Abstract: A notification regarding a transition of a User Equipment (UE) from a standby operating mode to an active operating mode is exchanged between a UE and a network element in a communication network. The notification could be an uplink notification that is transmitted by the UE to the network element in response to an operating mode transition criterion for the UE being met at the UE, or a downlink notification that is transmitted by the network element to the UE in response to an operating mode transition criterion for the UE being met at the network element. The UE transitions from the standby operating mode to the active operating mode in response to the operating mode transition criterion being satisfied. The transmitter of the notification, which could be the UE or the network element, could also perform grant-free transmission of data without first receiving a response to the notification.

Abstract: A method embodiment includes implementing, by a base station (BS), a grant-free uplink transmission scheme. The grant-free uplink transmission scheme defines a first contention transmission unit (CTU) access region in a time-frequency domain, defines a plurality of CTUs, defines a default CTU mapping scheme by mapping at least some of the plurality of CTUs to the first CTU access region, and defines a default user equipment (UE) mapping scheme by defining rules for mapping a plurality of UEs to the plurality of CTUs.

Abstract: A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining semiconductor chips to a mounting apparatus using a releasable bonding layer then forming thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. The releasable bonding layer is removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.

Abstract: A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining conventional semiconductor chips to a mounting apparatus then grinding the semiconductor chips to form thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member.

Abstract: An electromagnetic coupler comprising: a coupling waveguide adapted for receiving input modes along an input axis, propagating coupling modes along a coupling axis, and transmitting output modes along an output axis, the output axis being not parallel to the coupling axis; and an output waveguide disposed adjacent the coupling waveguide and adapted for receiving the output modes.

Abstract: A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining semiconductor chips to a mounting apparatus using a releasable bonding layer then forming thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. The releasable bonding layer is removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.

Abstract: A system and method for quantizing a photonic signal involves passing the photonic signal through a photonic crystal. The photonic crystal has localized defects for splitting the photonic signal into a plurality of quantized photonic components and for directing the quantized photonic components to a set of optical detectors. A digital conversion of the photonic signal can occur by performing a threshold comparison of the quantized components, either in the electrical domain through comparators or in the optical domain through optical limiters.

Abstract: A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining conventional semiconductor chips to a mounting apparatus then grinding the semiconductor chips to form thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member.

Abstract: A radio and method of making the radio is disclosed having a first set of radio components for processing analog signals in a radio transmission and a second set of radio components for processing digital signals in a radio transmission. The radio comprises a substrate base support, and at least one pocket formed within the substrate. The radio comprises at least one processor, each of the at least one processor being within a corresponding one of the at least one pocket for modulating a radio signal into one of a plurality of waveforms based on a software instruction set. Each of the at least one processor being in electronic communication with both of the first and second sets of the radio components. A dielectric layer covers a top surface of the substrate and each of the at least one processor. A plurality of vias are formed in the dielectric layer to expose selected portions of each of the at least one processor.

Abstract: A system and method for quantizing a photonic signal involves passing the photonic signal through a photonic crystal. The photonic crystal has localized defects for splitting the photonic signal into a plurality of quantized photonic components and for directing the quantized photonic components to a set of optical detectors. A digital conversion of the photonic signal can occur by performing a threshold comparison of the quantized components, either in the electrical domain through comparators or in the optical domain through optical limiters.

Abstract: An electromagnetic coupler comprising: a coupling waveguide adapted for receiving input modes along an input axis, propagating coupling modes along a coupling axis, and transmitting output modes along an output axis, the output axis being not parallel to the coupling axis; and an output waveguide disposed adjacent the coupling waveguide and adapted for receiving the output modes.

Abstract: High-capacity pick-up mechanisms operable for selectively reading data from and/or writing data to one or more surfaces of one or more optical storage media are disclosed. These mechanisms comprise a first pivotable structure, a second pivotable structure, a first reflective element, a second reflective element, a light source, and a light receiving device. The light source and the light receiving device are remotely located from the reflective elements via the pivotable structures, and only the reflective elements and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-capacity optical read/write devices and systems comprising these high-capacity pick-up mechanisms are also disclosed.

