycle of the Darlington transistor. The switching-off time delay of the Darlington transistor is greatly reduced while achieving the EMI optimization. In additional, the switch loss of Darlington transistor is small when it is switched off, and the efficiency is improved.

Abstract: Disclosed are a Darlington transistor drive circuit, a Darlington transistor drive method implemented based on such Darlington transistor drive circuit, and a constant current switching power supply comprising such Darlington transistor drive circuit. The Darlington transistor drive circuit comprises a drive current circuit, two switch units, and a drive control circuit used for controlling the two switch units to be switched off during the switching-on cycle of the Darlington transistor and to be switched on during a switching-off cycle of the Darlington transistor, and for changing an equivalent resistance of the two switch units at different stages during the switching-off cycle of the Darlington transistor. The switching-off time delay of the Darlington transistor is greatly reduced while achieving the EMI optimization. In additional, the switch loss of Darlington transistor is small when it is switched off, and the efficiency is improved.

Abstract: In a zigbee network, reliable communications are provided by maintaining messages transmitted from a device in a message queue in the device. If no successful acknowledgement is received for a transmitted message, the message is re-transmitted when the message queue executes. Messages are deleted from the queue when the message is successfully transmitted or when a maximum number of re-tries has been exhausted.

Abstract: In order to minimize traffic on a Zigbee network, a gateway of the Zigbee network represents end devices in communications with peripheral networks. The gateway receives messages, such as status request messages, from the peripheral network intended for an end device on the Zigbee network. The Zigbee network generates a response message by retrieving stored data for the end device instead of communicating the received message to the end device.

Abstract: In a zigbee network, reliable communications are provided by maintaining messages transmitted from a device in a message queue in the device. If no successful acknowledgement is received for a transmitted message, the message is re-transmitted when the message queue executes. Messages are deleted from the queue when the message is successfully transmitted or when a maximum number of re-tries has been exhausted.

Abstract: In a zigbee network, reliable communications are provided by maintaining messages transmitted from a device in a message queue in the device. If no successful acknowledgement is received for a transmitted message, the message is re-transmitted when the message queue executes. Messages are deleted from the queue when the message is successfully transmitted or when a maximum number of re-tries has been exhausted.

Abstract: In a zigbee network, reliable communications are provided by maintaining messages transmitted from a device in a message queue in the device. If no successful acknowledgement is received for a transmitted message, the message is re-transmitted when the message queue executes. Messages are deleted from the queue when the message is successfully transmitted or when a maximum number of re-tries has been exhausted.

Abstract: In a zigbee network, reliable communications are provided by maintaining messages transmitted from a device in a message queue in the device. If no successful acknowledgement is received for a transmitted message, the message is re-transmitted when the message queue executes. Messages are deleted from the queue when the message is successfully transmitted or when a maximum number of re-tries has been exhausted.

Abstract: In a zigbee network, reliable communications are provided by maintaining messages transmitted from a device in a message queue in the device. If no successful acknowledgement is received for a transmitted message, the message is re-transmitted when the message queue executes. Messages are deleted from the queue when the message is successfully transmitted or when a maximum number of re-tries has been exhausted.

Abstract: In a Zigbee network, reliable communications are provided by maintaining messages transmitted from a device in a message queue in the device. If no successful acknowledgement is received for a transmitted message, the message is re-transmitted when the message queue executes. Messages are deleted from the queue when the message is successfully transmitted or when a maximum number of re-tries has been exhausted.

Abstract: In order to minimize traffic on a Zigbee network, a gateway of the Zigbee network represents end devices in communications with peripheral networks. The gateway receives messages, such as status request messages, from the peripheral network intended for an end device on the Zigbee network. The Zigbee network generates a response message by retrieving stored data for the end device instead of communicating the received message to the end device.

Abstract: In order to minimize traffic on a Zigbee network, a gateway of the Zigbee network represents end devices in communications with peripheral networks. The gateway receives messages, such as status request messages, from the peripheral network intended for an end device on the Zigbee network. The Zigbee network generates a response message by retrieving stored data for the end device instead of communicating the received message to the end device.