Abstract: Organic light emitting devices are disclosed that use a micro electromechanical system (MEMS) structure to enable a pixel and pixel array wherein each pixel contains a MEMS and an OLED element. A MEMS structure is used for switching the OLED element. These OLED/MEMS pixels can be fabricated on flex circuit, silicon, as well as other inorganic materials. They can be fabricated in a large array for developing a 2-dimensional display application and each pixel can be addressed through conventional matrix scanning addressing scheme. The ability of fabricating these OLED/MEMS pixels on flexible organic substrates as well as other rigid substrates enables wider selection of substrate materials for use with different applications.

Abstract: High-speed pick-up mechanisms operable for reading data from and/or writing data to an optical storage medium are disclosed. These mechanisms comprise a pivotable structure, a reflective element, a light source, a light receiving device, and an actuation device. The light source and the light receiving device are remotely located from the reflective element via the pivotable structure, and only the reflective element and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-speed optical read/write devices and systems comprising these high-speed pick-up mechanisms are also disclosed. Additionally, high-speed methods for reading data from and/or writing data to an optical storage medium are disclosed.

Abstract: According to one embodiment of the invention, a method includes providing a printed circuit board having a plurality of optoelectronic components coupled to a first side of the printed circuit board, forming a first clad layer outwardly from the first side of the printed circuit board, coupling an injection molding mold to the first side of the printed circuit board, injecting a material into the mold in liquid form, and after the material is solidified, decoupling the injection molding mold from the first side of the printed circuit board, thereby forming an optical waveguide outwardly from the first clad layer. The method may also include forming a second clad layer outwardly from the optical waveguide, and forming a metal layer outwardly from the second clad layer. In lieu of injection molding, stamping may be performed to form the core layer of the optical waveguide.

Abstract: A method of fabricating an integrated optical interconnection includes forming a first optical waveguide in a semiconductor substrate, forming a first layer of dielectric material disposed above the optical waveguide, forming an optical interconnect in the first dielectric layer and disposed proximate to the first optical waveguide. The method further includes forming a second layer of dielectric material disposed above the optical interconnect, forming a second optical waveguide in the second layer of dielectric material and disposed proximate to the first optical waveguide, and forming a conductive contact disposed above and proximate the second optical waveguide.

Abstract: A solid state optical interconnect system selectively interconnects a plurality of electromagnetic signals between a plurality of inputs and a plurality of outputs. The system includes a plurality of solid state, selectively actuatable 2×2 optical switching elements; and a plurality of all-optical signal paths extending through said 2×2 optical switching elements between the inputs and outputs. Each of said plurality of all-optical signal paths has substantially the same pathlength. This switch element is relatively robust and insensitive to environmental disturbances and has a reconfiguration time which is an order of magnitude faster than conventional opto-mechanical switches which generally require tens of milliseconds before reconfiguration. The switch element provides constant data pathlength for constant latency, loss, and unskewed data output.

Abstract: An electromagnetic coupler comprising: a coupling waveguide adapted for receiving input modes along an input axis, propagating coupling modes along a coupling axis, and transmitting output modes along an output axis, the output axis being not parallel to the coupling axis; and an output waveguide disposed adjacent the coupling waveguide and adapted for receiving the output modes.

Abstract: A radio and method of making the radio is disclosed having a first set of radio components for processing analog signals in a radio transmission and a second set of radio components for processing digital signals in a radio transmission. The radio comprises a substrate base support, and at least one pocket formed within the substrate. The radio comprises at least one processor, each of the at least one processor being within a corresponding one of the at least one pocket for modulating a radio signal into one of a plurality of waveforms based on a software instruction set. Each of the at least one processor being in electronic communication with both of the first and second sets of the radio components. A dielectric layer covers a top surface of the substrate and each of the at least one processor. A plurality of vias are formed in the dielectric layer to expose selected portions of each of the at least one processor.

Abstract: Organic light emitting devices are disclosed that use a micro electromechanical system (MEMS) structure to enable a pixel and pixel array wherein each pixel contains a MEMS and an OLED element. A MEMS structure is used for switching the OLED element. These OLED/MEMS pixels can be fabricated on flex circuit, silicon, as well as other inorganic materials. They can be fabricated in a large array for developing a 2-dimensional display application and each pixel can be addressed through conventional matrix scanning addressing scheme. The ability of fabricating these OLED/MEMS pixels on flexible organic substrates as well as other rigid substrates enables wider selection of substrate materials for use with different applications.